Interface ICs
An interface IC is a type of integrated circuit that is designed to facilitate communication between two devices or systems. These devices are commonly used in electronic systems to enable the transfer of data and control signals between different components or subsystems. Some common use cases for interface ICs include connecting microcontrollers to peripherals such as sensors or displays, linking multiple processors together in a network, and enabling communication between devices using different communication protocols. Flux.ai has the world's largest community-driven public library of interface ICs, with footprints, symbols, datasheets, and simulation models. This library is a valuable resource for engineers and designers who need access to accurate and up-to-date information on these important components. Whether you are working on a new design project or simply looking to learn more about interface ICs, Flux.ai is an excellent resource to help you find the information you need.
W55RP20
Ethernet ICs W55RP20 microcontroller, Dual ARM Cortex-M0+ a. 133MHz, 2MByte Flash memory on-chip, 264kB on-chip SRAM in six independent banks, DMA controller W55RP20 is a highly integrated System-in-Package (SiP) from WIZnet that combines the popular RP2040 dual-core microcontroller with a W5500 hardware TCP/IP Ethernet controller. Designed for IoT, industrial automation, and embedded networking applications, the W55RP20 delivers reliable Ethernet connectivity, low power consumption, and high-performance processing in a compact package. It simplifies Ethernet-enabled designs by integrating the MCU, network stack, flash memory, and Ethernet functionality into a single device. Key Features Dual-core ARM Cortex-M0+ processor running up to 133 MHz Integrated hardwired TCP/IP stack for reliable Ethernet communication 2 MB on-chip Flash memory 264 KB SRAM in six independent memory banks Built-in 10BASE-T / 100BASE-TX Ethernet MAC and PHY Supports TCP, UDP, IPv4, ICMP, ARP, IGMP, and PPPoE protocols 23 GPIO pins, including 4 analog-capable inputs 2× UART, 2× SPI, and 2× I²C interfaces 16 PWM channels and 8 Programmable I/O (PIO) state machines USB 1.1 Host/Device controller with integrated PHY 12-channel DMA controller for efficient data transfer Operating voltage range of 1.8 V to 3.3 V Industrial temperature support up to -40°C to +85°C Compact 68-QFN package for space-constrained designs #W55RP20 #WIZnet #RP2040 #EthernetMCU #IoT #EmbeddedSystems #IndustrialAutomation #TCPIP #EthernetController #Microcontroller #HardwareTCPIP #Networking #EmbeddedDesign #SmartDevices #IoTDevelopment
4 Uses0 StarsNRF54L15-CAAA-R7
IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v5.4, Matter, Thread, Zigbee® 47-XFBGA, WLCSP # NRF54L15-CAAA-R7 ## General Description The NRF54L15-CAAA-R7 is an ultra-low-power wireless System-on-Chip (SoC) developed by [Nordic Semiconductor](https://www.nordicsemi.com?utm_source=chatgpt.com) for advanced Internet of Things (IoT), industrial, medical, smart home, and wireless sensing applications. The device integrates a high-performance Arm Cortex-M33 processor, a dedicated RISC-V coprocessor, large embedded memory resources, and a multiprotocol 2.4 GHz radio subsystem into a compact package. It is designed to provide exceptional energy efficiency, robust wireless connectivity, and enhanced security while supporting modern wireless standards including Bluetooth® Low Energy, Matter, Thread, Zigbee®, Bluetooth Mesh, Amazon Sidewalk, and proprietary 2.4 GHz protocols. The device is optimized for battery-powered applications requiring extended operating life, high processing capability, and scalable connectivity solutions. ## Key Features ### Processing Architecture * 128 MHz Arm® Cortex®-M33 application processor * Integrated 128 MHz RISC-V coprocessor * TrustZone® security architecture ### Memory Resources * 1.5 MB Non-Volatile Memory (NVM) * 256 KB RAM ### Wireless Connectivity * Multiprotocol 2.4 GHz RF transceiver * Bluetooth® Low Energy support * Matter support * Thread support * Zigbee® support * Bluetooth Mesh support * Amazon Sidewalk support * Proprietary 2.4 GHz protocol support * Bluetooth Channel Sounding capability * Compatible with Wi-Fi companion devices ### RF Performance * Data rates up to 4 Mbps * Output power up to +8 dBm * High receiver sensitivity for extended wireless range ### Security Features * Hardware cryptographic engine * Side-channel attack protection * Tamper detection mechanisms * Secure boot and secure firmware update support ### Peripheral Interfaces * SPI * I²C (TWI) * UART * I²S * GPIO * ADC * PWM * PDM * NFC * QDEC ### Power Characteristics * Ultra-low-power operation * Optimized sleep modes * Battery-powered application support * Operating supply voltage from 1.7 V to 3.6 V ### Package Information * WLCSP package * Surface-mount technology * Industrial operating temperature support ## Applications * Smart Home Devices * Industrial IoT Systems * Wearable Electronics * Medical and Healthcare Devices * Asset Tracking Solutions * Wireless Sensors * Building Automation Systems * Smart Lighting Controls * Consumer Electronics * Connected Peripheral Devices #NordicSemiconductor #nRF54L15 #NRF54L15CAAAR7 #BluetoothLE #Matter #Thread #Zigbee #IoT #WirelessSoC #EmbeddedSystems #IndustrialIoT #SmartHome #LowPowerDesign #CortexM33 #RISCV
9 Uses0 StarsSTM32MP157CAC3
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) # Engineering Specification ## Product Name STM32MP157CAC3 ## General Description STM32MP157CAC3 is a high-performance microprocessor unit that combines application processing and real-time control capabilities within a single integrated circuit. The device is designed to support advanced embedded systems requiring a balance of computing performance, deterministic control, multimedia processing, connectivity, and security functionality. The component integrates multi-core processing resources, memory interfaces, graphics capabilities, peripheral controllers, and communication subsystems to enable the development of sophisticated embedded platforms. Its heterogeneous architecture allows high-level operating systems and real-time firmware to operate simultaneously, supporting applications that require both user-interface functionality and low-latency control. The device is intended for industrial automation, human-machine interface systems, edge computing platforms, communication equipment, medical devices, smart infrastructure, and Internet of Things applications. Its architecture enables consolidation of system functions, reducing component count and simplifying overall hardware design. The design emphasizes processing efficiency, system scalability, power management, security, and long-term reliability. It supports advanced software ecosystems and facilitates the development of connected embedded products with graphical interfaces, networking capabilities, and real-time operational control. ## Functional Requirements ### Application Processing The device shall provide application-level processing capabilities suitable for operating systems, middleware, and user applications. ### Real-Time Processing The device shall support deterministic control functions for time-critical embedded operations. ### Multimedia Support The component shall support graphical and multimedia processing functions for display and user-interface applications. ### System Integration The device shall integrate processing, communication, and peripheral functions within a unified embedded computing platform. ## Electrical Requirements ### Power Management The device shall support efficient power operation and multiple power management modes to optimize energy consumption. ### Memory Interface Support The component shall support external memory devices for program execution, data storage, and system operation. ### Peripheral Connectivity The device shall provide interfaces for communication, control, monitoring, and external subsystem integration. ### Signal Integrity The design shall support reliable operation across supported interface standards and operating conditions. ## Processing Architecture Requirements ### Multi-Core Operation The device shall support concurrent execution of application and real-time workloads through integrated processing resources. ### Operating System Support The architecture shall support embedded operating systems and software frameworks suitable for advanced application development. ### Security Features The device shall support hardware-based mechanisms intended to protect system integrity, software assets, and sensitive data. ### Resource Management The component shall support efficient allocation of processing, memory, and peripheral resources. ## Mechanical Requirements ### Surface Mount Construction The device shall be supplied in a high-density surface mount package suitable for automated manufacturing processes. ### PCB Integration The package shall support integration into multilayer printed circuit boards designed for high-performance embedded systems. ### Structural Integrity The device shall maintain electrical and mechanical reliability during assembly and operational service life. ## Environmental Requirements ### Operating Conditions The component shall operate reliably within environmental conditions commonly encountered in industrial and embedded applications. ### Thermal Performance The device shall support stable operation under sustained processing workloads and associated thermal conditions. ### Storage and Handling The component shall maintain physical and electrical integrity during transportation, storage, and manufacturing processes. ## Quality Requirements ### Reliability The device shall provide dependable long-term operation in embedded and industrial computing environments. ### Verification Processing, peripheral, communication, and system functions shall be validated through applicable testing and qualification procedures. ### Compliance The product shall conform to relevant semiconductor, quality, and embedded computing standards applicable to its intended use. ## Documentation Requirements Technical documentation shall include processor architecture information, hardware integration guidelines, memory interface recommendations, power management considerations, software development support, security features, and application design guidance. ## Classification Tags #STM32MP157CAC3 #STM32MP1 #Microprocessor #MPU #EmbeddedProcessor #ARMProcessor #EmbeddedLinux #RealTimeControl #IndustrialAutomation #HumanMachineInterface #EdgeComputing #IoTGateway #EmbeddedSystems #SystemOnChip #SoC #ApplicationProcessor #GraphicsProcessor #ConnectivityPlatform #IndustrialElectronics #PCBDesign #HardwareDevelopment #ElectricalEngineering #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #SystemIntegration #SecureEmbeddedSystems #MulticoreProcessing
9 Uses0 StarsLR2021IMLTRT
IC RF TxRx Only General ISM > 1GHz LoRaWAN 32-VFQFN Exposed Pad LR2021IMLTRT is a fourth-generation, long-range, low-power, multi-band LoRa® RF transceiver from Semtech, designed for IoT, LPWAN, satellite communication, smart metering, industrial automation, asset tracking, and wireless sensor networks. It supports operation across sub-GHz and 2.4 GHz frequency bands, offering excellent receiver sensitivity, high transmit power, and compatibility with multiple wireless protocols including LoRaWAN®, Bluetooth® LE PHY, Zigbee™, Thread®, Amazon Sidewalk, and Wi-SUN. Key Features Multi-band operation: 150 MHz to 960 MHz and 1.5 GHz to 2.5 GHz Supports LoRa®, LoRaWAN®, LR-FHSS, FLRC, FSK, GFSK, GMSK, MSK, OOK, and O-QPSK Maximum data rate up to 2.6 Mbps High receiver sensitivity up to -141.5 dBm (LoRa mode) Transmit power up to +22 dBm (sub-GHz) Compatible with Bluetooth® LE 5.0 PHY, Thread®, Zigbee™, Amazon Sidewalk, Sigfox, Wi-SUN, and Z-Wave® Ultra-low power consumption with 470 nA sleep current Operating voltage range: 1.8 V to 3.7 V SPI interface with programmable GPIOs Operating temperature range: -40°C to +85°C Compact 32-pin QFN (5 mm × 5 mm) package for space-constrained designs. Hashtags #Semtech #LR2021IMLTRT #LoRa #LoRaWAN #RFTransceiver #WirelessCommunication #IoT #LPWAN #BluetoothLE #Zigbee #Thread #WiSUN #AmazonSidewalk #AssetTracking #SmartMetering #IndustrialIoT #SatelliteCommunication #LowPowerDesign #EmbeddedSystems #RFIC
11 Uses0 Stars2286550-1
2286550-1 is a TE Connectivity Automotive HSD (High-Speed Data) hybrid connector header designed for high-speed data transmission in automotive applications. It is a shielded, right-angle PCB-mounted connector that combines HSD and MQS contacts, making it suitable for Ethernet, LVDS, USB, camera, infotainment, and other vehicle data communication systems. The connector features a 100 Ω controlled impedance design for reliable signal integrity in demanding automotive environments. Key Features Automotive HSD+2MQS hybrid header connector 6-position interface with A-coding Right-angle (horizontal) PCB mounting Board-to-board and wire-to-board connectivity Shielded construction for EMI protection 100 Ω impedance for high-speed data transmission Through-hole solder termination Operating voltage up to 60 VDC Maximum current rating: 2.5 A Operating frequency range: 0 to 3 GHz Gold-plated signal contacts for reliable performance Operating temperature range: -40°C to +105°C Reflow soldering capable Designed for automotive signal applications #CommonPartsLibrary #Connector #TEConnectivity #AutomotiveConnector #HSDConnector #DataConnectivity #HighSpeedData #AutomotiveEthernet #WireToBoard #BoardToBoard #ShieldedConnector #PCBConnector #AutomotiveElectronics #22865501
1 Uses0 StarsZ84C2006PEG
Interface - Specialized Z84C2006PEG PDIP-40_L52.3-W13.8-P2.54-LS15.2-BL LCSC Part Number: C2614542 JLCPCB Part Class: Extended Part Manufactured by Zilog Z84C00 / Z84C0008PEC PDIP-40 Zilog Z80 microprocessor family, fourth-generation enhanced 8-bit CPU architecture with high computational performance and efficient memory utilization. Features two complete sets of general-purpose registers (main and alternate register banks) for fast context switching, two 16-bit index registers (IX and IY), stack pointer, program counter, refresh register, and interrupt register. Supports a single +5V power supply and interfaces directly with standard memory and peripheral devices. Includes advanced interrupt handling, daisy-chain interrupt capability, and built-in dynamic RAM refresh support. Widely used in industrial control systems, embedded equipment, terminals, instrumentation, retro computers, and communication devices. Search Keywords: Z80 CPU, Zilog Z80, Z84C00, Z8400, 8-bit microprocessor, enhanced Z80 processor, DIP40 CPU, CMOS Z80, NMOS Z80, embedded processor, industrial controller CPU, retro computer processor, vintage microprocessor, dynamic RAM refresh CPU, interrupt controller compatible CPU Hashtags: #Z80 #Zilog #Z84C00 #Z8400 #8BitCPU #Microprocessor #EmbeddedSystems #IndustrialElectronics #RetroComputing #VintageComputing #DIP40 #ComputerArchitecture #DigitalElectronics #CPU #ClassicComputing
0 Uses0 StarsZ84C0006PEG
Zilog Z80 microprocessor family, fourth-generation enhanced 8-bit CPU architecture with high computational performance and efficient memory utilization. Features two complete sets of general-purpose registers (main and alternate register banks) for fast context switching, two 16-bit index registers (IX and IY), stack pointer, program counter, refresh register, and interrupt register. Supports a single +5V power supply and interfaces directly with standard memory and peripheral devices. Includes advanced interrupt handling, daisy-chain interrupt capability, and built-in dynamic RAM refresh support. Widely used in industrial control systems, embedded equipment, terminals, instrumentation, retro computers, and communication devices. Search Keywords: Z80 CPU, Zilog Z80, Z84C00, Z8400, 8-bit microprocessor, enhanced Z80 processor, DIP40 CPU, CMOS Z80, NMOS Z80, embedded processor, industrial controller CPU, retro computer processor, vintage microprocessor, dynamic RAM refresh CPU, interrupt controller compatible CPU Hashtags: #Z80 #Zilog #Z84C00 #Z8400 #8BitCPU #Microprocessor #EmbeddedSystems #IndustrialElectronics #RetroComputing #VintageComputing #DIP40 #ComputerArchitecture #DigitalElectronics #CPU #ClassicComputingMicroprocessors - MPU 6MHz Z80 CMOS CPU XT
3 Uses0 StarsMCP4461-103E/ST
Digital Potentiometer 10k Ohm 4 Circuit 257 Taps I2C Interface 20-TSSOP # Engineering Specification ## Product Name MCP4461-103E/ST ## General Description MCP4461-103E/ST is a non-volatile digital potentiometer integrated circuit designed to provide electronically programmable resistance adjustment for analog and mixed-signal applications. The device enables precise digital control of resistance values through a serial communication interface, eliminating the need for manual potentiometer adjustments and enhancing system automation capabilities. The component integrates multiple resistor networks, non-volatile memory, and digital control logic within a compact package, making it suitable for signal conditioning, gain adjustment, calibration, offset trimming, volume control, and configuration management applications. The design supports reliable operation in embedded systems, industrial electronics, instrumentation equipment, communication devices, and consumer products requiring programmable analog control. The device is optimized for ease of integration, low power consumption, repeatable performance, and long-term reliability. Non-volatile memory functionality allows resistance settings to be retained during power interruptions, supporting consistent system behavior and simplified startup configuration. ## Functional Requirements ### Digital Resistance Control The device shall provide programmable resistance adjustment through a digital communication interface. ### Non-Volatile Memory Operation The device shall retain programmed resistance settings when power is removed and restore stored values upon power-up. ### Multi-Channel Adjustment The device shall support independent control of multiple resistance channels for flexible system configuration. ### Analog Signal Conditioning The device shall support use in gain control, calibration, bias adjustment, offset correction, and signal tuning applications. ## Electrical Requirements ### Power Supply Compatibility The device shall operate from standard low-voltage electronic power supply rails suitable for embedded and industrial systems. ### Digital Communication The device shall support serial communication for configuration, programming, and control of internal resistance networks. ### Resistance Network Performance The device shall provide repeatable and stable resistance adjustment characteristics throughout normal operating conditions. ### Low Power Operation The device shall minimize power consumption while maintaining functional performance and memory retention capability. ### Noise and Signal Integrity The design shall support accurate analog signal processing with minimal impact on system performance. ## Mechanical Requirements ### Package Construction The component shall be supplied in a surface-mount package suitable for automated PCB assembly processes. ### Board Integration The device shall support standard printed circuit board mounting practices and electronic manufacturing workflows. ### Structural Reliability The package shall maintain electrical and mechanical integrity during handling, assembly, and operational service. ## Environmental Requirements ### Operating Environment The device shall operate reliably within environmental conditions commonly encountered in commercial and industrial electronic equipment. ### Storage Conditions The component shall maintain functional and physical integrity during storage, transportation, and inventory management activities. ### Environmental Robustness The design shall support stable operation under expected temperature and humidity variations within specified application environments. ## Quality Requirements ### Reliability The device shall provide consistent long-term performance with stable resistance characteristics and memory retention capability. ### Verification Electrical functionality, communication performance, memory operation, and resistance adjustment behavior shall be validated through applicable testing procedures. ### Compliance The product shall conform to relevant semiconductor manufacturing, quality assurance, and electronic component standards. ## Documentation Requirements Technical documentation shall include device functionality, communication interface requirements, programming guidelines, application recommendations, electrical characteristics, package information, and reliability considerations. ## Classification Tags #MCP4461 #MCP4461103EST #DigitalPotentiometer #NonVolatileMemory #IntegratedCircuit #ICComponent #AnalogElectronics #MixedSignalDesign #SignalConditioning #GainControl #CalibrationCircuit #EmbeddedSystems #ElectronicComponents #ElectricalEngineering #PCBDesign #CircuitDesign #IndustrialElectronics #Instrumentation #CommonPartsLibrary #EngineeringSpecification #ComponentLibrary #TechnicalDocumentation #SystemIntegration #HardwareDevelopment #ReliabilityEngineering
1 Uses0 StarsIR0505S
Isolated Module DC DC Converter 2 Output 5V -5V 300mA 4.5V - 5.5V Input # Engineering Specification ## Product Name IR0505S ## General Description IR0505S is an isolated power conversion module designed to provide reliable DC-to-DC power conversion for electronic and embedded systems requiring galvanic isolation between input and output circuits. The device is intended for use in industrial control equipment, communication systems, instrumentation, automation platforms, and other electronic applications where stable power delivery and electrical isolation are essential. The module incorporates integrated switching and isolation technologies to support efficient power transfer while reducing system complexity and board-level design effort. Its compact form factor allows straightforward integration into printed circuit board assemblies and power distribution architectures. The design emphasizes operational reliability, electrical safety, electromagnetic compatibility, and long-term performance in demanding environments. ## Functional Requirements ### Power Conversion The module shall convert input DC power to an isolated DC output suitable for downstream electronic circuits and subsystems. ### Electrical Isolation The module shall provide galvanic isolation between input and output domains to reduce the propagation of electrical noise, ground loops, and fault conditions. ### Operational Stability The module shall maintain stable output characteristics during normal operating conditions and expected load variations. ### System Integration The module shall support integration into embedded, industrial, and communication systems through standard electrical interfaces and assembly practices. ## Electrical Requirements ### Input Characteristics The device shall accept DC input power within the specified operating range and maintain reliable operation throughout normal conditions. ### Output Characteristics The device shall provide regulated isolated output power suitable for electronic loads requiring stable voltage and current delivery. ### Protection Features The design shall incorporate protective characteristics to support safe operation during abnormal electrical conditions and transient events. ### Noise Performance The module shall minimize conducted and radiated electrical noise to support compatibility with sensitive electronic circuits. ## Mechanical Requirements ### Package Construction The module shall utilize a compact package suitable for direct PCB mounting and automated assembly processes. ### Structural Integrity The assembly shall withstand normal handling, installation, transportation, and operational stresses without degradation of performance. ### Maintainability The device shall support replacement and servicing through standard electronic maintenance procedures. ## Environmental Requirements ### Operating Environment The module shall perform reliably within the environmental conditions specified for industrial and commercial electronic applications. ### Storage Conditions The product shall maintain functional integrity during storage and transportation when handled according to recommended practices. ## Quality Requirements ### Reliability The module shall be designed for dependable long-term operation with consistent electrical performance throughout its intended service life. ### Verification Electrical, mechanical, and environmental characteristics shall be validated through applicable inspection, testing, and qualification procedures. ### Compliance The product shall conform to applicable safety, quality, and manufacturing standards relevant to isolated power conversion devices. ## Documentation Requirements Supporting documentation shall include product identification, electrical characteristics, application guidance, installation recommendations, safety information, and maintenance considerations. ## Classification Tags #IR0505S #DCDCConverter #IsolatedPowerSupply #PowerModule #CommonPartsLibrary #IntegratedCircuit #PowerElectronics #ElectronicComponents #ElectricalEngineering #EmbeddedSystems #IndustrialAutomation #PowerManagement #CircuitDesign #PCBDesign #SystemIntegration #EngineeringSpecification #TechnicalDocumentation #ReliabilityEngineering #ElectronicHardware #ComponentLibrary
0 Uses0 Stars2.54mm-8P ZZ
CONN HEADER TH 8POS 2.5mm 2.54mm-8P ZZ is a through-hole wire-to-board header connector from the XH-style connector family. It features a single-row 8-position configuration with approximately 2.5 mm pitch spacing, making it suitable for power and signal connections in consumer electronics, industrial controls, LED modules, battery systems, and embedded electronics. The connector is designed for PCB mounting and provides a reliable, low-cost interconnect solution for cable assemblies. Key Features Single-row 8-position (1×8) connector 2.5 mm / 2.54 mm pitch wire-to-board interface Through-hole PCB mounting Compatible with XH-series style housings Rated up to 3 A current Rated up to 250 V Tin-plated brass contacts for reliable conductivity UL94V-0 flame-retardant housing material Operating temperature range: -25°C to +85°C Suitable for power distribution and signal connections in electronic equipment Hashtags #Connector #WireToBoard #XHConnector #2_54mmPitch #ThroughHole #PCBConnector #8PinConnector #ElectronicComponents #Interconnect #EmbeddedSystems #IndustrialElectronics #PowerConnector #SignalConnector #RoHSCompliant
4 Uses0 Stars
