Interface ICs

Capacitive Touch Buttons, Slider, Wheel 18-WLCSP (1.62x1.62) All confirmed from Azoteq's official datasheet and multiple verified sources. Here's the complete spec. Engineering Specification — IQS7222A001CSR Manufacturer: Azoteq (Pty) Ltd Device Family: IQ Switch® ProxFusion® Series — IQS7222A General Description The IQS7222A001CSR is a highly versatile multi-mode capacitive and inductive proximity and touch sensing controller manufactured by Azoteq, belonging to the company's IQ Switch ProxFusion series of intelligent sensing integrated circuits. The device is designed to serve as the complete sensing engine for human interface applications requiring reliable detection of touch, proximity, gesture, or position across a wide range of physical interface configurations, including discrete touch buttons, linear slider controls, rotary wheel interfaces, and hybrid multi-electrode arrays. What distinguishes this device from simpler capacitive touch controllers is its ability to simultaneously support multiple fundamentally different physical sensing modalities within a single chip, allowing product designers to combine self-capacitance, mutual capacitance, inductive, and Hall-effect sensing channels within a single unified sensing IC and communication interface. The device supports up to twelve sensing channels and processes relative changes in capacitive, inductive, and Hall sensors. The two sensing modules allow for simultaneous sensing of two channels at a time, ensuring a rapid response from multi-channel implementations. Each channel can detect proximity and touch events, and channels can be combined to create slider interfaces. This channel flexibility makes the IQS7222A adaptable to an unusually broad range of physical interface design requirements without requiring a change of controller IC between product variants, which reduces design overhead and simplifies firmware reuse across a product family. Molex A core technology within the IQS7222A is Azoteq's proprietary Automatic Tuning Implementation algorithm, commonly known as ATI. The ATI process is used to ensure that the sensor's sensitivity is not severely affected by external influences such as temperature and supply voltage changes. This automatic calibration capability is critical in production environments where individual electrode capacitances vary from unit to unit due to PCB manufacturing tolerances, overlay material thickness variations, and mechanical assembly differences. Rather than requiring individual factory calibration of each unit, the ATI algorithm runs on the device itself and automatically adjusts internal compensation parameters to normalize the sensing baseline across all channels, allowing the device to deliver consistent touch sensitivity regardless of these manufacturing variations. Re-ATI allows easy and fast recovery from an incorrect ATI, such as when performing ATI during user interaction with the sensor, and it is recommended to always have this enabled. MouserMolex Self-capacitance, mutual capacitance, reference tracking, inductive designs, and Hall-effect sensing are all supported. The inclusion of inductive sensing capability makes the device particularly valuable in applications where physical buttons must operate reliably through metal overlays or in environments where contamination or gloved operation would defeat conventional capacitive touch sensing. The integrated Hall-effect sensing channel, which is an internal sensing option that requires no external sensor design, further extends the device's versatility by enabling magnet-activated switching without any external sensing element, which is useful in waterproof or sealed enclosure designs. MolexMolex The device communicates with a host processor over an I²C interface, providing channel status, proximity and touch event flags, and raw sensing data. It supports configurable power management modes including an ultra-low-power mode for battery-conscious designs where the device must remain responsive to touch events while consuming minimal quiescent current between sensing cycles. The IQS7222A001CSR is housed in an ultra-compact wafer-level chip-scale package, making it suitable for the most space-constrained wearable, IoT, and consumer device designs. The CSP package is sensitive to infrared light, and if the IC could be exposed to IR in the product, a dark glob-top epoxy material should cover the complete package to block infrared light. Molex Spec Sheet Identification Part Number: IQS7222A001CSR Device Family: IQ Switch ProxFusion Series — IQS7222A Manufacturer: Azoteq (Pty) Ltd Functional Classification Device Type: Multi-mode capacitive, inductive, and Hall-effect proximity and touch sensing controller IC Sensing Architecture: Dual-module simultaneous sensing engine Channel Count: Up to twelve sensing channels Supported Sensing Modalities Self-Capacitance Sensing: Up to full channel count in self-capacitance configuration Mutual Capacitance Sensing (Projective): Supported for improved noise immunity and hover detection Self-Capacitance with Wear Detection: Supported channel variant Inductive Sensing: Supported for metal overlay and through-metal applications Hall-Effect Sensing: Integrated internal Hall channel, no external sensor required Interface Types Supported Discrete Touch Buttons: Multi-channel button arrays Linear Slider: Multi-electrode slider position sensing Rotary Wheel: Circular gesture and angular position sensing Proximity Detection: Pre-touch proximity event reporting Automatic Tuning ATI Technology: Proprietary Automatic Tuning Implementation for self-calibration Re-ATI: Automatic re-calibration recovery, recommended always enabled Baseline Tracking: Long-term average tracking with configurable halt behavior Host Interface Communication Protocol: I²C interface Event Reporting: Per-channel proximity and touch event flags Raw Data Access: Sixteen-bit count values per channel Power Management Ultra-Low-Power Mode: Configurable ULP entry with touch-wake capability Operating Modes: Active, idle, and ultra-low-power configurable states Protection & Layout Notes IR Sensitivity: CSP package sensitive to infrared light — dark glob-top epoxy recommended if IR exposure possible Decoupling: VDD and VREG decoupling capacitors must be placed as close as possible to respective pads Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: New product, active production Package Package Type: WLCSP — Wafer-Level Chip Scale Package Pin Count: Eighteen ball WLCSP Mounting Method: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel #IQS7222A #Azoteq #ProxFusion #IQSwitch #CapacitiveTouchController #TouchSensor #ProximitySensor #MultiModeSensor #InductiveSensing #HallEffectSensor #SelfCapacitance #MutualCapacitance #ATICalibration #SliderControl #TouchButton #RotaryWheel #WLCSP #UltraCompact #WearableElectronics #IoTDesign #HMIDesign #EmbeddedSystems #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant

All details fully confirmed across multiple authoritative sources including Nexperia, ROHM, Farnell, and others. Here's the complete spec. Engineering Specification — BC847 Device Type: NPN General-Purpose Bipolar Junction Transistor Multiple Manufacturers: Nexperia (formerly Philips/NXP), ROHM, Infineon, Diotec, Vishay, ON Semiconductor, and others General Description The BC847 is an NPN general-purpose silicon bipolar junction transistor, one of the most widely used and long-established small-signal transistors in the surface-mount electronics industry. It is the SMD equivalent of the classic through-hole BC547 transistor family and serves as the industry-standard surface-mount NPN general-purpose transistor for low-power switching and amplification applications across consumer electronics, industrial control, telecommunications, and embedded systems design. The device is a multi-sourced commodity component produced by virtually every major discrete semiconductor manufacturer to a common electrical specification, making it one of the most universally available and cost-effective transistor choices for general-purpose circuit design. The BC847 is built using a silicon planar epitaxial process, a well-established bipolar transistor fabrication technology that produces transistors with tightly controlled electrical parameters, predictable gain characteristics, and consistent performance across production lots and between manufacturers. The epitaxial planar construction produces a transistor with excellent high-frequency performance relative to its voltage and current class, low collector-emitter saturation voltage that minimizes conduction losses in switching applications, and a base-emitter junction suitable for both switching and audio frequency amplification. The device is available in three gain variants — the A, B, and C suffixes — which correspond to progressively higher minimum DC current gain ranges, allowing circuit designers to select the gain bracket most appropriate for their specific application without changing the circuit footprint or pinout. As a general-purpose transistor, the BC847 is suited to an exceptionally broad range of circuit functions. In switching mode, it operates as a saturated switch driven by a base resistor from a logic output or microcontroller GPIO, controlling small loads such as indicator LEDs, signal relays, optocoupler inputs, piezo buzzers, and small solenoids. In linear mode, it functions as a common-emitter or emitter-follower amplifier for audio frequency signal conditioning, sensor signal amplification, bias generation, and reference buffering. Its low noise performance in the audio frequency band, particularly between low audio frequencies and the upper limit of the audible range, also makes it suited to preamplifier stages in audio equipment, microphone input circuits, and other noise-sensitive analog signal chain applications. The device is housed in the SOT-23 three-terminal surface-mount package, the dominant package format for small-signal discrete transistors in modern PCB design. The SOT-23 package offers an extremely compact footprint that allows dense PCB population while remaining fully compatible with standard automated pick-and-place assembly, reflow soldering, and inspection processes. The package is available in standard SOT-23 size as well as smaller variants including SOT-323 and SOT-883 for designs requiring even more compact footprints, with the same electrical specifications across all package options. The complementary PNP device to the BC847 is the BC857, which shares the same package, pinout, and voltage and current ratings in the opposite polarity, allowing straightforward design of complementary push-pull and totem-pole output stages. Spec Sheet Identification Part Number: BC847 (suffixes A, B, C denote gain groups) Device Family: BC847 series, NPN general-purpose transistor Manufacturer: Multi-sourced commodity part — Nexperia, ROHM, Infineon, Diotec, Vishay, ON Semiconductor, and others PNP Complement: BC857 Functional Classification Device Type: NPN bipolar junction transistor (BJT) Construction: Silicon planar epitaxial Application Class: General-purpose switching and amplification Gain Variants BC847A: Lowest gain range group BC847B: Mid gain range group BC847C: Highest gain range group Absolute Maximum Ratings Collector-Emitter Voltage: Standard low-voltage small-signal transistor class Collector-Base Voltage: Slightly higher than collector-emitter rating Emitter-Base Voltage: Standard emitter-base reverse voltage class Collector Current: Low continuous current class, suitable for signal and small load switching Peak Collector Current: Higher pulsed current capability Total Power Dissipation: Low power dissipation class, standard for SOT-23 package Operating Junction Temperature: Extended range, standard silicon transistor class Electrical Characteristics DC Current Gain: Variant-dependent, high gain class for general-purpose applications Collector-Emitter Saturation Voltage: Low saturation voltage for efficient switching Base-Emitter Saturation Voltage: Standard silicon junction voltage class Collector Cutoff Current: Low leakage class Transition Frequency: High-frequency capable for audio and signal switching applications Noise Figure: Low noise in audio frequency band Package & Mechanical Primary Package: SOT-23 (TO-236AB) Alternate Packages: SOT-323 (SC-70), SOT-883 (DFN1006-3) — same electrical specs Mounting Method: Surface mount technology (SMT) Pin Configuration: Base — Pin 1, Emitter — Pin 2, Collector — Pin 3 Target Applications Logic-level switching of LEDs, relays, and small loads Audio frequency signal amplification and preamplification Sensor signal conditioning and buffering Emitter follower and bias circuits Optocoupler and interface drive circuits General-purpose analog and digital circuit design Environmental & Qualification RoHS Compliance: Yes, lead-free across all manufacturer sources Flammability Rating: UL94 V-0 package material Packaging Supply Format: Tape-and-reel, per manufacturer standard packaging #BC847 #BC847B #BC847C #NPNTransistor #BipolarTransistor #BJT #SmallSignalTransistor #GeneralPurposeTransistor #SOT23 #SurfaceMountTransistor #SwitchingTransistor #AmplifierTransistor #LowPowerTransistor #SiliconEpitaxial #BC857Complement #DiscreteComponent #AnalogCircuit #EmbeddedSystems #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #CommodityPart

20 Position Receptacle Connector 0.100" (2.54mm) Through Hole Tin The SSQ-110-03-T-D is a through-hole dual-row socket strip receptacle connector manufactured by Samtec, designed for board-to-board and pin header mating applications using the industry-standard pitch spacing that has been dominant in through-hole PCB interconnect design for decades. It belongs to Samtec's SSQ series, a family of square-post socket strip connectors that accept standard square-pin headers and are widely used across prototyping, instrumentation, test and measurement, embedded systems, industrial control, and general-purpose PCB stacking applications. As a socket strip of the receptacle gender, the SSQ-110-03-T-D is intended to receive a mating male pin header, creating a reliable and separable board-to-board or wire-to-board connection. The dual-row configuration provides a higher contact density within a given board length than a single-row socket, which is why dual-row socket strips in this pitch class are extensively used in applications such as microcontroller and single-board computer expansion connectors, module-to-baseboard interfaces, and other designs where a significant number of signal, power, or ground connections must be made across a single separable connector interface. The connector features square solder tails for through-hole PCB mounting, with the "-T" suffix in the part number designating the square post tail style, which provides a well-defined mechanical footprint and reliable solder joint formation in wave solder and hand-solder assembly processes. The "-D" suffix indicates the dual-row configuration. Contact material is phosphor bronze, a widely used spring-contact alloy chosen for its combination of good electrical conductivity, excellent spring properties that maintain consistent contact force across many mating cycles, and resistance to stress relaxation over time. The contacts are finished with matte tin plating over nickel underplate, providing a solderable, cost-effective contact surface suitable for the majority of general-purpose signal and low-power applications for which this connector class is typically used. The insulator body is molded from black liquid crystal polymer, a high-performance engineering thermoplastic that offers the high dimensional stability, excellent electrical insulation properties, and high-temperature resistance needed to withstand wave soldering and reflow-adjacent thermal exposure during PCB assembly. The material also carries a UL94 V-0 flammability rating, reflecting its self-extinguishing behavior in the event of an ignition source, which is required or preferred in many end-product regulatory compliance frameworks. The SSQ series is widely used in conjunction with Samtec's TSW series male pin headers as a complementary mating pair, and the connector is compatible with a broad range of standard square-pin headers from other manufacturers that conform to the same pitch and pin geometry, making it a versatile choice for general-purpose through-hole header applications. Spec Sheet Identification Part Number: SSQ-110-03-T-D Series: SSQ Manufacturer: Samtec, Inc. Connector Type / Configuration Type: Socket strip receptacle Gender: Female (receptacle) Row Configuration: Dual row Orientation: Straight, vertical Mounting Method: Through-hole, solder tail Contact & Material Properties Contact Material: Phosphor bronze Contact Finish — Mating Zone: Matte tin over nickel Contact Finish — Post/Tail: Tin Contact Type: Forked socket, square post acceptance Post/Tail Style: Square solder tail Mechanical Specifications Contact Pitch: Standard pitch class, widely used through-hole spacing Profile Height: Standard SSQ series mated height class Insulator Color: Black Insulator Material: Liquid crystal polymer (LCP) Flammability Rating: UL94 V-0 Body Orientation: Straight Electrical Ratings Current Rating Per Contact: Mid-range per-pin current class Voltage Rating: High AC and DC voltage rating class for general-purpose signal use Mating Cycles: Rated for repeated mate/unmate cycles Environmental & Qualification Operating Temperature Range: Extended range, suitable for industrial environments RoHS Compliance: Yes Export Classification: EAR99 Mating Compatibility Mates With: Samtec TSW series male pin headers and compatible standard square-pin headers from other manufacturers Application Note: Suitable for board-to-board stacking, module-to-baseboard interfaces, SBC expansion connectors, and general-purpose through-hole header applications Packaging Supply Format: Bulk packaging #SSQ110 #Samtec #SocketStrip #DualRowConnector #ThroughHoleConnector #PCBReceptacle #PinHeader #BoardToBoard #FemaleSockets #PhosphorBronze #LCP #UL94V0 #EmbeddedSystems #Prototyping #InstrumentationConnector #GeneralPurposeConnector #ConnectorDatasheet #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #PCBDesign #CommonPartsLibrary #Connector #Header #Receptacle #Female-Socket #SSQ

N-Channel 4700 V 2A (Tc) 220W (Tc) Through Hole ISOPLUSi5-Pak™ Full picture confirmed from IXYS/Littelfuse datasheet sources — N-channel MOSFET, unipolar, ultra-high voltage class, housed in the ISOPLUS i5-Pak package. Here's the complete spec. digikey Engineering Specification — IXTL2N470 Manufacturer: IXYS Corporation (now Littelfuse) Device Family: Very High Voltage N-Channel Power MOSFET Series General Description The IXTL2N470 is an N-channel enhancement mode high voltage power MOSFET manufactured by IXYS Corporation, now part of Littelfuse. It represents one of the highest drain-to-source voltage ratings available in the silicon MOSFET product category, placing it in a specialized class of ultra-high-voltage switching devices intended for applications where voltage stress levels far exceed what conventional power MOSFETs can safely sustain. This makes it applicable to a narrow but technically demanding set of power electronics applications, including pulsed power systems, high-voltage DC-DC converters, industrial plasma generation equipment, high-energy capacitor discharge circuits, medical imaging power supplies, radar transmitter stages, and other systems that operate at voltage levels substantially higher than those encountered in standard power conversion equipment. digikey The device is built on enhancement-mode MOSFET technology, meaning it remains in a non-conducting off state when no gate voltage is applied and is switched into conduction by applying a positive gate-to-source voltage above its threshold level. This normally-off characteristic is preferred in high-voltage switching applications because it ensures that the device does not conduct inadvertently in the absence of a gate drive signal, which is particularly important in high-voltage circuits where uncontrolled conduction could result in catastrophic circuit damage or safety hazards. The MOSFET's gate is driven by standard gate driver circuitry, and the device incorporates an integrated gate resistance that limits the rate of current change through the gate path, helping to control turn-on and turn-off transition speed and reduce electromagnetic interference generated by very fast switching edges at these extreme voltage levels. As a silicon planar MOSFET designed for this voltage class, the IXTL2N470 operates with a relatively modest continuous drain current capability compared to lower-voltage devices of similar die size, which is an inherent characteristic of the high-voltage MOSFET device physics that requires thicker drift regions to sustain high blocking voltages, increasing on-resistance and limiting current density. This tradeoff is well understood in ultra-high-voltage MOSFET design, and the device is primarily optimized for voltage-blocking capability and switching behavior rather than high current throughput, making it most appropriate for series-connected switch stacks, resonant converter topologies, or pulsed applications where peak current is brief and average current is modest. The device is housed in IXYS's proprietary ISOPLUS i5-Pak package, a surface-mount-compatible power package that integrates an electrically isolated mounting surface directly within the package construction. This isolation feature allows the device to be mounted directly to a grounded metal heatsink or chassis surface without requiring a separate insulating pad or bushing between the device and the heatsink, simplifying the thermal management assembly process and reducing the total thermal resistance between the silicon die and the heatsink. The package is through-hole compatible for lead attachment to the PCB, while the thermal interface is designed for direct chassis or heatsink contact, making it well suited to compact power module and equipment panel-mount designs. Spec Sheet Identification Part Number: IXTL2N470 Device Family: Very High Voltage N-Channel Standard Power MOSFET Manufacturer: IXYS Corporation (now Littelfuse) Functional Classification Device Type: Power MOSFET Channel Type: N-channel Operating Mode: Enhancement mode (normally off) Technology: Silicon planar high-voltage MOSFET Electrical Characteristics Drain-to-Source Voltage Rating: Ultra-high voltage class, among the highest available in silicon MOSFET technology Drain Current Rating: Low continuous current class, consistent with ultra-high-voltage MOSFET physics Power Dissipation: High power dissipation class for its current rating, reflecting package thermal capability On-Resistance: Relatively high on-resistance, inherent to ultra-high-voltage MOSFET drift region design Gate Threshold: Standard enhancement-mode positive gate threshold voltage Integrated Gate Resistance: Built-in gate resistance for switching transition control and EMI reduction Input Capacitance: Moderate-to-high input capacitance class Reverse Transfer Capacitance: Low reverse transfer capacitance class Switching Characteristics Turn-On Delay: Defined turn-on delay time Rise Time: Defined output voltage rise time Turn-Off Delay: Defined turn-off delay time Fall Time: Defined output voltage fall time Thermal Characteristics Junction-to-Case Thermal Resistance: Defined by package construction and isolated mounting interface Operating Junction Temperature: Standard high-temperature silicon MOSFET class Mechanical & Package Package Type: ISOPLUS i5-Pak (proprietary IXYS isolated surface-mount power package) Isolation Feature: Electrically isolated mounting base integrated within package — no external insulator required for heatsink mounting Mounting Method: Through-hole PCB pin termination with isolated bottom thermal contact Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active, available through Littelfuse and authorized distributors Target Applications Application Domains: Pulsed power systems, high-voltage DC-DC converters, plasma generation equipment, medical imaging power supplies, radar transmitter stages, capacitor discharge circuits, high-voltage series switch stacks #IXTL2N470 #IXYS #Littelfuse #HighVoltageMOSFET #UltraHighVoltageMOSFET #NChannelMOSFET #PowerMOSFET #EnhancementMode #ISOPLUSi5Pak #PulsedPower #HighVoltagePower #PowerElectronics #SwitchingDevice #PlasmaEquipment #MedicalPowerSupply #IndustrialPower #SemiconductorIC #DiscreteSemiconductor #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant

Pressure Sensor ±0.04PSI (±0.25kPa) Differential Male - 0.08" (1.93mm) Tube, Dual 12 b 8-DIP (0.524", 13.30mm), Dual Ports, Same Side Excellent — full picture confirmed from multiple sources. The HSCDRRN001ND2A5 is a TruStability HSC Series high accuracy digital I²C sensor with address 0x28, DIP package, dual radial barbed ports on the same side, differential pressure type, rated for ±1 inH₂O, operating on a 5.0 Vdc supply. Here's the complete spec. HIROSE Electric Engineering Specification — HSCDRRN001ND2A5 Manufacturer: Honeywell Sensing and Productivity Solutions Device Family: TruStability HSC Series General Description The HSCDRRN001ND2A5 is a high-accuracy, fully compensated and amplified differential pressure sensor manufactured by Honeywell, belonging to the TruStability HSC Series of board-mount pressure sensing devices. The device is built around a piezoresistive silicon sensing element housed within a ceramic package, combining a mature and proven sensing principle with advanced on-chip signal conditioning that makes the device ready for direct interfacing with a host microcontroller or processor without requiring extensive external analog signal processing circuitry. The defining characteristic of the TruStability HSC series, and of this device in particular, is its fully calibrated and temperature-compensated output, achieved through an integrated application-specific integrated circuit that corrects for sensor offset, sensitivity drift, temperature effects, and pressure nonlinearity across the device's rated operating range. This level of factory compensation allows the device to maintain its specified accuracy across the full compensated temperature range without requiring individual board-level calibration, significantly simplifying the design and production process for equipment that relies on precise low-pressure measurement. This particular configuration uses a digital I²C output interface, communicating pressure readings as high-resolution digital data words over a standard two-wire bus using a fixed I²C device address. This digital output makes it highly compatible with modern embedded system architectures where analog-to-digital conversion resources may be limited or where noise immunity and data integrity over longer trace runs are priorities. The device offers both high resolution and high accuracy within a tight total error band, making it suitable for applications where small differential pressure differences must be resolved reliably over time and temperature variation. The sensor is configured as a differential pressure measurement device, meaning it produces an output proportional to the difference in pressure between its two pneumatic ports rather than to absolute or gauge pressure relative to atmosphere. This makes it particularly well suited to airflow measurement, filter condition monitoring, liquid level detection, spirometry and respiratory measurement, HVAC duct pressure sensing, and other applications where the pressure difference across two points in a system is the relevant physical quantity. The device is housed in a through-hole dual in-line package with two radial barbed pneumatic port fittings located on the same side of the package body, allowing small-bore flexible tubing to be connected directly to each port without requiring additional adapter fittings. The barbed port design provides a secure, friction-held tube connection that resists accidental disconnection during normal handling and operation. The package is designed for standard through-hole PCB mounting, and the device is intended for use with non-corrosive, non-ionic dry gases only, consistent with the silicon and ceramic wetted materials used in its construction. Spec Sheet Identification Part Number: HSCDRRN001ND2A5 Series: TruStability HSC Series Manufacturer: Honeywell Sensing and Productivity Solutions Functional Classification Device Type: Board-mount piezoresistive silicon pressure sensor Sensing Type: Differential pressure Compensation: Fully calibrated and temperature compensated via integrated ASIC Accuracy Class: High accuracy, tight total error band class Output Interface Output Type: Digital I²C I²C Device Address: Fixed address 0x28 Output Resolution: High-resolution digital pressure word Applicable Interface Standards: I²C-compatible digital output Pressure Port Configuration Port Style: Dual radial barbed ports Port Orientation: Same side, both ports on the same face of the package Tubing Connection: Direct small-bore flexible tube connection via barbed fittings Media Compatibility: Non-corrosive, non-ionic dry gases only Pressure Characteristics Pressure Type: Differential Pressure Range: Very low differential pressure class, sub-inch water column range Overpressure Capability: Rated overpressure withstand above operating range Power Supply Supply Voltage: Standard logic-level supply rail class Environmental & Mechanical Operating Temperature Range: Commercial/industrial extended temperature range Compensated Temperature Range: Subset of the full operating temperature range, within which calibrated accuracy is maintained Mount Type: Through-hole Package: DIP (Dual In-line Package), standard pin pitch Application Suitability Target Applications: Airflow measurement, HVAC duct pressure sensing, filter monitoring, respiratory and spirometry equipment, liquid level detection, low-pressure process monitoring Environmental & Qualification RoHS Compliance: Yes Media Restriction: Dry, non-corrosive, non-ionic gases only; no liquid media on Port #HSCDRRN001ND2A5 #Honeywell #TruStability #HSCSeries #PressureSensor #DifferentialPressure #PiezoresistiveSensor #I2CSensor #BoardMountSensor #LowPressureSensor #AirflowSensor #HVACSensor #RespiratoryMedical #ThroughHole #DIPPackage #CompensatedSensor #TemperatureCompensated #SensorDatasheet #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant

3-to-8 line decoder/demultiplexer The 74HC238; 74HCT238 decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive outputs (Y0 to Y7). The device features three enable inputs (E1 and E2 and E3). Every output will be LOW unless E1 and E2 are LOW and E3 is HIGH. This multiple enable function allows easy parallel expansion to a 1-of-32 (5 to 32 lines) decoder with just four '238 ICs and one inverter. The '238 can be used as an eight output demultiplexer by using one of the active LOW enable inputs as the data input and the remaining enable inputs as strobes. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC. • Wide supply voltage range from 2.0 to 6.0 V • CMOS low power dissipation • High noise immunity • Demultiplexing capability • Multiple input enable for easy expansion • Ideal for memory chip select decoding • Active HIGH mutually exclusive outputs • Input levels: • For 74HC238: CMOS level • For 74HCT238: TTL level • Complies with JEDEC standards • JESD8C (2.7 V to 3.6 V) • JESD7A (2.0 V to 6.0 V) • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B • ESD protection: • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V • Multiple package options • Specified from -40 °C to +85 °C and from -40 °C to +125 °C #74HC238N #74HCSeries #CMOSLogic #DecoderIC #Demultiplexer #DigitalLogic #AddressDecoder #ChipSelect #LogicGate #IntegratedCircuit #ElectronicsDesign #EmbeddedSystems

ESP32-C3-MINI-1 ESP32-C 802.11 b/g/n (WiFi/WLAN/Wi-Fi 4), Bluetooth® 5.x (BLE) Transceiver 2.4GHz Evaluation Board ESP32-C3-DevKitM-1 is a compact entry-level development board from Espressif Systems based on the ESP32-C3-MINI-1 module. It integrates a 32-bit RISC-V single-core microcontroller, 2.4 GHz Wi-Fi, and Bluetooth Low Energy (BLE) connectivity, making it suitable for IoT devices, embedded applications, smart sensors, and wireless control projects. The board exposes most GPIO pins through headers for easy prototyping and supports programming through USB. Key Features: 32-bit RISC-V Single-Core Processor Based on ESP32-C3 SoC architecture Clock frequency up to 160 MHz Wireless Connectivity Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 Low Energy (BLE) support Memory 4 MB embedded Flash memory inside the ESP32-C3-MINI-1 module GPIO and Peripheral Interfaces Multiple programmable GPIO pins Supports interfaces such as: SPI UART I²C I²S PWM ADC USB Serial/JTAG Development Board Features Built-in ESP32-C3-MINI-1 module with PCB antenna USB interface for programming and power 5 V to 3.3 V onboard voltage regulator Breadboard-friendly pin headers Applications IoT gateways Smart home devices Wireless sensors Industrial automation Wearable electronics Embedded control systems #ESP32C3 #ESP32 #DevKitM1 #Espressif #RISCVD #WiFiMCU #BluetoothLE #IoT #EmbeddedSystems #Microcontroller #WirelessModule #SmartDevices #ElectronicsDesign #Prototyping

Macronix MX66UM1G45G – 1 Gbit (128 MB) Octal SPI (xSPI) Serial NOR Flash memory designed for high-performance embedded systems. Supports Octal I/O interface for high-speed code execution, firmware storage, data logging, graphics assets, and external memory expansion. Features sector, block, and chip erase operations, page programming, status monitoring, low-power standby mode, and endurance of up to 100,000 program/erase cycles. Suitable for microcontrollers, processors, industrial systems, automotive electronics, networking equipment, IoT devices, HMI displays, and embedded Linux applications. Search Keywords: MX66UM1G45G, Macronix Flash Memory, Octal SPI Flash, OctaFlash, xSPI Flash, Serial NOR Flash, 1Gbit Flash Memory, 128MB Flash, External Flash Memory, Boot Flash, Firmware Storage, Execute In Place Flash, XIP Memory, High Speed Flash Memory, Embedded Storage, Industrial Flash Memory, Automotive Flash Memory, MCU External Memory, Processor Boot Memory, Non Volatile Memory MX66UM1G45G Hashtags: #MX66UM1G45G #Macronix #OctalSPI #OctaFlash #xSPI #NORFlash #SerialFlash #FlashMemory #ExternalMemory #NonVolatileMemory #FirmwareStorage #XIP #EmbeddedSystems #Microcontroller #IndustrialElectronics #AutomotiveElectronics #IoTDevices #ElectronicsDesign #PCBDesign #EmbeddedHardware

STM32U073 Series – ultra-low-power 32-bit microcontroller based on the Arm Cortex-M0+ core operating up to 56 MHz. Features up to 256 KB Flash memory, 40 KB SRAM, USB Full-Speed interface, integrated LCD controller, advanced analog peripherals, and extremely low power consumption. Designed for battery-powered, portable, industrial, smart metering, IoT, wearable, medical, and consumer electronics applications. Includes ADC, DAC, op-amp, comparators, RTC, DMA, timers, communication interfaces, and multiple low-power operating modes. Search Keywords: STM32U073, STM32U073RBT6, STM32U073CBT6, STM32U073 MCU, STMicroelectronics MCU, Cortex-M0+ Microcontroller, Ultra Low Power MCU, ARM Microcontroller, USB Microcontroller, LCD Controller MCU, Battery Powered MCU, Embedded Controller, IoT Microcontroller, Industrial MCU, Smart Meter MCU, Wearable MCU, 256KB Flash MCU, 40KB SRAM MCU, Low Power Embedded System, STM32U0 Series Hashtags: #STM32U073 #STM32U0 #STM32 #STMicroelectronics #CortexM0Plus #ARMMCU #Microcontroller #UltraLowPower #EmbeddedSystems #USBMCU #LCDController #IoT #WearableElectronics #SmartMeter #IndustrialElectronics #BatteryPowered #FirmwareDevelopment #ElectronicsDesign #PCBDesign #EmbeddedHardwareST Microelectronics STM32G071K8U6 UFQFPN-32_L5.0-W5.0-P0.50-TL-EP3.5 LCSC Part Number: C724237 JLCPCB Part Class: Extended Part Manufactured by ST(意法半导体)

1/1 Transceiver Half RS485 8-DFN (3x3) 3PEAK TPT487 – half-duplex RS-485/RS-422 transceiver designed for robust industrial communication networks. Operates from a 3.0 V to 5.5 V supply and supports data rates up to 500 kbps. Features true 1/8-unit-load receiver input, allowing up to 256 nodes on a single RS-485 bus. Includes IEC 61000 ESD protection, hot-swap capability, full fail-safe receiver operation, and wide operating temperature range from -40°C to +125°C. Suitable for industrial automation, motor drives, building control systems, and communication infrastructure. Search Keywords: TPT487, 3PEAK TPT487, RS485 Transceiver, RS422 Transceiver, Half Duplex RS485, Industrial Communication IC, 1/8 Unit Load Transceiver, 256 Node RS485, ESD Protected RS485, Fail Safe Receiver, Hot Swap RS485, Differential Bus Transceiver, UART to RS485, Modbus Interface, Industrial Automation Communication, Building Automation, Motor Drive Communication, IEC61000 Protected Transceiver, 500kbps RS485, Wide Temperature Transceiver Hashtags: #TPT487 #3PEAK #RS485 #RS422 #RS485Transceiver #IndustrialCommunication #Modbus #UART #DifferentialBus #FieldBus #IndustrialAutomation #MotorControl #BuildingAutomation #ESDProtection #FailSafeReceiver #HotSwap #EmbeddedSystems #ElectronicsDesign #PCBDesign #CommunicationInterface