Interface ICs

Bus Switch 1 x 8:1 24-VQFN (4x4) # TCA9548ARGER Engineering Specifications **General Description** The TCA9548ARGER is a low-voltage I²C and SMBus switch manufactured by Texas Instruments. It is designed to expand and manage I²C communication networks by allowing a single master device to selectively communicate with multiple downstream buses through independent switching channels. The device functions as a bidirectional translating switch, enabling communication between devices operating at different voltage levels while maintaining protocol compatibility. Through software control, individual channels can be enabled or disabled, providing flexible bus segmentation, address conflict resolution, and system scalability. The TCA9548ARGER is widely used in embedded systems, industrial control equipment, data acquisition platforms, telecommunications hardware, server management systems, sensor networks, and Internet of Things applications where multiple I²C devices must be connected to a single controller. Its low-power CMOS architecture, integrated reset functionality, and hot-insertion support make it suitable for complex digital systems requiring reliable and efficient I²C bus management. **Engineering Specifications** **Manufacturer:** Texas Instruments **Manufacturer Part Number:** TCA9548ARGER **Component Type:** I²C bus switch and multiplexer **Technology:** Low-voltage CMOS **Interface Standard:** I²C and SMBus compatible **Switch Configuration:** Multiple downstream I²C channel selection **Channel Operation:** Software-controlled channel enable and disable **Communication Direction:** Bidirectional signal transmission **Voltage Translation Capability:** Supports communication between devices operating at different logic voltages **Bus Isolation Function:** Independent channel isolation for address conflict management **Control Method:** I²C command-based channel selection **Address Selection:** Configurable device addressing through hardware address pins **Power Supply Configuration:** Single-supply operation **Power Consumption:** Low-power operation suitable for embedded applications **Signal Integrity Features:** Low ON-state resistance and low propagation delay **Reset Function:** Dedicated hardware reset input **Hot Insertion Support:** Prevents bus disruption during device insertion and removal **Fail-Safe Characteristics:** Protection against unintended bus communication during power transitions **Bus Capacitance Management:** Improves communication reliability in large I²C networks **System Scalability:** Supports expansion of sensor, peripheral, and control-device networks **Electrostatic Protection:** Integrated ESD protection circuitry **Operating Temperature Range:** Industrial temperature range **Package Type:** VQFN surface-mount package **Mounting Style:** Surface mount technology **Package Construction:** Leadless thermally efficient package **Environmental Compliance:** RoHS compliant and lead-free **Reliability Features:** Designed for high-reliability industrial and embedded applications **Typical Applications** I²C bus expansion systems Sensor aggregation networks Industrial automation equipment Embedded controller platforms Server management systems Data acquisition hardware Telecommunications equipment Internet of Things devices Medical instrumentation Consumer electronics Robotics and automation systems Environmental monitoring devices Smart building control systems Automotive electronic subsystems Multi-sensor embedded applications #TCA9548A #TCA9548ARGER #TexasInstruments #I2C #SMBus #BusMultiplexer #I2CSwitch #EmbeddedSystems #IndustrialAutomation #SensorNetworks #IoT #DataAcquisition #ElectronicsEngineering #ElectronicComponents #EngineeringSpecifications

# SAM-M10Q-00B Engineering Specifications **General Description** The SAM-M10Q-00B is a compact, ultra-low-power Global Navigation Satellite System receiver module manufactured by u-blox. It is designed to provide highly accurate positioning, navigation, and timing information for battery-powered and space-constrained applications. Built on the u-blox M10 positioning platform, the module supports concurrent reception of multiple satellite constellations, enabling improved positioning accuracy, faster acquisition times, and enhanced reliability in challenging environments such as urban canyons and partially obstructed outdoor locations. Its optimized power architecture significantly reduces energy consumption while maintaining continuous navigation performance. The integrated antenna architecture and compact system-in-package design simplify hardware development by reducing external component requirements. The module is suitable for asset tracking, wearable devices, Internet of Things systems, industrial monitoring equipment, smart city infrastructure, agricultural applications, and portable navigation products. Designed for high-volume embedded applications, the SAM-M10Q-00B combines advanced GNSS technology, low power consumption, and robust positioning performance in a miniature surface-mount package. **Engineering Specifications** **Manufacturer:** u-blox **Manufacturer Part Number:** SAM-M10Q-00B **Component Type:** GNSS receiver module **Technology:** Multi-constellation satellite positioning receiver **GNSS Platform:** u-blox M10 positioning technology **Navigation Function:** Global positioning, navigation, and timing **Satellite Reception:** Concurrent multi-constellation GNSS tracking **Supported Systems:** GPS, Galileo, GLONASS, BeiDou and regional augmentation services **Receiver Architecture:** High-sensitivity GNSS receiver **Positioning Capability:** Real-time location tracking and navigation **Acquisition Performance:** Fast satellite acquisition and reacquisition **Tracking Performance:** Continuous satellite tracking under dynamic conditions **Position Accuracy:** High-precision navigation performance **Sensitivity:** Optimized for weak-signal environments **Power Consumption:** Ultra-low-power operation **Power Supply Configuration:** Single-supply operation **Data Interface:** Serial communication interface for host processor integration **Communication Protocols:** Standard GNSS navigation messaging support **Integrated Features:** Embedded antenna solution and RF front-end integration **Startup Modes:** Cold start, warm start and hot start operation **Timing Capability:** Precision timing and synchronization support **Interference Mitigation:** Advanced signal-processing algorithms for improved reception **System Integration:** Designed for compact embedded applications **Environmental Performance:** Reliable operation in outdoor and industrial environments **Operating Temperature Range:** Industrial temperature range **Package Type:** System-in-package GNSS module **Mounting Style:** Surface mount technology **Package Construction:** Compact low-profile module **Environmental Compliance:** RoHS compliant and lead-free **Reliability Features:** Designed for long-term embedded operation and high-volume production **Typical Applications** Asset tracking devices Internet of Things systems Wearable electronics Portable navigation equipment Fleet management systems Smart city infrastructure Industrial monitoring equipment Agricultural positioning systems Environmental data loggers Personal tracking devices Drone navigation systems Geolocation-enabled sensors Telematics systems Logistics and transportation tracking Battery-powered embedded products #SAMM10Q00B #SAMM10Q #uBlox #GNSS #GPSModule #SatelliteNavigation #PositioningSystem #IoT #AssetTracking #WearableTechnology #EmbeddedSystems #NavigationModule #Telematics #LocationTracking #ElectronicComponents #EngineeringSpecifications

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

# ADC0804LCN/NOPB Engineering Specifications **General Description** The ADC0804LCN/NOPB is a CMOS successive-approximation analog-to-digital converter manufactured by Texas Instruments. It converts a differential analog input signal into an eight-bit digital output and is designed for direct connection to microprocessors through a parallel data interface. The device uses a differential potentiometric-ladder architecture to improve common-mode rejection and allow the analog zero-input level to be offset. Its adjustable reference input permits smaller analog voltage spans to use the converter’s full resolution. Tri-state output latches allow direct connection to a processor data bus without additional interface logic. The converter can operate as a microprocessor-controlled device or as a standalone, free-running converter. An integrated clock generator allows operation using an external resistor-capacitor network, although an external clock signal may also be used. **Engineering Specifications** **Manufacturer:** Texas Instruments **Manufacturer Part Number:** ADC0804LCN/NOPB **Component Type:** Analog-to-Digital Converter **Converter Architecture:** Successive Approximation Register **Resolution:** Eight bits **Number of Channels:** One **Input Configuration:** Differential analog input **Analog Input Range:** Zero volts to five volts with a five-volt supply **Supply Voltage Range:** Four and one-half volts to six and three-tenths volts **Typical Supply Voltage:** Five volts **Reference Type:** External, supply-based or ratiometric reference **Reference Input:** Adjustable VREF divided-by-two input **Digital Interface:** Eight-bit parallel interface **Microprocessor Compatibility:** Directly compatible with common eight-bit microprocessors **Conversion Time:** Approximately one hundred microseconds **Maximum Sampling Rate:** Approximately ten kilosamples per second **Total Unadjusted Error:** Plus or minus one least significant bit **Digital Outputs:** Latched tri-state outputs **Logic Compatibility:** TTL and MOS-compatible inputs and outputs **Clock Configuration:** Integrated clock generator with external resistor-capacitor timing or external clock input **Operating Modes:** Processor-controlled, standalone or continuous free-running operation **Operating Temperature Range:** Zero degrees Celsius to seventy degrees Celsius **Package Type:** Twenty-pin plastic dual in-line package **Mounting Style:** Through-hole mounting **Package Width:** Standard three-tenths-inch DIP format **Environmental Classification:** Lead-free and RoHS-compliant NOPB version **Lifecycle Status:** Obsolete and generally not recommended for new production designs **Typical Applications** Suitable for sensor signal conversion, temperature-monitoring systems, voltage measurement, transducer interfaces, embedded control systems, laboratory equipment, educational electronics projects and general-purpose data-acquisition circuits. #ADC0804LCN #ADC0804 #TexasInstruments #AnalogToDigitalConverter #ADC #DataAcquisition #EmbeddedSystems #ElectronicsEngineering #IntegratedCircuit #MicrocontrollerProjects #ElectronicComponents 8 Bit Analog to Digital Converter 1 Input 1 SAR 20-PDIP https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/721/ADC080x.pdf

Magnetic Sensors LIS2MDLTR LGA-12_L2.0-W2.0-P0.50-BL LCSC Part Number: C919695 JLCPCB Part Class: Extended Part Manufactured by ST(意法半导体) STMicroelectronics LIS2MDL ultralow-power high-performance 3-axis digital magnetometer, ±50 gauss magnetic dynamic range, 16-bit data output, SPI and I2C serial interfaces, 1.71V to 3.6V analog supply voltage, selectable power modes and resolution, single measurement mode, programmable interrupt generator, embedded self-test and temperature sensor, -40°C to +85°C operating range, LGA-12 package 2.0 x 2.0 x 0.7mm. Search Keywords: LIS2MDL, LIS2MDLTR, ST LIS2MDL, STMicroelectronics LIS2MDL, LIS2MDL magnetometer, 3-axis magnetometer, digital magnetic sensor, 3-axis digital magnetic sensor, ±50 gauss magnetometer, I2C SPI magnetometer, 16-bit magnetometer, low power magnetometer, compass sensor, LGA-12 magnetometer, 2x2mm magnetometer Hashtags: #LIS2MDL #LIS2MDLTR #STMicroelectronics #Magnetometer #3AxisMagnetometer #DigitalMagneticSensor #CompassSensor #I2CSensor #SPISensor #16BitSensor #LowPowerSensor #50GaussSensor #LGA12

Magnetic Sensors QMC5883L LGA-16_L3.0-W3.0-P0.50-BL_SQ The QMC5883L is a multi-chip three-axis magnetic sensor. This surface -mount, small sized chip has integrated magnetic sensors with signal condition ASIC, targeted for high precision applications such as compassing, navigation and gaming in drone, robot, mobile and personal hand-held devices. The QMC5883L is based on our state-of-the-art, high resolution, magneto-resistive technology licensed from Honeywell AMR technology. Along with custom-designed 16-bit ADC ASIC, it offers the advantages of low noise, high accuracy, low power consumption, offset cancellation and temperature compensation. QMC5883L enables 1° to 2° compass heading accuracy. The I²C serial bus allows for easy interface. The QMC5883L is in a 3x3x0.9mm3 surface mount 16-pin land grid array (LGA) package.  3-Axis Magneto-Resistive Sensors in a 3x3x0.9 mm3 Land Grid Array Package (LGA), guaranteed to operate over an extended temperature range of -40 °C to +85 °C.  Small Size for Highly Integrated Products. Signals Have Been Digitized And Calibrated.  16 Bit ADC With Low Noise AMR Sensors Achieves 2 Milli-Gauss Field Resolution  Enables 1° To 2° Degree Compass Heading Accuracy , Allows for Navigation and LBS Applications  Wide Magnetic Field Range (±8 Gauss)  Maximizes Sensor’s Full Dynamic Range and Resolution  Temperature Compensated Data Output and Temperature Output  Automatically Maintains Sensor’s Sensitivity Under Wide Operating Temperature Range  I 2C Interface with Standard and Fast Modes.  High-Speed Interfaces for Fast Data Communications. Maximum 200Hz Data Output Rate  Wide Range Operation Voltage (2.16V To 3.6V) and Low Power Consumption (75A)  Compatible with Battery Powered Applications  Lead Free Package Construction  RoHS Compliance  Software And Algorithm Support Available  Compassing Heading, Hard Iron, Soft Iron, and Auto Calibration Libraries Available #CommonPartsLibrary #Sensor

SPI Flash Serial Flash Memory with Dual/Quad SPI The W25Q16JVUXIQ is a 16-Mbit (2-MByte) Serial NOR Flash memory device from Winbond. It is designed for embedded systems that require non-volatile code and data storage with minimal pin count, low power consumption, and high-speed access. The device supports standard SPI, Dual SPI, and Quad SPI interfaces, making it suitable for firmware storage, boot memory, IoT devices, microcontrollers, consumer electronics, and execute-in-place (XIP) applications. Key Features 16-Mbit (2-MByte) Flash Memory Capacity Operating Voltage: 2.7 V to 3.6 V Standard SPI, Dual SPI, and Quad SPI Interface Support Maximum SPI Clock Frequency: 133 MHz Equivalent Data Transfer Rates: 266 MHz (Dual SPI) 532 MHz (Quad SPI) Continuous Read and XIP (Execute-In-Place) Capability 4 KB Sector Erase, 32 KB Block Erase, 64 KB Block Erase, and Chip Erase 256-Byte Programmable Page Size Minimum 100,000 Program/Erase Cycles per Sector More Than 20 Years Data Retention Ultra-Low Power Consumption Typical power-down current below 1 µA 64-Bit Unique Serial Number Three 256-Byte Security Registers with OTP Protection JEDEC ID and SFDP Support Software and Hardware Write Protection Operating Temperature Options up to +85°C and +105°C Compact 8-Pad USON Package (2 mm × 3 mm) suitable for space-constrained designs #CommonPartsLibrary #IntegratedCircuit #Memory

2.4GHz Wi-Fi+Bluetooth LE SoC ESP32-S3FH4R2 is a highly integrated low-power Wi-Fi and Bluetooth LE System-on-Chip (SoC) from Espressif Systems. It is based on a dual-core Xtensa® LX7 processor running at up to 240 MHz and is designed for IoT, smart home, industrial control, AIoT, audio processing, and embedded applications. The ESP32-S3FH4R2 variant includes 4 MB of in-package Quad SPI Flash and 2 MB of in-package Quad SPI PSRAM, reducing external component count and simplifying PCB design. Key Features Dual-core Xtensa® LX7 CPU Up to 240 MHz operating frequency 32-bit architecture with floating-point unit (FPU) SIMD instructions for AI and signal-processing workloads Integrated Memory 4 MB in-package Flash 2 MB in-package PSRAM 512 KB on-chip SRAM 384 KB ROM Additional RTC memory for low-power operation Wireless Connectivity IEEE 802.11 b/g/n 2.4 GHz Wi-Fi Bluetooth® 5 Low Energy (LE) Long-range and low-power wireless communication support Rich Peripheral Set Up to 45 programmable GPIOs USB OTG and USB Serial/JTAG SPI, I²C, I²S, UART, SDIO TWAI® (CAN 2.0 compatible) Camera interface LCD interface PWM, pulse counter, RMT, DMA controller Analog Features Two 12-bit SAR ADCs Temperature sensor 14 capacitive touch sensing inputs Security Features Secure Boot Flash Encryption AES, SHA, RSA, HMAC hardware accelerators True Random Number Generator (RNG) Digital Signature peripheral Low-Power Operation Multiple power-saving modes ULP-RISC-V coprocessor ULP-FSM coprocessor Deep-sleep support with RTC memory retention

Small Footprint RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support LAN8720A-CP-TR-ABC is a low-power, single-port 10BASE-T/100BASE-TX Ethernet Physical Layer (PHY) transceiver from Microchip Technology. It is designed to connect a microcontroller, processor, or Ethernet MAC to a standard Ethernet network through an RMII (Reduced Media Independent Interface). The device is widely used in embedded networking applications such as industrial controllers, IoT gateways, IP cameras, networked printers, routers, and ESP32-based Ethernet designs. Key Features Single-chip 10/100 Mbps Ethernet PHY Supports both 10BASE-T and 100BASE-TX Ethernet operation. RMII Interface Reduced pin-count interface for easy connection to Ethernet MACs and microcontrollers. IEEE 802.3 / 802.3u Compliant Fully compliant with Fast Ethernet standards. HP Auto-MDIX Support Automatically detects and configures straight-through or crossover Ethernet cables. Auto-Negotiation Automatically selects the best available speed and duplex mode. Flexible I/O Voltage Supports LVCMOS I/O voltages from 1.6 V to 3.6 V, simplifying interfacing with different processors. Integrated 1.2 V Regulator Allows operation from a single 3.3 V supply, reducing external components. Low-Power Architecture Features multiple power-saving modes through Microchip's flexPWR® technology. Built-in Diagnostics and Reliability Features Loopback modes, automatic polarity correction, link-status monitoring, and wake-up detection. Compact Package Available in a 24-pin SQFN/QFN (4 mm × 4 mm) package for space-constrained designs #CommonPartsLibrary #IntegratedCircuit

M.2 CONN.P=0.5 6.7mm H conn The 91302-67-067R2M is a 67-position M.2 (NGFF) card-edge connector manufactured by UMAX. It is designed for connecting M.2 SSDs and PCIe-based expansion modules to a host PCB. The connector features an M-Key interface, making it suitable for high-speed PCIe storage applications such as NVMe solid-state drives. It is a surface-mount, right-angle receptacle with a 0.5 mm contact pitch and a 6.7 mm height above the PCB. Key Features M.2 M-Key connector Supports M-Key M.2 modules, commonly used for PCIe/NVMe SSDs. 67 contacts (67P) Standard pin count for M-Key M.2 card-edge connections. 0.5 mm pitch Fine-pitch design suitable for compact, high-density PCB layouts. Surface-mount, right-angle mounting Optimized for automated PCB assembly and low-profile system designs. 6.7 mm connector height Provides compatibility with standard M.2 card installation requirements. Female card-edge receptacle Accepts M.2 modules directly without additional adapters. RoHS compliant Meets environmental requirements for lead-free electronic assemblies. Typical Applications NVMe SSD sockets PCIe M.2 storage devices Embedded computing systems Industrial PCs Networking equipment Edge AI and IoT gateways Single-board computers requiring M.2 expansion #CommonPartsLibrary #Connector