Interface ICs

PCB spring terminal block for wire-to-board connections, featuring a 2-position, 3.5 mm pitch interface with a 45° wire entry and push-in spring connection. It is rated for up to 10 A and 320 V (IEC), accepts 0.2–1.5 mm² (22–16 AWG) conductors, supports PCB through-hole soldering, and operates over a −40°C to +105°C temperature range. #commonpartslibrary #connector #terminalblock #tht

IC RF TxRx + MCU Bluetooth Bluetooth v5.3 2.4GHz 48-VFQFN Exposed Pad NRF52832-QFAA-R7 is an ultra-low-power wireless System-on-Chip (SoC) from Nordic Semiconductor, designed for Bluetooth Low Energy (BLE), ANT, NFC, and proprietary 2.4 GHz wireless applications. It integrates a high-performance ARM Cortex-M4F processor, memory, peripherals, and a 2.4 GHz radio into a single chip, making it ideal for IoT devices, wearables, wireless sensors, beacons, and smart peripherals. GHz protocols • 2.4 GHz transceiver • -96 dBm sensitivity in Bluetooth® low energy mode • Supported data rates: 1 Mbps, 2 Mbps Bluetooth® low energy mode • -20 to +4 dBm TX power, configurable in 4 dB steps • On-chip balun (single-ended RF) • 5.3 mA peak current in TX (0 dBm) • 5.4 mA peak current in RX • RSSI (1 dB resolution) • ARM® Cortex®-M4 32-bit processor with FPU, 64 MHz • 215 EEMBC CoreMark® score running from flash memory • 58 μA/MHz running from flash memory • 51.6 μA/MHz running from RAM • Data watchpoint and trace (DWT), embedded trace macrocell (ETM), and instrumentation trace macrocell (ITM) • Serial wire debug (SWD) • Trace port • Flexible power management • 1.7 V–3.6 V supply voltage range • Fully automatic LDO and DC/DC regulator system • Fast wake-up using 64 MHz internal oscillator • 0.3 μA at 3 V in System OFF mode • 0.7 μA at 3 V in System OFF mode with full 64 kB RAM retention • 1.9 μA at 3 V in System ON mode, no RAM retention, wake on RTC • Memory • 512 kB flash/64 kB RAM • 256 kB flash/32 kB RAM • Nordic SoftDevice ready • Support for concurrent multi-protocol • Type 2 near field communication (NFC-A) tag with wakeup-on-field and touchto-pair capabilities • 12-bit, 200 ksps ADC - 8 configurable channels with programmable gain • 64 level comparator • 15 level low power comparator with wakeup from System OFF mode • Temperature sensor • 32 general purpose I/O pins • 3x 4-channel pulse width modulator (PWM) unit with EasyDMA • Digital microphone interface (PDM) • 5x 32-bit timer with counter mode • Up to 3x SPI master/slave with EasyDMA • Up to 2x I2C compatible 2-wire master/slave • I2S with EasyDMA • UART (CTS/RTS) with EasyDMA • Programmable peripheral interconnect (PPI) • Quadrature decoder (QDEC) • AES HW encryption with EasyDMA • Autonomous peripheral operation without CPU intervention using PPI and EasyDMA • 3x real-time counter (RTC) • Single crystal operation • Package variants • QFN48 package, 6 × 6 mm • WLCSP package, 3.0 × 3.2 mm #CommonPartsLibrary #IntegratedCircuit

2-Channel Single ADC Delta-Sigma 24-bit Serial 16-Pin SOP 24-Bit Analog-to-Digital Converter (ADC) – NAU7802SGI The NAU7802SGI is a 24-bit high-resolution ADC designed for weigh scale and bridge sensor applications. It integrates a low-noise programmable gain amplifier (PGA), supports differential analog inputs, operates from a 2.7 V to 5.5 V supply, and provides an I²C digital interface. The device includes selectable PGA gain settings from 1 to 128 and operates with an internal or external clock source. #ADC #AnalogToDigitalConverter #24BitADC #I2CInterface #PGA #BridgeSensor #Nuvoton #NAU7802 #PCBComponent #ElectronicComponent #commonpartslibrary #integratedcircuit

The TMS320F280049CPZQR is a 32-bit real-time microcontroller from Texas Instruments' C2000 Piccolo family, purpose-built for high-performance digital power control, motor control, and other real-time embedded control applications. The device is centered around TI's C28x digital signal processing core, a fixed- and floating-point architecture specifically optimized for the kind of fast, deterministic mathematical computation required in closed-loop control systems such as motor drives, digital power supplies, solar inverters, and electric vehicle subsystems. This particular part number represents the "C" variant within the TMS320F28004x family, which grants access to an integrated Configurable Logic Block, a flexible programmable logic resource that allows engineers to implement custom digital logic functions directly on-chip, such as specialized PWM waveform shaping, custom protocol interfaces, or glue logic that would otherwise require an external FPGA or discrete logic devices. This variant also provides access to a secure ROM library containing TI's InstaSPIN-FOC technology, a field-oriented motor control solution that significantly simplifies the development of sensorless motor control algorithms by handling much of the underlying control theory and tuning complexity in pre-validated, secure firmware. Beyond its core processing capabilities, the device integrates an extensive set of control-oriented peripherals that are characteristic of the C2000 platform, including high-resolution pulse-width modulation outputs, enhanced capture modules, and a multi-channel sigma-delta filter module that enables isolated current and voltage sensing across an isolation barrier without requiring a separate digital isolator and decoder chip. A dedicated Control Law Accelerator runs in parallel with the main processing core, offloading time-critical control loop calculations so that the main core remains free to handle communication, supervisory logic, and other system-level tasks, which is particularly valuable in systems running multiple simultaneous control loops. Connectivity on the device is supported through a broad set of industry-standard communication interfaces, allowing it to interface with a wide range of external sensors, communication networks, and host systems without requiring additional bridge components. The device also supports TI's Fast Serial Interface, a high-speed, robust communication protocol intended to simplify board-to-board and module-to-module communication in multi-controller systems, an increasingly common need in distributed power and motor control architectures. This part is qualified to automotive electronics reliability standards, making it suitable for deployment in vehicle power electronics, traction inverters, onboard chargers, and other automotive systems where component robustness, extended temperature operation, and rigorous quality screening are required. The device also supports TI's functional safety documentation framework, providing the architectural transparency and failure mode analysis resources needed by system designers building safety-critical control systems around the device. It is housed in a surface-mount package suited to dense power electronics board layouts and is supplied in tape-and-reel packaging for automated assembly. Spec Sheet Identification Part Number: TMS320F280049CPZQR Device Family: C2000 Piccolo, TMS320F28004x Manufacturer: Texas Instruments Variant: "C" type — with Configurable Logic Block and secure ROM/InstaSPIN-FOC access Functional Classification Device Type: 32-bit real-time microcontroller Core Architecture: C28x digital signal processing core Math Acceleration: Floating-Point Unit and Trigonometric Math Unit for control-loop computation Parallel Control Processing: Integrated Control Law Accelerator Programmable Logic: Configurable Logic Block (CLB) for custom digital logic functions Motor Control Library: Secure ROM with InstaSPIN-FOC sensorless field-oriented control Memory Program Memory Type: Embedded flash memory Memory Architecture: Supports field reprogramming for firmware updates and calibration data storage Control & Analog Peripherals PWM Capability: Frequency-independent, high-resolution PWM outputs Capture Module: Enhanced capture (eCAP) peripheral Isolated Sensing: Multi-channel sigma-delta filter module (SDFM) for isolated current/voltage sensing Analog Integration: Integrated high-speed analog-to-digital converters and internal digital-to-analog converters Programmable Gain: Integrated programmable gain amplifiers Communication Interfaces Standard Interfaces: SPI, SCI, I2C, LIN, and CAN connectivity Power Management Bus: Fully compliant PMBus support High-Speed Module Interface: Fast Serial Interface (FSI) for board-to-board and module-to-module communication Target Applications Application Domains: Industrial motor drives, solar inverters, digital power supplies, electric vehicle and transportation systems, sensing and signal processing Environmental & Qualification Automotive Qualification: AEC-Q100 qualified Functional Safety Support: Documentation and architecture support for functional safety-compliant system design Lifecycle Status: Active production Package Package Type: Surface-mount quad flat package style (LQFP) Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel, per part suffix designation #TMS320F280049 #C2000 #Piccolo #TexasInstruments #DigitalSignalController #RealTimeMCU #MotorControl #DigitalPowerControl #InstaSPINFOC #FieldOrientedControl #ConfigurableLogicBlock #AECQ100 #AutomotiveMCU #PowerElectronics #EmbeddedSystems #LQFP #SurfaceMount #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary

Accelerometer, Gyroscope, 6 Axis Sensor I²C Output 6-axis MEMS motion tracking sensor integrating a 3-axis gyroscope, 3-axis accelerometer, and digital temperature sensor. Operates from a 2.375 V to 3.46 V supply, communicates via an I²C interface (up to 400 kHz), and provides programmable gyroscope ranges of ±250, ±500, ±1000, and ±2000 °/s and accelerometer ranges of ±2 g, ±4 g, ±8 g, and ±16 g. Includes an on-chip Digital Motion Processor (DMP) and supports operation over a -40°C to +85°C temperature range. #TDKInvenSense #MPU6050 #IMU #MotionSensor #MEMS #Accelerometer #Gyroscope #I2C #DigitalMotionProcessor #EmbeddedSystems #commonpartslibrary #sensor #transducer #accelerometer

Connector Header Through Hole, Right Angle 2 position The AT13-2P-BM01 is a rugged 2-position right-angle PCB mount receptacle from Amphenol Sine Systems' AT Series BoardLock™ connector family. Designed for harsh-environment applications, it features gold-plated male contacts, a flange-mount design, and an IP67-rated sealed interface when mated. This connector is ideal for automotive, industrial, off-road, agricultural, marine, and heavy equipment applications where reliable board-to-cable connections are required. It supports through-hole solder mounting and is compatible with AT06-2S mating plugs. Key Features: 2-position right-angle PCB mount receptacle Through-hole solder termination BoardLock™ flange-mount design for secure PCB attachment Gold-plated copper alloy contacts for excellent conductivity and corrosion resistance Rated for 13 A current and 250 V voltage IP67 sealing (when mated) for dust and water resistance Operating temperature: -55°C to +125°C Durable thermoplastic housing with silicone rubber seals Designed for harsh automotive and industrial environments Compatible with AT06-2S AT Series plug connectors #CommonPartsLibrary #Connector #Amphenol #ATSeries #BoardLock #PCBConnector #RightAngleConnector #AutomotiveConnector #IndustrialConnector #IP67 #ThroughHole #FlangeMount #GoldPlated #HarshEnvironment #Electronics #BoardToCable

Connector Header Panel Mount, Through Hole, Right Angle 2 position 0.215" (5.46mm) Deutsch DT 2-position connector DT13-2 style DT13-2P is a 2-position, right-angle wire-to-board PCB header from the DEUTSCH DT Series by TE Connectivity. It is designed for rugged automotive, industrial, heavy equipment, and off-road applications where reliable power and signal connections are required. The connector features a sealed interface, through-hole solder termination, and a durable housing that withstands harsh environments, including vibration, moisture, and extreme temperatures. Key Features: 2-position right-angle PCB header DEUTSCH DT sealed connector system Through-hole solder termination 5.46 mm (0.215 in) pitch Rated up to 13 A contact current Maximum operating voltage of 250 VAC/VDC Operating temperature range: -55°C to +125°C Nickel-plated contacts for corrosion resistance Suitable for both power and signal applications Rugged design for automotive and industrial environments #CommonPartsLibrary #Connector #DT13-2P #TEConnectivity #DeutschDT #PCBHeader #WireToBoard #SealedConnector #AutomotiveConnector #IndustrialConnector #ThroughHole #RightAngleConnector #PowerConnector #SignalConnector

N-Channel 100 V 171A (Tc) 188W (Tc) Surface Mount PG-WSON-8-2 The BSC030N10NS5SCATMA1 specification defines the engineering requirements for an N-channel power MOSFET designed for high-efficiency switching and power management applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable switching performance, low conduction losses, and long-term operational stability in power electronic systems. The device is intended for use in DC-DC converters, synchronous rectification circuits, motor control systems, battery management systems, power distribution modules, and industrial electronic equipment. It provides low on-state resistance, fast switching characteristics, and efficient power handling, making it suitable for high-frequency and high-current applications requiring optimized efficiency and thermal performance. Engineering Requirements The power MOSFET shall be manufactured using advanced semiconductor fabrication processes and qualified materials to ensure consistent electrical characteristics, high switching efficiency, and reliable long-term operation. The device shall maintain stable performance under specified voltage, current, and environmental operating conditions. Electrical characteristics shall provide low on-state resistance, high current-carrying capability, low gate charge, and fast switching performance to minimize conduction and switching losses. The device shall maintain stable operation during repetitive switching cycles, transient load conditions, and dynamic power management applications. Thermal performance shall support efficient heat dissipation through the package structure and printed circuit board interface. The component shall maintain electrical integrity and operational reliability within the specified junction temperature range during continuous and intermittent high-power operation. Mechanical construction shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. The package shall withstand vibration, thermal cycling, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, cracks, bond failures, package deformation, or structural inconsistencies. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with all applicable engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, thermal characterization reports, qualification records, inspection reports, material declarations, reliability data, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before implementation to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #PowerMOSFET #NChannelMOSFET #PowerElectronics #PowerManagement #MotorControl #DCDCConverter #Semiconductor #QualityAssurance #EngineeringDocumentation #commonpartslibrary #transistor #mosfet

ADC, Audio 32 b 8k ~ 192k I2S 20-WQFN (3x3) The PCM1822 is a high-performance, Burr-Brown™ audio analog-to-digital converter (ADC) that supports simultaneous sampling of up to two analog channels. The device supports single-ended and differential line and microphone inputs with a 1-VRMS full-scale signal. The device integrates a phase-locked loop (PLL), a DC removal high-pass filter (HPF), and supports sample rates up to 192 kHz. The device supports time-division multiplexing (TDM) or I2S audio formats, selectable with the hardware pin level. Additionally, the PCM1822 supports master and slave mode selection for the audio bus interface operation. These integrated high-performance features, along with the ability to be powered from a single supply of 3.3 V, make the device an excellent choice for costsensitive, space-constrained audio systems in far-field microphone recording applications. The PCM1822 is specified from –40°C to +125°C, and is offered in a 20-pin WQFN package. Features • Stereo high-performance ADC: – 2-channel analog microphones or line-in • ADC line and microphone differential and singleended input performance: – PCM1822 dynamic range: • 117-dB, dynamic range enhancer enabled • 111-dB, dynamic range enhancer disabled – THD+N: –95 dB • 1-VRMS full-scale input • ADC sample rate (fS) = 8 kHz to 192 kHz • Hardware pin control configurations • Linear-phase or low-latency filter selection • Flexible audio serial data interface: – Master or slave interface selection – 32-bits, 2-channel TDM – 32-bits, 2-channel I2S • Automatic power-down upon loss of audio clocks • Integrated high-performance audio PLL • Single-supply operation: 3.3 V • I/O-supply operation: 3.3 V or 1.8 V • Power consumption for 3.3-V AVDD supply: – 19.6 mW/channel at 16-kHz sample rate – 21.3 mW/channel at 48-kHz sample rate #CommonPartsLibrary #IntegratedCircuit #PCM1822IRTER #TexasInstruments #AudioADC #StereoADC #BurrBrown #I2S #TDM #AudioElectronics #EmbeddedAudio #SmartSpeaker #AVReceiver #HighResolutionAudio #PCBDesign #ElectronicsDesign #SignalProcessing