Interface ICs

The SMBJ6.8CA is a bidirectional Transient Voltage Suppression (TVS) diode designed to protect sensitive electronic circuits from voltage transients caused by electrostatic discharge, lightning-induced surges, inductive load switching, and other transient events. It is commonly used in power supplies, communication interfaces, industrial control systems, automotive electronics, and consumer devices requiring robust overvoltage protection. The device utilizes avalanche breakdown technology to rapidly clamp transient voltages to safe levels, helping prevent damage to downstream components. Its bidirectional configuration makes it suitable for protecting AC lines and signal lines where voltage polarity may reverse. The SMB package provides a compact surface-mount solution with high surge-handling capability and excellent reliability for demanding environments. Features Bidirectional transient voltage suppression diode Fast response time to transient events High peak pulse power dissipation capability Low incremental surge resistance Excellent clamping performance Surface-mount SMB package Protection against ESD and lightning-induced surges Suitable for AC and bidirectional signal line protection RoHS-compliant and halogen-free options available from various manufacturers High reliability and long operational life Electrical Characteristics Reverse standoff voltage optimized for low-voltage applications Avalanche breakdown protection mechanism High peak surge current capability Low leakage current during normal operation Bidirectional voltage clamping characteristics Designed for transient suppression in accordance with industry surge standards Applications Power input protection Communication interfaces Industrial automation equipment Automotive electronic modules Consumer electronics Data and signal line protection Telecom equipment Embedded control systems Sensor interface protection Package Information Package Type: SMB (DO-214AA) Surface-mount technology Compact footprint for PCB integration Suitable for automated assembly processes #commonpartslibrary #semiconductor #tvsdiode #esdprotection #surgeprotection #circuitprotection #transientvoltagesuppressor #powerprotection #electronics #surfaceMountDevice #automotiveelectronics #industrialelectronics

SPI Flash Serial Flash Memory with Dual/Quad SPI The W25Q16JVUXIQ is a 16-Mbit (2-MByte) Serial NOR Flash memory device from Winbond. It is designed for embedded systems that require non-volatile code and data storage with minimal pin count, low power consumption, and high-speed access. The device supports standard SPI, Dual SPI, and Quad SPI interfaces, making it suitable for firmware storage, boot memory, IoT devices, microcontrollers, consumer electronics, and execute-in-place (XIP) applications. Key Features 16-Mbit (2-MByte) Flash Memory Capacity Operating Voltage: 2.7 V to 3.6 V Standard SPI, Dual SPI, and Quad SPI Interface Support Maximum SPI Clock Frequency: 133 MHz Equivalent Data Transfer Rates: 266 MHz (Dual SPI) 532 MHz (Quad SPI) Continuous Read and XIP (Execute-In-Place) Capability 4 KB Sector Erase, 32 KB Block Erase, 64 KB Block Erase, and Chip Erase 256-Byte Programmable Page Size Minimum 100,000 Program/Erase Cycles per Sector More Than 20 Years Data Retention Ultra-Low Power Consumption Typical power-down current below 1 µA 64-Bit Unique Serial Number Three 256-Byte Security Registers with OTP Protection JEDEC ID and SFDP Support Software and Hardware Write Protection Operating Temperature Options up to +85°C and +105°C Compact 8-Pad USON Package (2 mm × 3 mm) suitable for space-constrained designs #CommonPartsLibrary #IntegratedCircuit #Memory

CONN HEADER SMD R/A 3POS 1.25mm The SM03B-GHS-TB(LF)(SN) is a 3-pin, surface-mount, right-angle header connector that mates with JST GH-series wire housings. It provides a reliable, low-profile connection between a PCB and external wires using a crimp-style mating system. It belongs to the JST GH series, known for fine-pitch, compact connectors optimized for miniaturized electronics. 3-position connector (signal/power lines) 1.25 mm pitch for high-density PCB layout Surface-mount, right-angle (horizontal) mounting Shrouded header design for secure mating and alignment Locking ramp mechanism to prevent accidental disconnection Tin-plated contacts for reliable conductivity Lead-free / RoHS compliant (LF/SN finish) Current rating: ~1 A typical Voltage rating: ~50 V Operating temperature: approx. -25 °C to +85 °C 📦 Typical Applications Consumer electronics (wearables, IoT devices) Industrial control modules Robotics and sensor interfaces Battery-powered embedded systems Compact PCB interconnect systems #CommonPartsLibrary #Connector

M.2 CONN.P=0.5 6.7mm H conn The 91302-67-067R2M is a 67-position M.2 (NGFF) card-edge connector manufactured by UMAX. It is designed for connecting M.2 SSDs and PCIe-based expansion modules to a host PCB. The connector features an M-Key interface, making it suitable for high-speed PCIe storage applications such as NVMe solid-state drives. It is a surface-mount, right-angle receptacle with a 0.5 mm contact pitch and a 6.7 mm height above the PCB. Key Features M.2 M-Key connector Supports M-Key M.2 modules, commonly used for PCIe/NVMe SSDs. 67 contacts (67P) Standard pin count for M-Key M.2 card-edge connections. 0.5 mm pitch Fine-pitch design suitable for compact, high-density PCB layouts. Surface-mount, right-angle mounting Optimized for automated PCB assembly and low-profile system designs. 6.7 mm connector height Provides compatibility with standard M.2 card installation requirements. Female card-edge receptacle Accepts M.2 modules directly without additional adapters. RoHS compliant Meets environmental requirements for lead-free electronic assemblies. Typical Applications NVMe SSD sockets PCIe M.2 storage devices Embedded computing systems Industrial PCs Networking equipment Edge AI and IoT gateways Single-board computers requiring M.2 expansion #CommonPartsLibrary #Connector

Uni-directional 6.0 V TVS diode for transient voltage and ESD protection of sensitive electronics, I/O interfaces, VCC buses, power supplies, and consumer/portable equipment. Rated for 200 W peak pulse power (10/1000 µs), 6.0 V reverse stand-off voltage, 6.67–7.37 V breakdown voltage, 10.3 V maximum clamping voltage at 19.4 A, and 400 µA maximum reverse leakage at VR. Fast response (<1 ns typical) in a low-profile SOD-123FL surface-mount package. #TVSDiode #TransientProtection #ESDProtection #SurgeProtection #Littelfuse #SOD123FL

ESP32-S3-WROOM-1-N8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 processor, integrated 2.4 GHz Wi-Fi and Bluetooth 5 LE connectivity, 8 MB SPI flash memory, and a PCB antenna. The module is optimized for AIoT, edge computing, human-machine interfaces, smart devices, and industrial IoT applications. Key Features Dual-core Xtensa® LX7 CPU running up to 240 MHz for high-performance embedded applications. 8 MB onboard SPI Flash (N8 variant) for firmware and data storage. 2.4 GHz Wi-Fi (802.11 b/g/n) with data rates up to 150 Mbps. Bluetooth 5 LE support including: Long Range mode 2 Mbps PHY Bluetooth Mesh Extended Advertising AI acceleration support through ESP32-S3 vector instructions for machine learning and signal-processing workloads. USB 1.1 OTG and USB Serial/JTAG integrated, simplifying debugging and USB device applications. Up to 45 GPIOs with extensive peripheral support: SPI I²C I²S UART PWM ADC Touch Sensors TWAI® (CAN-compatible) Camera Interface LCD Interface SDIO Host MCPWM Integrated 40 MHz crystal oscillator, RF matching circuitry, and PCB antenna for reduced external component count. Operating voltage range: 3.0 V to 3.6 V. Compact surface-mount module suitable for space-constrained designs. Typical Applications Smart home and home automation devices HMI displays and touchscreen products Voice recognition and audio processing Edge AI and machine learning applications Industrial IoT gateways and sensors Video streaming and camera systems USB-connected embedded devices Smart agriculture and healthcare equipment N8 specifically indicates 8 MB Flash and no PSRAM, making it a good choice for applications requiring substantial program storage but not large external RAM. #RF-transceiver #Module #ESP32

Sensor Modules BME280 Environmental Sensor LGA-8_BME280_BL LCSC Part Number: C431940 JLCPCB Part Class: Extended Part Manufactured by Waveshare(微雪电子) Bosch BME280 combined digital humidity, barometric pressure and temperature environmental sensor, compact metal-lid LGA package with 2.5 x 2.5mm footprint and 0.93mm height, low power consumption for battery-powered devices, high accuracy humidity and pressure measurement, integrated temperature sensor for compensation and ambient temperature estimation, SPI and I2C interfaces, 1.71V to 3.6V sensor supply range, 1.2V to 3.6V interface supply range, sleep/normal/forced operating modes, current consumption down to 0.1µA in disabled state, suitable for indoor navigation, home automation, health care, GPS refinement and weather monitoring applications. Search Keywords: BME280, Bosch BME280, Bosch Sensortec BME280, BME280 environmental sensor, BME280 humidity pressure temperature sensor, BME280 barometric pressure sensor, BME280 temperature humidity sensor, BME280 I2C SPI sensor, BME280 LGA, 2.5x2.5mm sensor, low power environmental sensor, digital humidity sensor, digital pressure sensor, BMP280 compatible sensor, BME280 datasheet Hashtags: #BME280 #BoschBME280 #BoschSensortec #EnvironmentalSensor #HumiditySensor #PressureSensor #TemperatureSensor #BarometricPressureSensor #DigitalSensor #I2CSensor #SPISensor #LowPowerSensor #LGA8 #25x25mmSensor #IndoorNavigationSensor #WeatherSensor

ARM-MSeries LQFP-48(7x7) Microcontrollers (MCU/MPU/SOC) ROHS ST Microelectronics STM32G0B1CBT6 LQFP-48_L7.0-W7.0-P0.50-LS9.0-BL LCSC Part Number: C2847904 JLCPCB Part Class: Extended Part Manufactured by ST(意法半导体) STMicroelectronics STM32G0B1 series 32-bit Arm Cortex-M0+ microcontroller, up to 64MHz CPU frequency, 1.7V to 3.6V operating voltage, up to 512KB Flash memory and 144KB SRAM, USB 2.0 full-speed device/host support, USB Type-C Power Delivery controller, FDCAN, I2C, USART, SPI, HDMI CEC, 12-bit ADC, 12-bit DACs, timers, RTC, DMA, CRC unit, SWD debug interface, 96-bit unique ID, operating temperature options up to -40°C to +125°C, available in LQFP, UFQFPN, UFBGA and WLCSP packages. Search Keywords: STM32G0B1, STM32G0B1xB, STM32G0B1xC, STM32G0B1xE, STMicroelectronics STM32G0B1, STM32G0B1 MCU, STM32G0B1 microcontroller, Arm Cortex-M0+ microcontroller, STM32G0 64MHz MCU, STM32G0B1 USB Type-C PD, STM32G0B1 USB FS, STM32G0B1 FDCAN, STM32G0B1 512KB Flash, STM32G0B1 144KB SRAM, STM32G0B1 LQFP, STM32G0B1 UFQFPN, STM32G0B1 UFBGA, STM32G0B1 WLCSP, STM32G0B1 datasheet Hashtags: #STM32G0B1 #STM32G0B1xB #STM32G0B1xC #STM32G0B1xE #STMicroelectronics #STM32MCU #STM32G0 #ArmCortexM0Plus #32bitMicrocontroller #64MHzMCU #512KBFlashMCU #144KBSRAM #USBTypeCPD #USBFS #FDCAN #I2CMCU #SPIMCU #USARTMCU #ADCmicrocontroller #DACmicrocontroller #LQFP #UFQFPN #UFBGA #WLCSP

USB 3.1 Type-A Receptacle Connector – Surface-mount, right-angle USB connector designed for data communication and power connections in embedded systems, industrial controllers, and consumer electronics. The Korean Hroparts Elec U-A-39WD-W-1 (LCSC C3020886) features 9 contacts, supports the USB 3.1 interface, and has a 1.5 A current rating. It operates over a −40°C to +85°C temperature range. LCSC Electronics #KoreanHroparts #U-A-39WD-W-1 #C3020886 #USB31 #USBTypeA #USBConnector #SurfaceMount #EmbeddedSystems #PCBDesign

SPI Flash Memory with Dual/Quad SPI The W25Q128JV (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages. The W25Q128JV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128JV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q128JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 and I/O3. SPI clock frequencies of W25Q128JV of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories.  New Family of SpiFlash Memories – W25Q128JV: 128M-bit / 16M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1 – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1)  Highest Performance Serial Flash – 133MHz Single, Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles per sector – More than 20-year data retention  Efficient “Continuous Read” – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – <1µA Power-down (typ.) – -40°C to +85°C operating range – -40°C to +105°C operating range Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4K/32K/64K-Byte) – Program 1 to 256 byte per programmable page – Erase/Program Suspend & Resume  Advanced Security Features – Software and Hardware Write-Protect – Power Supply Lock-Down – Special OTP protection – Top/Bottom, Complement array protection – Individual Block/Sector array protection – 64-Bit Unique ID for each device – Discoverable Parameters (SFDP) Register – 3X256-Bytes Security Registers with OTP locks – Volatile & Non-volatile Status Register Bits  Space Efficient Packaging – 8-pin SOIC 208-mil – 16-pin SOIC 300-mil (additional /RESET pin) – 8-pad WSON 6x5-mm / 8x6-mm – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array) – 24-ball WLCSP – Contact Winbond for KGD and other options #CommonPartsLibrary #IntegratedCircuit #Memory