Memory

ARM® Cortex® M3 STM32F1 Microcontroller IC 32-Bit Single-Core 72MHz 64KB (64K x 8) FLASH Medium-density performance line Arm®-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 com. interfaces Arm® 32-bit Cortex®-M3 CPU core – 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access – Single-cycle multiplication and hardware division • Memories – 64 or 128 Kbytes of Flash memory – 20 Kbytes of SRAM • Clock, reset and supply management – 2.0 to 3.6 V application supply and I/Os – POR, PDR, and programmable voltage detector (PVD) – 4 to 16 MHz crystal oscillator – Internal 8 MHz factory-trimmed RC – Internal 40 kHz RC – PLL for CPU clock – 32 kHz oscillator for RTC with calibration • Low-power – Sleep, Stop and Standby modes – VBAT supply for RTC and backup registers • 2x 12-bit, 1 µs A/D converters (up to 16 channels) – Conversion range: 0 to 3.6 V – Dual-sample and hold capability – Temperature sensor • DMA – 7-channel DMA controller – Peripherals supported: timers, ADC, SPIs, I 2Cs and USARTs • Up to 80 fast I/O ports – 26/37/51/80 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant Debug mode: – Serial wire debug (SWD) and JTAG interfaces • Seven timers – Three 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input – 16-bit, motor control PWM timer with dead-time generation and emergency stop – Two watchdog timers (independent and window) – SysTick timer 24-bit downcounter • Up to nine communication interfaces – Up to two I2C interfaces (SMBus/PMBus®) – Up to three USARTs (ISO 7816 interface, LIN, IrDA capability, modem control) – Up to two SPIs (18 Mbit/s) – CAN interface (2.0B Active) – USB 2.0 full-speed interface • CRC calculation unit, 96-bit unique ID • Packages are ECOPACK #commonpartslibrary #integratedcircuit #microcontroller #stm32f1

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.412GHz ~ 2.484GHz PCB Trace Surface Mount SP32-C3-MINI-1-N4 is a compact Wi-Fi + Bluetooth Low Energy (BLE) module based on Espressif’s ESP32-C3 chip, designed for low-power IoT and embedded applications. The module integrates a RISC-V 32-bit single-core processor with wireless connectivity, making it suitable for cost-sensitive and power-efficient smart devices. Key features Processor: 32-bit RISC-V single-core CPU (up to 160 MHz) Wireless: Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth 5 (LE support) Flash: “N4” variant typically includes 4 MB SPI flash Memory: Internal SRAM for lightweight embedded applications Security features: Secure boot Flash encryption Hardware cryptographic acceleration Low power modes: Deep sleep support for battery-powered devices GPIO: Multiple general-purpose I/O pins (shared with peripherals like UART, SPI, I2C, ADC, PWM) Package: Compact “MINI” form factor for space-constrained PCB designs #CommonPartsLibrary #Module #RF

USB Controller USB 2.0 I2C Interface 24-QFN (4x4) The STUSB4500QTR is a standalone USB Type-C Power Delivery (PD) controller from STMicroelectronics designed for power sink applications (devices that receive power, like chargers, IoT devices, or battery-powered systems). It enables automatic negotiation of USB Power Delivery contracts (up to 100 W: 20 V / 5 A) without requiring an external microcontroller, thanks to its built-in auto-run algorithm. Power profiles (PDOs) can be pre-configured and stored in internal non-volatile memory, simplifying system design and reducing component count. The device is optimized for modern USB-C designs, offering robust protection, high-voltage tolerance, and support for operation even from a dead battery state. Key Features Power Delivery & Control Standalone USB Type-C™ and USB PD sink controller Supports up to 100 W (20 V, 5 A) power negotiation Auto-run mode (no MCU required) for PD negotiation Up to 3 configurable sink PDO profiles stored in NVM Power Management Dead battery mode support (can start with no battery power) Dual power supply inputs: V_SYS: 3.0 V – 5.5 V V_DD: 4.1 V – 22 V Integrated VBUS monitoring and control Integrated Functions Built-in VBUS switch gate drivers (PMOS) Internal/external VBUS discharge paths I²C interface for configuration and monitoring Protection & Reliability Short-to-VBUS protection on CC pins (up to 22 V) High-voltage tolerance: Up to 28 V on VBUS pins ESD protection: 3 kV HBM / 1.5 kV CDM Physical & Environmental Package: QFN-24 (4×4 mm) Operating temperature: –40°C to +105°C Industrial-grade reliability Compliance & Compatibility Certified for: USB Type-C Rev 1.2 USB PD Rev 2.0 Interoperable with USB PD 3.0 #commonpartslibrary #integratedcircuit #usbcontroller

IC RF TxRx Only Bluetooth, WiFi Bluetooth v5.0, Thread, Zigbee® 2.412GHz ~ 2.484GHz 32-VFQFN Exposed Pad The ESP32-C6FH4 is a low-power, highly integrated wireless microcontroller from Espressif Systems, designed for IoT applications. It is based on a 32-bit RISC-V processor running at up to 160 MHz, providing efficient performance for embedded systems while maintaining low power consumption. This variant includes 4 MB of embedded flash memory, making it suitable for standalone applications without the need for external flash. The ESP32-C6FH4 supports multiple wireless communication protocols, including: Wi-Fi 6 (802.11ax) in the 2.4 GHz band (backward compatible with Wi-Fi 4/802.11 b/g/n) Bluetooth Low Energy (BLE 5) IEEE 802.15.4 (used for protocols like Thread and Zigbee) Key features include: Rich set of GPIO pins with support for peripherals such as UART, SPI, I2C, PWM, ADC, and more Integrated hardware security features (secure boot, flash encryption, cryptographic accelerators) Multiple low-power modes for battery-operated devices On-chip temperature sensor and RTC peripherals #commonpartslibrary #transceiver

RF System on a Chip - SoC Cortex-M55 250MHz, 2.5D GPU, 4MB MRAM, 3.75MB SRAM, BLE5.4, -20 to +70 C, BGA , 1.71 V to 2.2 V -20C ~ 70C ARM® Cortex®-M55 System On Chip (SOC) IC Apollo510B 250MHz The AP510BFA-CBR is an ultra-low-power MCU System-on-Chip (SoC) designed for advanced embedded and edge-AI applications. It belongs to the Apollo510B series and integrates a powerful ARM Cortex-M55 processor optimized for both performance and energy efficiency. It combines processing, memory, and multiple peripherals into a single BGA package, making it suitable for compact and power-sensitive designs. Key Characteristics Core: ARM Cortex-M55 Max CPU Speed: 250 MHz Architecture: MCU / SoC Flash Memory: 4 MB RAM: ~3.75 MB Connectivity: I2C, SPI, UART, USB Wireless Support: Bluetooth 5.4 (variant dependent) Package: 153-BGA (compact high-density package) Key Features Built on Ambiq’s ultra-low-power SPOT technology Designed for battery-powered and energy-sensitive devices High computational performance for edge AI and DSP workloads Integrated peripherals for embedded system development Typical Applications Wearables (smartwatches, fitness bands) Smart home and IoT devices Edge AI / machine learning nodes Industrial sensors and monitoring systems Wireless communication modules #CommonPartsLibrary #IntegratedCircuit #SoC #Apollo510B

NAND Flash 3.3V 2Gb 24nm SLC NAND (EEPROM) FLASH - NAND (SLC) Memory IC 2Gbit Parallel 25 ns 67-VFBGA (6.5x8) The TC58NVG1S3HBAI6 is a 2-Gbit (256M × 8) SLC NAND flash memory device originally developed by Toshiba (now Kioxia). It is a CMOS-based, electrically erasable and programmable read-only memory (EEPROM) used to store data even when power is removed. This device uses Single-Level Cell (SLC) NAND technology, which offers high reliability, fast access time, and long endurance, making it suitable for industrial and embedded systems. Key Characteristics Memory Type: NAND Flash (Non-volatile) Technology: SLC (Single-Level Cell) Density: 2 Gbit (256M × 8 organization) Interface: Parallel I/O Supply Voltage: 2.7 V – 3.6 V Access Time: ~25 ns Package: 67-ball VFBGA (compact surface-mount) Functional Overview Organized into pages and blocks (typical NAND structure) Supports operations such as: Read Page program (write) Block erase Copy-back operations Uses shared I/O pins for address, data, and command input/output Internally, data is transferred between the memory array and internal registers in page-sized chunks (~2176 bytes including spare area). Typical Applications Embedded systems storage Firmware and boot memory Industrial control systems Data logging devices Consumer electronics (e.g., cameras, audio storage) #CommonPartsLibrary #IntegratedCircuit #memory #TC58NVG1

EEPROM Memory IC 256Kbit I2C 1 MHz 450 ns 8-SO The M24256E-FMN6TP is a 256-Kbit (32 Kbyte) I²C-compatible serial EEPROM from STMicroelectronics. It is designed for reliable, non-volatile data storage in a wide range of electronic applications including consumer, industrial, and automotive systems. The device supports standard (100 kHz), fast (400 kHz), and fast-mode plus (1 MHz) I²C communication, enabling efficient data transfer. It features byte and page write operations, low power consumption, and a high endurance of write cycles, making it suitable for frequent data logging and configuration storage. Housed in a compact SO8 package, the device is optimized for space-constrained PCB designs while maintaining robust performance and data retention capabilities. Key Features Memory size: 256 Kbit (32 Kbyte) Interface: I²C (2-wire serial interface) Clock frequency: Standard mode: 100 kHz Fast mode: 400 kHz Fast-mode Plus: 1 MHz Supply voltage range: 1.7 V to 5.5 V Page write capability: up to 64 bytes Write cycle time: ~5 ms (typical) Data retention: > 200 years Endurance: > 4 million write cycles Hardware write protection available ESD protection and latch-up immunity Functional Description The device operates as a slave on the I²C bus and supports: Byte write and read Page write (up to 64 bytes) Random and sequential read operations Memory addressing is internally managed using a 16-bit address pointer, allowing access to the full 32 KB memory array. The device includes an internal write cycle controller, eliminating the need for external timing management. Pin Configuration (SO8 Package) A0, A1, A2: Device address inputs VSS: Ground SDA: Serial data line SCL: Serial clock line WC: Write control (hardware write protection) VCC: Supply voltage Absolute Maximum Ratings Supply voltage (VCC): -0.3 V to 6.5 V Input voltage: -0.3 V to VCC + 0.6 V Storage temperature: -65°C to +150°C Operating temperature (industrial grade): -40°C to +85°C Electrical Characteristics Low standby current: < 1 µA (typical) Operating current: < 1 mA Input/output compatible with CMOS logic levels Schmitt trigger inputs for noise immunity Timing Characteristics Write cycle time: 5 ms (typical) Fast-mode Plus support up to 1 MHz Sequential read supports continuous data streaming Package Information Package type: SO8 (8-lead Small Outline) Mounting: Surface-mount (SMD) Tape & reel packaging (TP suffix) Applications Configuration storage Calibration data storage Data logging systems Industrial control systems Consumer electronics Embedded systems requiring non-volatile memory Advantages High endurance and long data retention Wide voltage range (ideal for mixed-voltage systems) Compact footprint High-speed I²C compatibility (up to 1 MHz) #commonpartslibrary #integratedcircuit #memory

WiFi 802.11b/g/n Transceiver Module 2.4GHz ~ 2.5GHz Integrated, Trace Surface Mount The ESP-12F is a compact WiFi module based on the ESP8266EX, widely used in IoT and embedded systems due to its low cost and built-in networking capabilities. Integrated WiFi (2.4 GHz) Supports 802.11 b/g/n Built-in TCP/IP stack (no external WiFi processor needed) Microcontroller + WiFi in one Powered by the ESP8266EX SoC Can run user applications directly (not just a WiFi modem) Flash Memory Typically 4 MB SPI flash (varies by version) GPIO Support Multiple multifunction pins: Digital I/O PWM I2C SPI UART ADC (1 channel) Size: ~16 mm × 24 mm Mounting: Castellated SMD module Antenna: Built-in PCB trace antenna (requires proper keepout zone) Power Requirements Operating Voltage: 3.0V – 3.6V (typical 3.3V) Current Consumption: Idle: ~70 mA Peak (TX): up to ~300 mA Common Interfaces UART – programming and debugging SPI – peripheral communication I2C (software-based) GPIO – general-purpose control #commonpartslibrary #transceiver #module #wireless #rf #wifi

System On Chip (SOC) IC It integrates multiple processing units including CPUs, DSPs, AI accelerators, and GPU into a single chip to handle vision processing, deep learning, sensor fusion, and real-time control in automotive and industrial systems. • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators • Depth and Motion Processing Accelerators (DMPAC) • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0GHz – 1MB shared L2 cache per dual-core Cortex®- A72 cluster – 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core • Six Arm® Cortex®-R5F MCUs at up to 1.0GHz – 16K I-Cache, 16K D-Cache, 64K L2 TCM – Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem – Four Arm® Cortex®-R5F MCUs in general compute partition • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS • 3D GPU PowerVR® Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec • Custom-designed interconnect fabric supporting near max processing entitlement Memory subsystem: • Up to 8MB of on-chip L3 RAM with ECC and coherency – ECC error protection – Shared coherent cache – Supports internal DMA engine • External Memory Interface (EMIF) module with ECC – Supports LPDDR4 memory types – Supports speeds up to 4266MT/s – 32-bit data bus with inline ECC • General-Purpose Memory Controller (GPMC) • 512KB on-chip SRAM in MAIN domain, protected by ECC #CommonPartsLibrary #IntegratedCircuit