Interface ICs
An interface IC is a type of integrated circuit that is designed to facilitate communication between two devices or systems. These devices are commonly used in electronic systems to enable the transfer of data and control signals between different components or subsystems. Some common use cases for interface ICs include connecting microcontrollers to peripherals such as sensors or displays, linking multiple processors together in a network, and enabling communication between devices using different communication protocols. Flux.ai has the world's largest community-driven public library of interface ICs, with footprints, symbols, datasheets, and simulation models. This library is a valuable resource for engineers and designers who need access to accurate and up-to-date information on these important components. Whether you are working on a new design project or simply looking to learn more about interface ICs, Flux.ai is an excellent resource to help you find the information you need.
VL6180XV0NR/1
Optical Sensor 0 ~ 24.41" (0 ~ 62cm) I2C Output Optical Time-of-Flight (ToF) proximity sensor with an integrated infrared emitter, designed for absolute distance measurement, ambient light sensing, and gesture detection. Operates from a 2.6 V to 3.5 V supply, measures distances up to 100 mm, features an I²C interface (up to 400 kHz), and integrates an 850 nm VCSEL, ranging sensor, ambient light sensor (ALS), and signal processing. Housed in a compact 4.8 × 2.8 × 1.0 mm LGA-12 package. #TimeOfFlight #ToFSensor #ProximitySensor #AmbientLightSensor #GestureDetection #I2C #VCSEL #InfraredSensor #STMicroelectronics #LGA12 #commonpartslibrary #sensor
22 Uses1 StarsOS102011MS2QN1
Slide Switch, SPDT, On-On, Through Hole, OS Series, 100mA # OS102011MS2QN1 ## General Description The OS102011MS2QN1 is a miniature slide switch manufactured by C&K, designed for low-power signal switching and control applications in electronic equipment. The switch features a compact mechanical design, reliable contact performance, and through-hole mounting configuration, making it suitable for embedded systems, industrial controls, instrumentation, telecommunications equipment, consumer electronics, and portable devices. Its robust construction ensures dependable operation throughout repeated switching cycles while maintaining stable electrical performance. The device is commonly utilized for mode selection, power control, configuration settings, and user-interface functions within electronic assemblies. ## Key Features ### Mechanical Characteristics * Miniature slide switch construction * Through-hole PCB mounting * Compact form factor * Durable actuator mechanism * Positive switching action * Designed for repeated mechanical operation ### Switching Characteristics * Maintained-contact operation * Reliable position retention * Low-force actuation * Stable contact engagement * Suitable for signal and control switching applications ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Stable switching performance * Suitable for low-current and low-voltage circuits * Consistent electrical operation throughout service life ### Contact System * High-reliability contact materials * Corrosion-resistant contact surfaces * Long operational durability * Dependable electrical continuity ### Material Construction * High-strength thermoplastic housing * Industrial-grade metallic contacts * Durable actuator assembly * RoHS-compliant materials ### Environmental Characteristics * Suitable for commercial and industrial electronic equipment * Resistant to mechanical wear * Reliable performance under normal operating environments * Designed for long-term service reliability ### Application Areas * Embedded Systems * Industrial Control Equipment * Consumer Electronics * Test and Measurement Instruments * Communication Devices * Medical Electronics * Power Control Circuits * User Interface Controls * Configuration and Mode Selection Functions * Electronic Development Platforms ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Switching Component ## Manufacturer C&K ## Product Family OS Series Miniature Slide Switches #OS102011MS2QN1 #CKSwitches #SlideSwitch #MiniatureSwitch #ElectronicSwitch #PCBSwitch #EmbeddedSystems #IndustrialElectronics #ControlSystems #ConsumerElectronics #HardwareDesign #ElectronicsEngineering #SignalSwitching #PCBAssembly #ElectronicComponents #commonpartslibrary #switch #slide #spdt
618 Uses1 StarsSTM32MP257FAI3
MPU with Dual Arm Cortex-A35 @1.5GHz, Cortex-M33 @400MHz, 3xEthernet (2+1 switch), 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI/NN, Secure Boot, Cryptography, DRAM enc/dec, PKA The STM32MP257FAI3 is a high-performance microprocessor from STMicroelectronics' STM32MP2 series, integrating dual 64-bit Arm Cortex-A35 cores running at up to 1.5 GHz, a Cortex-M33 real-time core, and a Cortex-M0+ low-power management core. It is designed for advanced industrial, edge AI, machine vision, HMI, IoT gateway, and multimedia applications requiring Linux-class processing alongside deterministic real-time control. The device features AI acceleration, 3D graphics, video encoding/decoding, extensive connectivity, advanced security, and support for high-speed external memory. Key Features Dual-core 64-bit Arm Cortex-A35 CPU operating up to 1.5 GHz Arm Cortex-M33 real-time processor with TrustZone and FPU support Arm Cortex-M0+ low-power coprocessor for autonomous operation Integrated NPU (Neural Processing Unit) delivering up to 1.35 TOPS AI performance 3D GPU and hardware video encoder/decoder acceleration Supports DDR3L, DDR4, and LPDDR4 external memory up to 4 GB Multiple display interfaces including MIPI-DSI, LVDS, and parallel RGB USB 2.0 Host and USB 3.0 Dual-Role with embedded PHYs PCI Express interface with integrated 5 Gbps PHY Up to three Gigabit Ethernet interfaces with TSN and IEEE 1588 support Extensive connectivity: I2C, I3C, SPI, UART, USART, CAN FD, SDMMC, SAI, and SPDIF Hardware cryptographic accelerators including AES, SHA, RSA, ECC, PKA, and True RNG Secure boot, TrustZone security, tamper detection, and resource isolation framework Multiple low-power operating modes for energy-efficient designs Available in fine-pitch BGA packages for high-density embedded systems. #STM32MP257FAI3 #STM32MP2 #STMicroelectronics #CortexA35 #CortexM33 #EdgeAI #EmbeddedLinux #IndustrialAutomation #MachineVision #HMI #IoTGateway #MPU #PCIe #USB3 #GigabitEthernet #TrustZone #EmbeddedSystems #ArtificialIntelligence #LinuxProcessor #IndustrialIoT #CommonPartsLibrary #IntegratedCircuit #Microprocessor #STM32MP2
35 Uses1 StarsBME280
Humidity, Pressure, Temperature 0 ~ 100% RH I²C, SPI ±3% 1 s Surface Mount BME280 I2C breakout module The BME280 integrates three sensors—temperature, relative humidity, and pressure—along with a high-performance digital interface. It communicates via I²C or SPI, making it easy to interface with microcontrollers like Arduino, ESP32, and STM32. It is designed for low power consumption, making it suitable for battery-powered applications such as portable weather stations and smart home devices. Key Features Environmental Sensing Measures: Temperature Relative Humidity Barometric Pressure Enables altitude estimation based on pressure readings High Accuracy Temperature: ±1.0°C (typical) Humidity: ±3% RH (typical) Pressure: ±1 hPa (typical) Low Power Consumption Typical current: ~0.6 µA (sleep mode) ~3.6 µA (measurement mode) Ideal for battery-operated devices Communication Interfaces Supports: I²C (up to 3.4 MHz) SPI (3-wire / 4-wire) Easy integration with most microcontrollers Compact Package Small footprint: 2.5 × 2.5 × 0.93 mm LGA package Suitable for space-constrained designs Built-in Features Factory-calibrated coefficients stored in NVM Configurable oversampling and filtering Integrated ADC for high-resolution measurements #commonpartslibrary #sensor #humidity #pressure
319 Uses1 StarsMAX-M10S-00B
MAX-M10 RF Receiver BeiDou, Galileo, GLONASS, GPS, GNSS 1.561GHz, 1.575GHz, 1.602GHz -167dBm 921.6kbps Not Included Module The MAX-M10S-00B is a professional-grade, ultra-low-power GNSS positioning module from u-blox based on the u-blox M10 platform. It is designed for battery-powered applications such as asset trackers, wearables, IoT devices, and navigation systems. The module supports simultaneous reception of multiple GNSS constellations, providing high positioning availability, fast acquisition times, and excellent sensitivity even in challenging urban or weak-signal environments. It integrates a TCXO, LNA, and SAW filter to improve RF performance while maintaining very low power consumption. Key Features Multi-constellation GNSS receiver: GPS Galileo GLONASS BeiDou QZSS SBAS support (WAAS, EGNOS, MSAS, GAGAN) Concurrent tracking of up to four GNSS constellations for improved position availability and accuracy. Ultra-low power consumption: Approximately 25 mW in continuous tracking mode, making it ideal for battery-powered devices. High RF sensitivity: Tracking sensitivity up to −167 dBm for reliable operation in weak-signal conditions. High positioning accuracy: Typical position accuracy of approximately 1.5 m CEP under suitable conditions. Navigation update rate: Up to 10 Hz for responsive tracking applications. Integrated RF front-end: Built-in LNA (Low Noise Amplifier) Built-in SAW filter Integrated TCXO for stable operation. Supports Assisted GNSS services: AssistNow Online AssistNow Offline AssistNow Autonomous CloudLocate support for low-power IoT positioning. Communication interfaces: UART I²C NMEA and UBX protocols supported. Wide operating temperature range: −40°C to +85°C. Supply voltage: 1.76 V to 3.6 V. Typical Applications Asset tracking devices Wearable electronics Fleet management systems Industrial IoT Smart meters Drone and robotics navigation Personal navigation devices Timing and synchronization systems Package Information Package Type: Surface-mount LCC module Dimensions: 9.7 mm × 10.1 mm × 2.5 mm (typical module size) #Commonpartslibrary #RF #Wireless #RFreceivers #MAXM10S #uBlox #GNSS #GPS #Galileo #GLONASS #BeiDou #QZSS #NavigationModule #GNSSModule #GPSTracking #AssetTracking #IoT #IndustrialIoT #WearableTech #FleetManagement #DroneNavigation #EmbeddedSystems #ElectronicsDesign #PCBDesign #HardwareEngineering #LowPowerDesign #LocationTracking #Geolocation #RFDesign #LNA #SMTModule
346 Uses1 StarsTMC2209-LA-T
Motor Drivers TMC2209-LA-T QFN-28_L5.0-W5.0-P0.50-BL-EP LCSC Part Number: C2150710 TRINAMIC TMC2209-LA two-phase stepper motor driver IC with STEP/DIR interface, up to 2.8A peak coil current (2A RMS), ultra-quiet StealthChop2 operation, SpreadCycle current control, StallGuard4 sensorless stall detection, CoolStep automatic current reduction, MicroPlyer interpolation up to 256 microsteps, integrated pulse generator, UART configuration interface, internal sense resistor option, low RDS(on) MOSFETs, 4.75V to 29V motor supply range, QFN package with exposed thermal pad, designed for 3D printers, CNC machines, robotics, automation and battery-powered equipment. Search Keywords: TMC2209, TMC2209-LA, Trinamic TMC2209, stepper motor driver, silent stepper driver, StealthChop2, SpreadCycle, StallGuard4, CoolStep, MicroPlyer, UART stepper driver, STEP DIR driver, 2A RMS stepper driver, 2.8A peak motor driver, 3D printer driver, CNC motor driver, QFN stepper driver Hashtags: #TMC2209 #TMC2209LA #Trinamic #StepperDriver #StepperMotorDriver #StealthChop2 #SpreadCycle #StallGuard4 #CoolStep #MicroPlyer #UARTDriver #3DPrinterElectronics #CNCElectronics #MotionControl #MotorDriverIC #SilentStepperDriver
128 Uses1 StarsESP32-CAM
The ESP32-CAM Ai-Thinker is a compact, low-cost Wi-Fi and Bluetooth-enabled camera development module based on the ESP32-S dual-core microcontroller. It integrates an OV2640 2MP camera sensor, onboard Flash memory, PSRAM, and a MicroSD card slot, making it suitable for IoT vision applications, wireless surveillance, image capture, video streaming, face recognition, and smart home projects. The module combines wireless connectivity and image processing capabilities in a small form factor while maintaining low power consumption. Key Features ESP32-S Dual-Core Processor Tensilica Xtensa LX6 dual-core 32-bit CPU Operating frequency up to 240 MHz Computing performance up to 600 DMIPS Integrated Camera Equipped with OV2640 CMOS image sensor Maximum image resolution: 1600 × 1200 (UXGA, 2MP) Supports JPEG image compression and video streaming Memory 4 MB Flash memory External PSRAM for frame buffering and image processing 520 KB internal SRAM Wireless Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 4.2 BR/EDR and BLE support Storage Built-in MicroSD/TF card slot Supports local storage of images, videos, and data logs Peripheral Interfaces UART SPI I²C PWM ADC DAC GPIO expansion pins Power Supply Operating voltage: 5 V Low-power operation with deep-sleep capability for battery-powered applications Compact Design Module size approximately 27 mm × 40.5 mm PCB antenna onboard Optional external antenna connection on some variants
184 Uses1 Stars
