Crystals

25 MHz TCXO HCMOS Oscillator 3.3V Enable/Disable 4-SMD, No Lead ASTX-H12 25.000 MHz Abracon ASTX-H12 HCMOS output SMD TCXO, 2.5 x 2.0 x 0.9mm package, 3.2MHz to 55MHz frequency range, standard frequencies 5MHz to 44MHz, 3.3V typical supply voltage, frequency stability up to ±2.5ppm over temperature, ±2.0ppm tolerance at 25°C, low current consumption, 15pF load, 5ns max rise/fall time, tri-state standby function, MSL-1, RoHS/RoHS II compliant, suitable for cellular phones, wireless modules, GPS, RF communication and precision clock reference applications. Search Keywords: ASTX-H12, Abracon ASTX-H12, ASTX-H12 TCXO, HCMOS TCXO, SMD TCXO 2.5x2.0mm, 3.3V TCXO, 26MHz TCXO, 40MHz TCXO, 3.2MHz to 55MHz TCXO, low power TCXO, precision clock oscillator, RF reference oscillator, GPS TCXO, wireless module TCXO, ASTX-H12 datasheet Hashtags: #ASTXH12 #AbraconASTXH12 #TCXO #HCMOSTCXO #SMDOscillator #CrystalOscillator #TemperatureCompensatedOscillator #33VTCXO #25x20mmOscillator #PrecisionClock #FrequencyReference #RFOscillator #GPSOscillator #WirelessClock

27.12 MHz ±10ppm Crystal 10pF 50 Ohms 4-SMD, No Lead # 7M-27.120MEEQ-T Crystal Unit Engineering Specification ## General Description The 7M-27.120MEEQ-T is a surface-mount quartz crystal resonator designed to provide a stable and accurate frequency reference for digital, wireless, communication, NFC, RFID, microcontroller, and embedded system applications. Manufactured by TXC Corporation, this crystal offers reliable frequency stability, low equivalent series resistance, and compact packaging suitable for space-constrained designs. Its surface-mount construction enables automated assembly while maintaining excellent electrical performance across a wide range of operating conditions. ## Features * Fundamental mode quartz crystal resonator * Surface-mount device package for automated PCB assembly * High frequency accuracy and stability * Low equivalent series resistance * Low power consumption * Suitable for clock generation and timing circuits * RoHS compliant construction * Reliable performance for industrial and consumer electronics applications ## Electrical Characteristics * Nominal Frequency: 27.120 MHz * Crystal Type: Fundamental Mode * Load Capacitance: 10 pF * Frequency Tolerance: ±20 ppm * Frequency Stability: ±20 ppm * Equivalent Series Resistance: 60 Ω Maximum * Drive Level: Low-power operation * Operating Temperature Range: Industrial grade * Storage Temperature Range: Extended environmental capability ## Mechanical Characteristics * Package Type: Surface-Mount Crystal * Mounting Style: SMD/SMT * Compact footprint optimized for high-density PCB layouts * Four-pad no-lead package construction ## Applications * PN532 NFC Controllers * RFID Readers and Writers * Microcontroller Clock Sources * Wireless Communication Modules * Embedded Systems * Industrial Control Electronics * Consumer Electronic Devices * IoT and Smart Device Platforms ## Compliance * RoHS Compliant * Lead-Free Construction * Suitable for Automated Assembly Processes #7M27_120MEEQT #TXC #CrystalResonator #SMDCrystal #QuartzCrystal #27_120MHz #PN532 #NFC #RFID #EmbeddedSystems #TimingReference #ElectronicsDesign

0.35 BB CONN. H=0.6 SSB6 RP REC ASSY 5050660622 is a 6-position board-to-board (mezzanine) receptacle connector from the Molex SlimStack™ Armor 505066 Series. It is designed for compact electronic devices where a very low-profile connection between two PCBs is required. The connector features a fine 0.35 mm pitch, 0.60 mm mated height, and surface-mount termination, making it suitable for smartphones, wearables, IoT devices, cameras, and other space-constrained applications. Key Features 6 circuits (contacts) for board-to-board interconnection. 0.35 mm pitch for high-density PCB designs. Ultra-low 0.60 mm mated height to minimize product thickness. 2-row connector configuration for efficient space utilization. Surface-mount (SMT) mounting for automated assembly. Armor Nail design improves solder joint strength and mechanical retention. Gold-plated contacts for reliable electrical performance and corrosion resistance. 50 V AC/DC voltage rating. Up to 0.3 A per contact current rating. Operating temperature range: -40°C to +85°C. Liquid Crystal Polymer (LCP) housing for high heat resistance during reflow soldering. 30 mating cycle durability. Typical Applications Smartphones and tablets Wearable devices Wireless modules Portable medical devices Cameras and imaging equipment Compact consumer electronics #CommonPartsLibrary #Connector

ESP32-C3-MINI-1-H4 is a compact, low-power wireless module from Espressif Systems built around the ESP32-C3 SoC. It integrates a 32-bit RISC-V processor, 2.4 GHz Wi-Fi, Bluetooth 5 LE, onboard 4 MB flash memory, crystal oscillator, RF matching circuitry, and a PCB antenna in a small surface-mount package. The module is designed for IoT devices, smart home products, industrial automation, wearable electronics, and wireless sensor applications. Key Features 32-bit RISC-V single-core processor with clock speeds up to 160 MHz. 2.4 GHz Wi-Fi 4 (802.11 b/g/n) connectivity. Bluetooth 5 Low Energy (BLE 5.0) support with long-range capability. 4 MB embedded SPI flash memory (H4 variant). 384 KB ROM and 408 KB SRAM for application execution. Integrated PCB antenna for simplified RF design. USB Serial/JTAG controller for programming and debugging without an external USB-to-UART bridge. Multiple peripheral interfaces: UART SPI I²C I²S PWM GPIO ADC USB JTAG Operating voltage range: 3.0 V to 3.6 V. Supports secure boot, flash encryption, and hardware cryptographic acceleration. Compact SMD module suitable for space-constrained designs. Typical Applications Smart home and home automation devices Wireless sensors and data loggers IoT gateways and edge devices Industrial monitoring and control systems Bluetooth beacons Wearable electronics Consumer connected products H4 Variant Note: The ESP32-C3-MINI-1-H4 version includes 4 MB flash memory and supports an extended operating temperature range up to 105°C, making it suitable for more demanding industrial environments. #RF-Transceiver #ESP32 #Module

The CC1101RGP is a low-power sub-gigahertz RF transceiver designed for wireless communication applications requiring reliable long-range data transmission and high receiver sensitivity. It integrates a complete radio frequency front-end, packet handling engine, modulation and demodulation circuitry, frequency synthesizer, and advanced power management features within a compact package. The device supports multiple modulation formats and is optimized for industrial, scientific, medical, smart metering, home automation, remote control, wireless sensor networks, and Internet of Things applications. Its flexible configuration options enable designers to achieve an optimal balance between communication range, data throughput, power consumption, and system robustness. Features Sub-gigahertz RF transceiver for license-free ISM frequency bands High receiver sensitivity for extended communication range Programmable output power for optimized power consumption Multiple modulation schemes including FSK, GFSK, ASK, OOK, and MSK Integrated packet handling and error detection functions Fast frequency synthesizer settling time Low current consumption in transmit, receive, and sleep modes Hardware support for address filtering and data buffering Programmable channel spacing and data rate configuration Integrated RSSI, LQI, and clear channel assessment functions SPI interface for configuration and data communication Suitable for battery-powered wireless devices Applications Smart metering systems Wireless sensor networks Industrial monitoring and control Home and building automation Remote keyless entry systems Alarm and security systems Asset tracking devices Telemetry and data acquisition systems IoT communication nodes Proprietary wireless communication networks Electrical Characteristics Wide operating supply voltage range Low-power transmit and receive operation Programmable RF output power levels High-performance frequency synthesizer Low standby and sleep current consumption Integrated crystal oscillator support Robust RF performance across supported frequency bands Interface and Connectivity Serial Peripheral Interface communication Digital control and status signals Configurable interrupt outputs Integrated FIFO buffers for transmit and receive data External antenna connection through matching network Package Information Surface-mount package suitable for automated assembly Compact footprint for space-constrained applications RoHS-compliant device construction #commonpartslibrary #integratedcircuit #wirelesscommunication #rftransceiver #subghz #iot #embeddedsystems #industrialautomation #smartmetering #wirelesssensornetwork #lowpowerdesign #telemetry #homeautomation #remotecontrol #texasinstruments

RF Modules E01-2G4M27SX WIRELM-SMD_E01-2G4M27SX LCSC Part Number: C2971733 JLCPCB Part Class: Extended Part Manufactured by EBYTE(亿佰特) EBYTE E01-2G4M27SX 2.4GHz SMD RF transceiver module based on Nordic nRF24L01P, integrated PA and LNA, up to 500mW transmit power, SPI interface with 0 to 10Mbps data rate, supports 2Mbps/1Mbps/250kbps air data rates, 125 communication channels, 2.3V to 3.6V supply voltage, industrial 16MHz crystal, IPEX antenna connector, enhanced ShockBurst compatible with nRF24L01/nRF24L01P/nRF24 series, compact 18 x 14.5mm module for long-range wireless communication. Search Keywords: E01-2G4M27SX, EBYTE E01-2G4M27SX, E01 2G4M27SX, E01-2G4M27SX RF module, E01-2G4M27SX nRF24L01P, EBYTE 2.4GHz RF module, nRF24L01P PA LNA module, 500mW 2.4GHz RF transceiver module, SPI RF transceiver module, 2.4GHz SMD wireless module, IPEX antenna RF module, long range nRF24L01P module, EBYTE nRF24 module, E01-2G4M27SX datasheet Hashtags: #E012G4M27SX #EBYTEE012G4M27SX #EBYTE #nRF24L01P #nRF24Module #RFTransceiverModule #24GHzRFModule #24GHzWirelessModule #SMDWirelessModule #500mWRFModule #PALNAModule #SPIRFModule #IPEXAntenna #EnhancedShockBurst #NordicnRF24 #LongRangeWirelessModule

11 Position Connector Header, Center Strip Contacts Surface Mount Gold or Gold, GXT™ The 91911-31311LF is a 1.00 mm pitch board-to-board mezzanine connector from the Conan™ / MezzSelect™ series by Amphenol ICC. It is designed for compact, high-density PCB stacking applications commonly used in industrial, embedded, networking, and portable electronic systems. Key Features 11-position vertical header 1.00 mm pitch compact board-to-board connector Surface-mount (SMT) mounting 5 mm mated stacking height Gold/GXT™ contact plating for reliable signal integrity and durability Board guide and solder retention features for easier assembly and improved mechanical stability Supports high-density PCB layouts Designed for industrial and embedded applications RoHS and REACH compliant Housing material: LCP (Liquid Crystal Polymer) Rated up to 1 A current and 500 V voltage Typical Applications Embedded computing modules Industrial control systems Networking equipment Portable electronics Compact PCB stacking designs

The ESP32-S3-PICO-1-N8R8 is a highly integrated System-in-Package (SiP) module from Espressif based on the ESP32-S3 SoC. It is designed for compact, low-power IoT applications requiring strong wireless performance, rich peripherals, and minimal external components. This variant (N8R8) integrates 8 MB of SPI flash and 8 MB of PSRAM, making it suitable for memory-intensive applications such as AIoT, voice processing, and graphical user interfaces. The module integrates RF circuitry, crystal oscillator, power management, and memory into a single package, significantly reducing PCB size and BOM cost while improving reliability. ⚡ Key Features Processor & Performance Dual-core Xtensa LX7 microprocessor Up to 240 MHz clock speed Hardware acceleration for AI/ML and vector operations Memory 8 MB SPI Flash 8 MB PSRAM Internal SRAM for fast access tasks Wireless Connectivity 2.4 GHz Wi-Fi 802.11 b/g/n Bluetooth 5 (LE) support Integrated RF front-end Peripherals GPIO, SPI, I2C, UART, ADC, PWM USB 1.1 OTG support RMT, I2S, SD/MMC interface Touch sensor support Power & Efficiency Low-power sleep modes for battery-powered devices Integrated power management circuitry (SiP-level integration) Wide operating voltage: 3.0V – 3.6V Integration Advantages Built-in crystal oscillator Integrated RF matching components Reduced external component count (SiP design) Compact footprint for space-constrained designs 📌 Typical Applications Smart home devices IoT sensors and controllers Voice-enabled AI devices Wearables HMI (Human Machine Interface) Industrial monitoring systems

I-PEX MHF4 Connector Receptacle, Male Pin 50 Ohms Surface Mount Solder The 20449-001E-03 is an ultra-miniature MHF4 RF coaxial receptacle connector from I-PEX designed for high-frequency wireless applications such as Wi-Fi, Bluetooth, LTE, GNSS, and cellular antenna connections in compact electronic devices. It is a surface-mount RF connector optimized for miniature coaxial cable assemblies and high-density PCB layouts. Key Features Ultra-small MHF4 RF coaxial receptacle Supports frequencies up to 9 GHz Characteristic impedance: 50 Ω Surface-mount (SMT) PCB mounting Snap-on mating mechanism Compact footprint for space-constrained designs Gold-plated center contact for improved conductivity and corrosion resistance Uses: MHF4 compatible RF cables and antenna assemblies High-reliability micro RF interconnect Operating temperature: −40°C to +90°C Rated voltage: 60 V Approximate mating cycle rating: 30 cycles Constructed with: Brass contacts LCP (Liquid Crystal Polymer) dielectric material RoHS compliant Typical Applications Wi-Fi modules LTE/5G modules GNSS/GPS antennas Bluetooth devices IoT devices Embedded wireless systems Compact handheld electronics RF communication modules

ARM Microcontrollers - MCU ARM M4 1024 FLASH 168 Mhz 192kB SRAM 100-LQFP (14x14) Arm® Cortex®-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from Flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 1 Mbyte of Flash memory – Up to 192+4 Kbytes of SRAM including 64- Kbyte of CCM (core coupled memory) data RAM – 512 bytes of OTP memory – Flexible static memory controller supporting Compact Flash, SRAM, PSRAM, NOR and NAND memories • LCD parallel interface, 8080/6800 modes • Clock, reset and supply management – 1.8 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC (1% accuracy) – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Low-power operation – Sleep, Stop and Standby modes –VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM • 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode • 2×12-bit D/A converters • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support • Up to 17 timers: up to twelve 16-bit and two 32- bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex-M4 Embedded Trace Macrocell™ • Up to 140 I/O ports with interrupt capability – Up to 136 fast I/Os up to 84 MHz – Up to 138 5 V-tolerant I/Os • Up to 15 communication interfaces – Up to 3 × I2C interfaces (SMBus/PMBus) – Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control) – Up to 3 SPIs (42 Mbits/s), 2 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock – 2 × CAN interfaces (2.0B Active) – SDIO interface • Advanced connectivity – USB 2.0 full-speed device/host/OTG controller with on-chip PHY – USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI – 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII #CommonPartsLibrary #IntegratedCircuit #Microcontroller #STM32F407