Interface ICs
An interface IC is a type of integrated circuit that is designed to facilitate communication between two devices or systems. These devices are commonly used in electronic systems to enable the transfer of data and control signals between different components or subsystems. Some common use cases for interface ICs include connecting microcontrollers to peripherals such as sensors or displays, linking multiple processors together in a network, and enabling communication between devices using different communication protocols. Flux.ai has the world's largest community-driven public library of interface ICs, with footprints, symbols, datasheets, and simulation models. This library is a valuable resource for engineers and designers who need access to accurate and up-to-date information on these important components. Whether you are working on a new design project or simply looking to learn more about interface ICs, Flux.ai is an excellent resource to help you find the information you need.
E22-900M22S
868/915MHz SPI SMD LoRa Module E22-900M22S is a compact, industrial-grade LoRa® wireless transceiver module developed by Ebyte, based on the Semtech SX1262 RF chipset. Operating in the 868/915 MHz ISM band, it communicates through an SPI interface and is designed for long-range, low-power wireless data transmission. The module offers excellent receiver sensitivity, strong anti-interference performance, and supports both LoRa and FSK modulation, making it suitable for smart metering, industrial automation, IoT sensor networks, remote monitoring, and wireless control applications. Key Features Based on the Semtech SX1262 LoRa transceiver Operates in the 850–930 MHz frequency range (optimized for 868/915 MHz ISM bands) SPI interface with data rates up to 10 Mbps Maximum transmit power of +22 dBm (160 mW) Receiver sensitivity up to −147 dBm (LoRa mode) Supports LoRa and FSK modulation Programmable air data rate up to 62.5 kbps (LoRa) and 300 kbps (FSK) Long communication range of up to 7 km under ideal line-of-sight conditions Wide operating voltage: 1.8 V to 3.7 V (3.3 V recommended) Ultra-low receive current (~6.8 mA) and low sleep current Industrial operating temperature: −40°C to +85°C Compact 20 × 14 × 2.8 mm SMD package with castellated pads/IPEX antenna options Suitable for IoT, AMI, smart home, industrial sensors, wireless alarms, and remote control systems. #Ebyte #E22Series #E22900M22S #SX1262 #LoRa #WirelessModule #SubGHz #SPI #IoT #IndustrialAutomation #SmartMetering #RemoteMonitoring #EmbeddedSystems #RFModule
87 Uses0 StarsPESD5V0L4UG,115
13V Clamp 2.5A (8/20µs) Ipp Tvs Diode Surface Mount 5-TSSOP The PESD5V0L4UG,115 is a low-capacitance, unidirectional quad-channel Electrostatic Discharge (ESD) protection diode array from Nexperia. It is designed to protect up to four high-speed signal or data lines from ESD events and other transient voltage spikes while maintaining excellent signal integrity due to its low junction capacitance. Packaged in a compact SOT-353 (SC-88A/5-TSSOP) surface-mount package, it is well suited for space-constrained electronic designs, including communication equipment, portable devices, computers, and consumer electronics. Key Features Quad-channel unidirectional ESD protection for up to 4 signal lines 5 V reverse standoff voltage (VRWM) suitable for 5 V interfaces Low junction capacitance (~16 pF typ.) to minimize signal distortion Low clamping voltage (13 V max.) for effective transient suppression Peak pulse power of 30 W IEC 61000-4-2 Level 4 ESD protection (up to ±20 kV) Ultra-low leakage current (typically 5 nA) Compact SOT-353 (SC-88A) surface-mount package Qualified to AEC-Q100 for automotive applications Ideal for protecting USB, communication interfaces, SIM card lines, audio/video ports, and other sensitive I/O circuits. #PESD5V0L4UG115 #Nexperia #ESDProtection #TVSDiode #TransientProtection #CircuitProtection #QuadChannel #LowCapacitance #AutomotiveGrade #SOT353 #SignalIntegrity #ElectronicsDesign
118 Uses0 StarsCMX973Q5
RF Demodulator IC 20MHz ~ 300MHz 32-VFQFN Exposed Pad The CMX973Q5 specification defines the engineering requirements for a radio frequency quadrature modulator integrated circuit designed for digital and analog wireless communication systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure accurate signal modulation, high RF performance, and long-term operational reliability. The device is intended for use in wireless communication equipment, telemetry systems, software-defined radio platforms, digital data transmission equipment, industrial RF systems, and embedded communication applications requiring high-performance I/Q modulation. It provides precise conversion of baseband in-phase and quadrature signals into modulated RF output while maintaining excellent signal integrity, low distortion, and stable operation over a wide range of operating conditions. Engineering Requirements The RF modulator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical characteristics, reliable modulation accuracy, and dependable long-term performance. The device shall maintain stable operation under specified supply voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate in-phase and quadrature signal processing, low phase imbalance, high linearity, low noise, and excellent carrier suppression. The device shall maintain stable RF output characteristics and predictable modulation performance throughout continuous operation while minimizing harmonic distortion and unwanted spurious emissions. The integrated RF architecture shall support efficient signal conversion and reliable interface with external oscillators, filters, and communication circuitry. The device shall preserve signal integrity across the specified operating frequency range while supporting high-quality modulation for digital and analog communication protocols. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, plating irregularities, or structural inconsistencies that could adversely affect RF performance or reliability. Inspection, validation, and testing shall be performed using calibrated RF measurement equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, RF performance specifications, modulation characteristics, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #RFModulator #QuadratureModulator #WirelessCommunication #RFIC #SignalModulation #EmbeddedSystems #Telecommunications #QualityAssurance #EngineeringDocumentation
0 Uses0 StarsTXU0202DTTR
Voltage Level Translator Unidirectional 1 Circuit 2 Channel 200Mbps 8-X1SON (1.95x1) The TXU0202DTTR specification defines the engineering requirements for a dual-bit voltage level translator integrated circuit designed for bidirectional logic-level conversion between digital interfaces operating at different supply voltages. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable signal translation, high-speed communication, and long-term operational stability in embedded electronic systems. The device is intended for use in embedded controllers, microprocessor and microcontroller systems, communication interfaces, industrial automation equipment, consumer electronics, and portable devices requiring voltage compatibility between digital subsystems. It enables seamless signal transfer while preserving logic integrity, minimizing propagation delay, and supporting low-power operation in compact electronic designs. Engineering Requirements The voltage level translator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate bidirectional logic-level translation with low propagation delay, high noise immunity, and reliable input and output switching performance. The device shall maintain signal integrity during continuous operation, power sequencing, and dynamic switching conditions without introducing excessive distortion or timing errors. The integrated translation architecture shall support independent voltage domains while ensuring reliable communication between connected digital devices. The device shall maintain stable performance across varying supply voltages and logic frequencies while minimizing leakage current and preserving overall system efficiency. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect functionality or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, timing diagrams, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #VoltageLevelTranslator #LogicLevelShifter #DigitalInterface #EmbeddedSystems #Semiconductor #SignalIntegrity #IndustrialElectronics #QualityAssurance #EngineeringDocumentation
19 Uses0 StarsMCP3204-CI/SL
12 Bit Analog to Digital Converter 2, 4 Input 1 SAR 14-SOIC The MCP3204-CI/SL specification defines the engineering requirements for a multi-channel analog-to-digital converter integrated circuit designed to provide high-accuracy conversion of analog signals into digital data for embedded electronic systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure precise signal acquisition, reliable data conversion, and long-term operational stability. The device is intended for use in embedded control systems, industrial automation, instrumentation, data acquisition equipment, sensor interfaces, medical electronics, and portable devices requiring accurate analog signal measurement. It supports multiple analog input channels and serial digital communication, enabling efficient integration with microcontrollers and digital processing systems. Engineering Requirements The analog-to-digital converter shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent conversion accuracy, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental conditions. Electrical characteristics shall provide accurate analog-to-digital conversion with low noise, excellent linearity, and stable reference performance. The converter shall maintain repeatable sampling characteristics and consistent digital output while supporting reliable serial communication with compatible host controllers. The conversion architecture shall provide predictable sampling behavior, low conversion error, and reliable channel selection while maintaining signal integrity throughout the specified operating range. The device shall support continuous and intermittent data acquisition without degradation of conversion performance. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical characteristics and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of functionality. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, timing diagrams, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #AnalogToDigitalConverter #ADC #DataAcquisition #SignalConditioning #EmbeddedSystems #IndustrialElectronics #Semiconductor #QualityAssurance #EngineeringDocumentation
2 Uses0 StarsTS3USB221DRCR
USB Switch IC 2 Channel 10-VSON (3x3) The TS3USB221DRCR specification defines the engineering requirements for a high-speed USB analog switch integrated circuit designed for signal routing and interface switching in embedded electronic systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable high-speed signal transmission, low insertion loss, and long-term operational stability. The device is intended for use in USB interface switching, portable electronics, embedded controllers, communication equipment, docking stations, and multimedia systems requiring high-speed differential signal routing. It enables seamless switching between USB data paths while maintaining signal integrity, minimizing propagation delay, and supporting reliable operation in compact, high-performance electronic designs. Engineering Requirements The analog switch shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent switching performance, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental conditions. Electrical characteristics shall provide low on-resistance, low capacitance, minimal insertion loss, and excellent channel-to-channel matching to preserve high-speed USB signal integrity. The device shall support reliable differential signal switching with minimal distortion, low propagation delay, and low crosstalk during continuous operation. The switching architecture shall provide dependable channel selection, high isolation between signal paths, and predictable switching behavior during power-up, power-down, and dynamic operating conditions. The device shall maintain stable electrical performance while minimizing electromagnetic interference and signal degradation. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand vibration, thermal cycling, mechanical handling, and environmental exposure without degradation of performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect electrical or mechanical reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #USBAnalogSwitch #HighSpeedSwitch #USBInterface #SignalIntegrity #EmbeddedSystems #Semiconductor #ElectronicDesign #QualityAssurance #EngineeringDocumentation
15 Uses0 StarsTAA3020IRTER
Audio 16 b, 20 b, 24 b, 32 b 768k I2C, I2S, TDM 20-WQFN (3x3) The TAA3020IRTER is a high-performance 2-channel audio analog-to-digital converter (ADC) from Texas Instruments, designed for professional and embedded audio applications. It supports up to two analog microphone/line inputs or four digital PDM microphone channels with simultaneous sampling. The device delivers excellent audio quality with a 104 dB dynamic range, supports sample rates up to 768 kHz, and integrates advanced audio processing features such as programmable gain, digital filters, automatic gain control (AGC), voice activity detection (VAD), and an integrated PLL. It communicates through an I²C control interface and supports I²S, TDM, and Left-Justified (LJ) digital audio formats, making it ideal for smart speakers, conferencing systems, IP cameras, and other high-performance audio acquisition systems. Key Features High-performance 2-channel audio ADC Supports 2 analog microphone/line inputs or 4 digital PDM microphone inputs 104 dB dynamic range (DR) and –95 dB THD+N Sampling rates from 8 kHz to 768 kHz Programmable microphone gain from 0 dB to 42 dB Digital volume control from –100 dB to +27 dB Integrated programmable HPF, biquad filters, and low-latency filter modes Built-in Automatic Gain Control (AGC) and Voice Activity Detection (VAD) Integrated audio PLL and programmable microphone bias supply Supports I²S, TDM, and Left-Justified (LJ) audio interfaces Configurable for 1.8 V or 3.3 V supply operation Available in a compact 20-pin WQFN (RTE) package Operating temperature range: –40°C to +105°C #AudioADC #TexasInstruments #TAA3020 #HighPerformanceADC #I2S #TDM #PDMMicrophone #AudioProcessing #AGC #VAD #EmbeddedAudio #ProfessionalAudio
0 Uses0 StarsDLVR-L10D-E1BD-C-NI3N
Pressure Sensor ±0.36PSI (±2.49kPa) Differential Male - 0.09" (2.24mm) Tube, Dual 14 b 8-DIP (0.620", 15.75mm), Dual Ports, Same Side The DLVR-L10D-E1BD-C-NI3N is a low-voltage, digital differential pressure sensor from Amphenol All Sensors' DLVR Series. It is designed to deliver highly accurate and temperature-compensated pressure measurements using proprietary CoBeam²™ sensing technology, which enhances long-term stability while minimizing package stress effects. The sensor features a 14-bit digital I²C output, operates from a 3.3 V supply, and measures differential pressures in the ±10 inH₂O range. Its compact through-hole DIP package with dual barbed ports makes it well suited for medical, HVAC, environmental monitoring, industrial control, and portable instrumentation applications. Key Features Differential pressure measurement: ±10 inH₂O 14-bit digital I²C interface 3.3 V low-voltage operation Proprietary CoBeam²™ MEMS technology for improved long-term stability Factory calibrated and temperature compensated Typical accuracy better than ±1% over temperature Dual barbed pressure ports (same-side orientation) Through-hole 8-pin DIP package Low-power operation suitable for battery-powered systems Designed for non-corrosive, non-ionic gases such as air and dry gases Ideal for medical breathing devices, HVAC, environmental monitoring, industrial automation, and portable equipment. #PressureSensor #DifferentialPressure #DigitalSensor #I2C #MEMS #AmphenolAllSensors #DLVRSeries #MedicalElectronics #HVAC #IndustrialAutomation #EnvironmentalMonitoring #EmbeddedSystems
2 Uses0 Stars
