Interface ICs

14-Bit 1 GSPS High-Speed Pipeline Analog-to-Digital Converter (ADC) – High-performance ADC designed for software-defined radios (SDR), radar systems, communications equipment, satellite receivers, instrumentation, signal intelligence, wideband data acquisition, and high-speed embedded processing. The Analog Devices AD9690BCPZ-1000 provides 14-bit resolution with a maximum sampling rate of 1 GSPS, using a differential analog input and JESD204B serial digital output for high-speed connection to an FPGA or other high-performance digital processing device. It supports an approximately 2 GHz full-power analog input bandwidth, programmable differential input termination of 50 Ω, 100 Ω, 200 Ω, or 400 Ω, an integrated voltage reference, differential clock input, and flexible JESD204B lane configurations. At 1 GSPS, typical total power consumption is around 2 W. The device also includes two integrated wideband digital processing paths, including NCO and cascaded half-band filtering, which can reduce the amount of data that needs to be processed downstream. The AD9690BCPZ-1000 uses a 64-lead LFCSP package (9 × 9 mm), operates over −40°C to +85°C, and is listed by DigiKey as active. It is particularly well suited for systems where a high-speed ADC needs to interface directly with an FPGA through JESD204B, such as the AMD Kintex UltraScale+ FPGA you provided earlier.

6-Axis Inertial Measurement Unit (IMU) with Embedded Sensor Fusion and AI Features – Advanced motion-sensing IC combining a 3-axis digital accelerometer and 3-axis digital gyroscope, designed for wearables, TWS earbuds, smartphones, gaming devices, robotics, IoT products, motion tracking, vibration detection, and low-power embedded applications. The STMicroelectronics LSM6DSV16BXTR also includes an integrated temperature sensor and supports I²C, I3C, and SPI digital interfaces. The device features triple accelerometer and gyroscope channels, embedded sensor-fusion processing (SFLP), a Machine Learning Core (MLC), Finite State Machine (FSM), adaptive self-configuration, and Qvar sensing, enabling advanced motion classification, gesture detection, orientation tracking, power management, and AI-assisted sensor processing. Its high-performance motion-tracking mode can operate at approximately 0.6 mA, supporting always-on low-power applications. The LSM6DSV16BXTR uses a compact 14-pin LGA package measuring 2.5 × 3.0 × 0.74 mm, supports −40°C to +85°C operation, and is an active, volume-production device. #STMicroelectronics #LSM6DSV16BXTR #LSM6DSV16BX #IMU #Accelerometer #Gyroscope #MotionSensor #SensorFusion #MachineLearningCore #MLC #IoT #Wearables #TWS #Robotics #EmbeddedSystems

Single-chip IEEE 802.11a/b/g/n/ac 2T2R RF/WLAN network-interface controller with USB 2.0 and USB 3.0 host interfaces, in a 9 × 9 mm QFN-76 exposed-pad package.

16-S automotive precision battery monitor, balancer and integrated protector with ASIL-D compliance Battery monitor, balancer, and hardware protector designed to measure and monitor 6S to 16S battery modules in automotive battery management systems. The BQ79616-Q1 provides ±1.5 mV ADC accuracy, measures all cell channels within 128 µs, supports internal cell balancing up to 240 mA, and provides isolated differential daisy-chain communication with UART/SPI host interface support. It is housed in a 64-pin HTQFP package measuring 10 mm × 10 mm. #TexasInstruments #BQ79616Q1 #BatteryMonitor #BMS #BatteryManagement

Connector Header Through Hole 10 position 0.050" pin header 2x5 1.27mm The Harwin M50-3500542 is a 1.27 mm pitch (0.05") 2×5 male pin header from the Harwin Archer M50 series, designed for board-to-board or cable-to-board interconnections. It is a through-hole, vertical PCB connector commonly used in embedded systems, debug interfaces (SWD/JTAG), and compact electronics where high-density signal routing is required. This connector provides a reliable low-profile interconnect solution with gold-plated contacts for good signal integrity and durability in industrial environments. Key Features Connector Type 2×5 (10-position) male pin header Dual-row configuration Pitch 1.27 mm (0.05") fine pitch for high-density PCB layouts Mounting Type Through-hole vertical PCB mount Contact Type Male square pins (0.4 mm typical) Electrical Rating Up to 1A per contact Contact Plating Gold plated mating area Tin plated tail for soldering Operating Temperature -40 °C to +105 °C Housing Material High-temperature thermoplastic (UL94 V-0 rated) Stacking / Mating Heights Multiple height options (approx. 3.2 mm to 6.2 mm) for flexible board stacking Compact Design Designed for high-density embedded PCB layouts Typical Applications ARM Cortex SWD / JTAG debug headers Embedded development boards Board-to-board mezzanine connections Industrial control electronics Compact IoT and MCU systems #CommonPartsLibrary #Connector #Header

Multiphase Motor Driver NMOS PWM, SPI 24-WQFN (3x3) Three-phase PWM motor driver designed to drive three-phase brushless DC motors using three integrated MOSFET half-bridges. The DRV8311P operates from 3–20 V, supports up to 5-A peak output current and 200-kHz PWM frequency, and provides a 10-MHz SPI/tSPI interface, integrated current sensing, and a 3.3-V, 100-mA LDO regulator in a 24-pin 3 × 3-mm WQFN package. #MotorDriver #BLDC #PWM #SPI #TexasInstruments

FRAM (Ferroelectric RAM) Memory IC 2Mbit SPI 40 MHz 8-SOIC 2-Mbit Serial F-RAM (Ferroelectric RAM) provides nonvolatile data storage organized as 256K × 8 bits and accessed through a high-speed SPI interface supporting up to 40 MHz and SPI modes 0 and 3. It operates from 2.0 V to 3.6 V over an industrial temperature range of −40°C to +85°C and is available in 8-pin SOIC and DFN packages. #F-RAM #SPI #NonvolatileMemory #Infineon

Battery Battery Monitor IC Lithium Ion 8-WLP (1.66x0.92) Battery fuel gauge IC that provides ModelGauge™ state-of-charge estimation for single-cell lithium-ion batteries without requiring a current-sense resistor. It operates over a 2.5 V to 4.5 V supply range, communicates through an I²C interface, measures battery voltage, and reports state of charge and voltage while consuming a typical operating current of 23 µA and a 0.3 µA shutdown current. #BatteryFuelGauge #FuelGaugeIC #BatteryManagement #SingleCellLiIon #ModelGauge #I2C #AnalogDevices #MaximIntegrated #PowerManagement #VoltageMonitoring

Telecom IC Ethernet 56-VQFN (7x7) An Ethernet PHY transceiver that provides a single-port physical layer interface for 10BASE-Te, 100BASE-TX, 1000BASE-T, and 2.5GBASE-T Ethernet networks. It supports SGMII, MDIO, SPI, UART, and GPIO interfaces, operates from 3.3 V and 1.0 V supply rails, and is housed in a 56-pin VQFN (7 mm × 7 mm) package. #EthernetPHY #EthernetTransceiver #2_5GBASE_T #1000BASE_T #100BASE_TX #10BASE_T #SGMII #MDIO #SPI #VQFN56

Power Barrel Connector Jack 2.50mm ID (0.098"), 5.50mm OD (0.217") Through Hole, Right Angle DC power jack designed to provide a through-hole interface for external DC power input. It features a 2.0 mm center pin, 6.5 mm mating diameter, right-angle through-hole mounting, and is rated for 2 A and 24 VDC, with an operating temperature range of -25°C to +85°C. #DCPowerJack #BarrelJack #PowerConnector #ThroughHole #SameSkyDevices