Interface ICs
An interface IC is a type of integrated circuit that is designed to facilitate communication between two devices or systems. These devices are commonly used in electronic systems to enable the transfer of data and control signals between different components or subsystems. Some common use cases for interface ICs include connecting microcontrollers to peripherals such as sensors or displays, linking multiple processors together in a network, and enabling communication between devices using different communication protocols. Flux.ai has the world's largest community-driven public library of interface ICs, with footprints, symbols, datasheets, and simulation models. This library is a valuable resource for engineers and designers who need access to accurate and up-to-date information on these important components. Whether you are working on a new design project or simply looking to learn more about interface ICs, Flux.ai is an excellent resource to help you find the information you need.
NRF54LM20B-PAAA-R7
IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v6.0, Matter, Thread, Zigbee® 2.4GHz 98-WFBGA, CSPBGA Wireless System-on-Chip (SoC) designed for ultra-low-power 2.4 GHz wireless communication, providing an integrated multiprotocol radio for Bluetooth Low Energy and proprietary 2.4 GHz applications, along with an embedded processing subsystem for application and protocol handling. Supports operation in the 2.4 GHz ISM band and includes digital peripheral interfaces for system integration in embedded wireless designs. #WirelessSoC #NordicSemiconductor #nRF54L #BluetoothLE #2.4GHz #UltraLowPower #EmbeddedSystem
3 Uses0 StarsSTTS22HTR
Digital Temperature Sensor – 16-bit digital temperature sensor with I²C/SMBus 3.0 interface for local temperature measurement from −40°C to +125°C. Operates from a 1.5 V to 3.6 V supply and provides ±0.5°C accuracy over the −10°C to +60°C range. Features programmable temperature thresholds, ALERT output, one-shot mode, support for up to 1 MHz I²C clock, and up to four selectable I²C addresses. Housed in a 6-pin UDFN (2 × 2 mm) package. #STMicroelectronics #STTS22H #STTS22HTR #TemperatureSensor #DigitalTemperatureSensor #I2C #SMBus #16Bit #TemperatureMonitoring #UDFN6 #EmbeddedSystems #Sensors
25 Uses0 StarsEG25GGB-MINIPCIE
LTE Cat 4 Cellular Module – LTE Cat 4 wireless communication module in a Mini PCIe form factor supporting LTE-FDD, LTE-TDD, UMTS/HSPA+, and GSM/GPRS/EDGE networks. Operates from a 3.0 V to 3.6 V supply and provides data rates of up to 150 Mbps downlink and 50 Mbps uplink over LTE. Features USB 2.0, UART, I²C, and PCM interfaces, optional multi-constellation GNSS (GPS, GLONASS, BeiDou, Galileo, and QZSS), and supports an operating temperature range of −35°C to +75°C. Packaged in a standard Mini PCIe card (51.0 × 30.0 × 4.9 mm). #Quectel #EG25GGBMINIPCIE #EG25G #LTECat4 #CellularModule #MiniPCIe #LTE #4G #GNSS #GPS #GLONASS #BeiDou #Galileo #QZSS #USB2_0 #UART #I2C #PCM #EmbeddedSystems
8 Uses0 StarsEC21AUVFA512STD
LTE Cat 1 Cellular Module – LTE Cat 1 wireless communication module supporting LTE-FDD, UMTS/HSPA+, and GSM/GPRS/EDGE networks with maximum data rates of 10 Mbps downlink and 5 Mbps uplink. Operates from a 3.0 V to 3.6 V supply and features USB 2.0, UART, PCM, USIM, and I²C interfaces. Supports optional multi-constellation GNSS (GPS, GLONASS, BeiDou, Galileo, and QZSS) and is housed in an LCC package (29.0 × 32.0 × 2.4 mm). Specified for an operating temperature range of −35°C to +75°C. #Quectel #EC21AUVFA512STD #EC21 #LTECat1 #CellularModule #LTE #3G #2G #GNSS #GPS #GLONASS #BeiDou #Galileo #QZSS #USB2_0 #UART #I2C #LCC #EmbeddedSystems
0 Uses0 StarsDT13-08PA
Connector Header Panel Mount, Through Hole, Right Angle 8 position Connector header for wire-to-board interconnection in the DEUTSCH DT series. This 8-position, 2-row, right-angle board-mount connector features through-hole solder termination, a maximum contact current rating of 13 A, and a maximum operating voltage of 250 VAC/VDC. It has a 5.46 mm pitch, keyed locking interface with a sealable design, and supports power and signal applications. The connector operates over a -55°C to +125°C temperature range. #ConnectorHeader #WireToBoard #DeutschDT #RightAngle #ThroughHole #8Position #13A #250V #Sealable #PowerSignal #TEConnectivity
18 Uses0 StarsBP1048B2
Bluetooth and 2.4 GHz Wireless Audio Application Processor for embedded wireless audio systems, integrating a 32-bit processor with Bluetooth® 5.3 and 2.4 GHz proprietary wireless audio support. It operates from a 2.8 V to 4.3 V supply, integrates 24-bit audio DSP processing, supports I²S, PCM, UART, SPI, I²C, ADC, DAC, PWM, and GPIO interfaces, and includes Bluetooth Classic audio profiles along with programmable audio processing functions. The device is housed in a LQFP-48 (7 mm × 7 mm) package. #BluetoothAudioProcessor #WirelessAudioSoC #Bluetooth53 #24BitDSP #32BitProcessor #24GHzWireless #I2S #PCM #SPI #I2C #UART #MVSilicon
1 Uses0 StarsAC6951C
Bluetooth Audio SoC for wireless audio applications, integrating a 32-bit DSP processor with Bluetooth Classic (BR/EDR) and Bluetooth Low Energy (BLE) connectivity. It operates from a 2.8 V to 4.3 V supply and integrates 8 Mbit Flash, a 240 MHz programmable processor with hardware FPU, 16-bit stereo DAC (≥95 dB SNR), 3-channel 16-bit ADC (≥90 dB SNR), USB, UART, SPI, I²C, PWM, SD interfaces, and support for analog and PDM microphones. The device supports audio sampling rates from 8 kHz to 48 kHz, hardware audio codecs, and is available in a 48-pin LQFP (7 mm × 7 mm) package. #BluetoothSoC #AudioProcessor #WirelessAudio #BluetoothBR_EDR #BluetoothBLE #32BitDSP #240MHz #AudioCodec #USB #UART #SPI #I2C #PWM #LQFP48 #JieLiTech #AC6951C
0 Uses0 StarsLE910C1-AP
Telit LE910C1-AP LTE Cat 1 cellular module for APAC/ANZ/Japan applications. The module uses Telit's 28.2 mm x 28.2 mm x 2.2 mm xE910 181-pad LGA form factor, operates from a 3.4 V to 4.2 V main supply with 3.8 V nominal VBATT, and is rated for -40 C to +85 C industrial operation. LE910C1-AP supports LTE Cat 1 data rates up to 10 Mbps downlink and 5 Mbps uplink; extracted AP variant band data lists FDD LTE B1/B3/B5/B8/B28 with HSPA+ B1/B5/B8 fallback. Key interfaces include USB 2.0 HS/HSIC, UART, SPI/AUX UART, SD/MMC, Wi-Fi SDIO/coexistence, SIM1/SIM2, DVI, GPIO, ADC, I2C, SGMII, main/diversity RF antenna pads, and optional GNSS-related pins where supported. RF pins require 50 ohm controlled-impedance routing; reserved pins should be left floating unless Telit documentation states otherwise.
0 Uses0 StarsAT24C02C-SSHM-T
Serial EEPROM providing 2 Kbit (256 × 8) nonvolatile memory with an I²C-compatible two-wire interface for data storage and system configuration. It operates from 1.7 V to 5.5 V, supports Standard (100 kHz), Fast (400 kHz), and Fast-mode Plus (1 MHz) I²C communication, features 16-byte page write, and is housed in an 8-pin SOIC package. #SerialEEPROM #EEPROM #I2C #NonvolatileMemory #2Kbit #Microchip #SOIC8 #EmbeddedSystems
2 Uses0 StarsTPD4S201RUKR
Overvoltage/Surge Protection IC Internal Switch 20-WQFN (3x3) ESD protection and USB charging-port interface IC for USB 2.0 data lines, integrating IEC 61000-4-2 ±15 kV air and ±8 kV contact ESD protection with support for USB Battery Charging Specification Rev. 1.2 charger detection. It operates from a 2.5 V to 5.5 V supply, includes an integrated high-side VBUS switch rated for up to 1.5 A, and is housed in a 6-pin WQFN (RUK) package. #ESDProtection #USB2_0 #USBCharging #BC1_2 #VBUSSwitch #InterfaceIC #TexasInstruments #WQFN6
7 Uses0 Stars
