Interface ICs
An interface IC is a type of integrated circuit that is designed to facilitate communication between two devices or systems. These devices are commonly used in electronic systems to enable the transfer of data and control signals between different components or subsystems. Some common use cases for interface ICs include connecting microcontrollers to peripherals such as sensors or displays, linking multiple processors together in a network, and enabling communication between devices using different communication protocols. Flux.ai has the world's largest community-driven public library of interface ICs, with footprints, symbols, datasheets, and simulation models. This library is a valuable resource for engineers and designers who need access to accurate and up-to-date information on these important components. Whether you are working on a new design project or simply looking to learn more about interface ICs, Flux.ai is an excellent resource to help you find the information you need.
TC358768AXBG
Display Interface Bridge 72-Pin VFBGA Display Interface Bridge IC that converts a 24-bit RGB display interface to a MIPI® DSI® transmitter interface. It supports display resolutions up to WUXGA (1920 × 1200) at 60 fps with 24 bpp, DSI operation with 1 to 4 data lanes at up to 1 Gbps per lane, and RGB input clock frequencies up to 166 MHz. The device provides I²C (100 kHz, 400 kHz, 1 MHz) or SPI slave (up to 25 MHz) control interfaces, operates from 1.2 V core/MIPI PHY and 1.8 V to 3.3 V I/O supplies, and is housed in a 72-pin VFBGA package (4.5 × 4.5 mm, 0.4 mm pitch). #DisplayInterfaceBridge #RGBtoMIPIDSI #MIPIDSI #RGBInterface #DisplayBridgeIC #I2C #SPI #WUXGA #VFBGA72 #Toshiba
0 Uses0 StarsRK3568
Application Processor integrating a quad-core Arm Cortex-A55 64-bit CPU operating at up to 2.0 GHz, an Arm Mali-G52 2EE GPU, and a 1 TOPS INT8 NPU. Supports DDR3/DDR3L/DDR4/LPDDR3/LPDDR4/LPDDR4X memory, 4K H.264/H.265/VP9 video decoding, 1080p60 H.264/H.265 video encoding, and interfaces including PCIe 3.0, SATA 3.0, USB 3.0/2.0, Gigabit Ethernet, HDMI 2.0, eDP 1.3, MIPI-CSI, MIPI-DSI, CAN, SDIO/eMMC, UART, SPI, I²C, and PWM. Packaged in a FCBGA636L (19 × 19 mm) package. Hashtags: #ApplicationProcessor #SoC #Rockchip #RK3568 #CortexA55 #MaliG52 #NPU #EmbeddedProcessor #AIoT #FCBGA636 #BGA636 #DDR4 #LPDDR4X #PCIe3 #USB3 #HDMI2 #GigabitEthernet
2 Uses0 StarsDSPIC30F4013-20I/P
dsPIC dsPIC™ 30F Microcontroller IC 16-Bit 20 MIPS 48KB (16K x 24) FLASH 40-PDIP Digital Signal Controller (DSC) for embedded control and digital signal processing applications, featuring a 16-bit dsPIC® core operating at up to 20 MIPS. It integrates 48 KB Flash program memory, 2 KB RAM, 1 KB EEPROM, and supports a 2.5 V to 5.5 V operating voltage range. The device includes a 13-channel 12-bit ADC, CAN, I²C, SPI, and UART communication interfaces, multiple PWM outputs, and is housed in a 40-pin PDIP package with up to 30 programmable I/O pins. #Microchip #dsPIC30F #DSPIC30F4013 #DigitalSignalController #DSC #16Bit #20MIPS #FlashMemory #CAN #I2C #SPI #UART #PWM #ADC #EmbeddedControl #MotorControl #PDIP40
0 Uses0 StarsNRF54LM20B-PAAA-R7
IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v6.0, Matter, Thread, Zigbee® 2.4GHz 98-WFBGA, CSPBGA Wireless System-on-Chip (SoC) designed for ultra-low-power 2.4 GHz wireless communication, providing an integrated multiprotocol radio for Bluetooth Low Energy and proprietary 2.4 GHz applications, along with an embedded processing subsystem for application and protocol handling. Supports operation in the 2.4 GHz ISM band and includes digital peripheral interfaces for system integration in embedded wireless designs. #WirelessSoC #NordicSemiconductor #nRF54L #BluetoothLE #2.4GHz #UltraLowPower #EmbeddedSystem
3 Uses0 StarsSTTS22HTR
Digital Temperature Sensor – 16-bit digital temperature sensor with I²C/SMBus 3.0 interface for local temperature measurement from −40°C to +125°C. Operates from a 1.5 V to 3.6 V supply and provides ±0.5°C accuracy over the −10°C to +60°C range. Features programmable temperature thresholds, ALERT output, one-shot mode, support for up to 1 MHz I²C clock, and up to four selectable I²C addresses. Housed in a 6-pin UDFN (2 × 2 mm) package. #STMicroelectronics #STTS22H #STTS22HTR #TemperatureSensor #DigitalTemperatureSensor #I2C #SMBus #16Bit #TemperatureMonitoring #UDFN6 #EmbeddedSystems #Sensors
25 Uses0 StarsEG25GGB-MINIPCIE
LTE Cat 4 Cellular Module – LTE Cat 4 wireless communication module in a Mini PCIe form factor supporting LTE-FDD, LTE-TDD, UMTS/HSPA+, and GSM/GPRS/EDGE networks. Operates from a 3.0 V to 3.6 V supply and provides data rates of up to 150 Mbps downlink and 50 Mbps uplink over LTE. Features USB 2.0, UART, I²C, and PCM interfaces, optional multi-constellation GNSS (GPS, GLONASS, BeiDou, Galileo, and QZSS), and supports an operating temperature range of −35°C to +75°C. Packaged in a standard Mini PCIe card (51.0 × 30.0 × 4.9 mm). #Quectel #EG25GGBMINIPCIE #EG25G #LTECat4 #CellularModule #MiniPCIe #LTE #4G #GNSS #GPS #GLONASS #BeiDou #Galileo #QZSS #USB2_0 #UART #I2C #PCM #EmbeddedSystems
8 Uses0 StarsEC21AUVFA512STD
LTE Cat 1 Cellular Module – LTE Cat 1 wireless communication module supporting LTE-FDD, UMTS/HSPA+, and GSM/GPRS/EDGE networks with maximum data rates of 10 Mbps downlink and 5 Mbps uplink. Operates from a 3.0 V to 3.6 V supply and features USB 2.0, UART, PCM, USIM, and I²C interfaces. Supports optional multi-constellation GNSS (GPS, GLONASS, BeiDou, Galileo, and QZSS) and is housed in an LCC package (29.0 × 32.0 × 2.4 mm). Specified for an operating temperature range of −35°C to +75°C. #Quectel #EC21AUVFA512STD #EC21 #LTECat1 #CellularModule #LTE #3G #2G #GNSS #GPS #GLONASS #BeiDou #Galileo #QZSS #USB2_0 #UART #I2C #LCC #EmbeddedSystems
0 Uses0 StarsDT13-08PA
Connector Header Panel Mount, Through Hole, Right Angle 8 position Connector header for wire-to-board interconnection in the DEUTSCH DT series. This 8-position, 2-row, right-angle board-mount connector features through-hole solder termination, a maximum contact current rating of 13 A, and a maximum operating voltage of 250 VAC/VDC. It has a 5.46 mm pitch, keyed locking interface with a sealable design, and supports power and signal applications. The connector operates over a -55°C to +125°C temperature range. #ConnectorHeader #WireToBoard #DeutschDT #RightAngle #ThroughHole #8Position #13A #250V #Sealable #PowerSignal #TEConnectivity
18 Uses0 StarsBP1048B2
Bluetooth and 2.4 GHz Wireless Audio Application Processor for embedded wireless audio systems, integrating a 32-bit processor with Bluetooth® 5.3 and 2.4 GHz proprietary wireless audio support. It operates from a 2.8 V to 4.3 V supply, integrates 24-bit audio DSP processing, supports I²S, PCM, UART, SPI, I²C, ADC, DAC, PWM, and GPIO interfaces, and includes Bluetooth Classic audio profiles along with programmable audio processing functions. The device is housed in a LQFP-48 (7 mm × 7 mm) package. #BluetoothAudioProcessor #WirelessAudioSoC #Bluetooth53 #24BitDSP #32BitProcessor #24GHzWireless #I2S #PCM #SPI #I2C #UART #MVSilicon
1 Uses0 StarsAC6951C
Bluetooth Audio SoC for wireless audio applications, integrating a 32-bit DSP processor with Bluetooth Classic (BR/EDR) and Bluetooth Low Energy (BLE) connectivity. It operates from a 2.8 V to 4.3 V supply and integrates 8 Mbit Flash, a 240 MHz programmable processor with hardware FPU, 16-bit stereo DAC (≥95 dB SNR), 3-channel 16-bit ADC (≥90 dB SNR), USB, UART, SPI, I²C, PWM, SD interfaces, and support for analog and PDM microphones. The device supports audio sampling rates from 8 kHz to 48 kHz, hardware audio codecs, and is available in a 48-pin LQFP (7 mm × 7 mm) package. #BluetoothSoC #AudioProcessor #WirelessAudio #BluetoothBR_EDR #BluetoothBLE #32BitDSP #240MHz #AudioCodec #USB #UART #SPI #I2C #PWM #LQFP48 #JieLiTech #AC6951C
0 Uses0 Stars
