Interface ICs

Power Management IC for iMX8M 5V 6A 6 Buck + 5 LDO The PCA9450CHNY is a highly integrated Power Management Integrated Circuit (PMIC) from NXP Semiconductors, specifically designed to power the i.MX 8M family of application processors, particularly the i.MX 8M Plus. It integrates multiple high-efficiency DC-DC buck converters, LDO regulators, power sequencing logic, load switching, voltage monitoring, and system control functions into a single device. The PCA9450C variant features a configurable dual-phase 6 A buck regulator for powering high-current processor cores while supporting Dynamic Voltage Scaling (DVS) for optimized power efficiency. Key Features Six high-efficiency switching regulators (Buck converters) PCA9450C variant supports a configurable 6 A dual-phase buck regulator Three 3 A buck regulators with Dynamic Voltage Scaling (DVS) Remote-sense capability on major buck outputs for IR-drop compensation Five integrated LDO regulators Supports DDR4, LPDDR4, and DDR3L memory configurations 400 mA load switch with active discharge Dual-channel logic level translator Integrated 32.768 kHz crystal oscillator driver Fast-mode Plus (Fm+) 1 MHz I²C interface Programmable power sequencing and voltage control Power ON/OFF and Standby/Run mode control inputs Protection features including UVLO, thermal shutdown, fault monitoring, and soft-start Operating temperature range: −40°C to +105°C 56-pin HVQFN package (7 mm × 7 mm, 0.4 mm pitch) Optimized for i.MX 8M Mini, Nano, and Plus processors, especially the i.MX 8M Plus for the PCA9450C variant. #CommonPartsLibrary #PCA9450CHNY #PCA9450C #NXP #PMIC #PowerManagementIC #PowerSupply #VoltageRegulator #BuckConverter #LDO #DynamicVoltageScaling #DVS #IMX8M #IMX8MPlus #EmbeddedSystems #IndustrialElectronics #PowerManagement #HVQFN56 #Semiconductor #IntegratedCircuit #IC #CommonPartsLibrary #ElectronicsDesign #HardwareDesign #PCBDesign #EmbeddedLinux #IoT #ProcessorPowerManagement #PowerSequencing #SystemPower #NXPSemiconductors

Red, Green, Blue (RGB) 626nm Red, 528nm Green, 465nm Blue LED Indication - Discrete 2.15V Red, 2.65V Green, 2.85V Blue 6-PLCC The LRTBGWSR-4U4V-JW+8A8B-D8-3S4U-7Z is an automotive-grade RGB surface-mount LED from the OSIRE® E3635 family by ams OSRAM. It integrates independently controllable red, green, and blue LED chips within a compact 6-PLCC package, enabling precise color mixing and dynamic lighting effects. The device is designed for high-reliability applications requiring full-color illumination, status indication, ambient lighting, and display backlighting. Its wide viewing angle, high luminous intensity, and AEC-Q102 qualification make it suitable for automotive interior lighting, industrial controls, consumer electronics, and advanced human-machine interface applications. Features - Package: white PLCC-6 package, silicone resin - Chip technology: Thinfilm / Volume emitter on Sapphire (AlInGaN) - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 626 nm (● red); λdom = 528 nm (● true green); λdom = 465 nm (● blue) - Corrosion Robustness Class: 3B - Qualifications: AEC-Q102 Qualified - ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) Applications - Ambient Lighting - Automotive Aftermarket #CommonPartsLibrary #LED #RGBLED #OSRAM #amsOSRAM #OSIREE3635 #AutomotiveLED #AECQ102 #SMDLED #PLCC6 #IndicatorLED #AmbientLighting #ColorMixing #LRTBGWSR_4U4V_JW_8A8B_D8_3S4U_7Z

Magnetic Sensors QMC5883L LGA-16_L3.0-W3.0-P0.50-BL_SQ The QMC5883L is a multi-chip three-axis magnetic sensor. This surface -mount, small sized chip has integrated magnetic sensors with signal condition ASIC, targeted for high precision applications such as compassing, navigation and gaming in drone, robot, mobile and personal hand-held devices. The QMC5883L is based on our state-of-the-art, high resolution, magneto-resistive technology licensed from Honeywell AMR technology. Along with custom-designed 16-bit ADC ASIC, it offers the advantages of low noise, high accuracy, low power consumption, offset cancellation and temperature compensation. QMC5883L enables 1° to 2° compass heading accuracy. The I²C serial bus allows for easy interface. The QMC5883L is in a 3x3x0.9mm3 surface mount 16-pin land grid array (LGA) package.  3-Axis Magneto-Resistive Sensors in a 3x3x0.9 mm3 Land Grid Array Package (LGA), guaranteed to operate over an extended temperature range of -40 °C to +85 °C.  Small Size for Highly Integrated Products. Signals Have Been Digitized And Calibrated.  16 Bit ADC With Low Noise AMR Sensors Achieves 2 Milli-Gauss Field Resolution  Enables 1° To 2° Degree Compass Heading Accuracy , Allows for Navigation and LBS Applications  Wide Magnetic Field Range (±8 Gauss)  Maximizes Sensor’s Full Dynamic Range and Resolution  Temperature Compensated Data Output and Temperature Output  Automatically Maintains Sensor’s Sensitivity Under Wide Operating Temperature Range  I 2C Interface with Standard and Fast Modes.  High-Speed Interfaces for Fast Data Communications. Maximum 200Hz Data Output Rate  Wide Range Operation Voltage (2.16V To 3.6V) and Low Power Consumption (75A)  Compatible with Battery Powered Applications  Lead Free Package Construction  RoHS Compliance  Software And Algorithm Support Available  Compassing Heading, Hard Iron, Soft Iron, and Auto Calibration Libraries Available #CommonPartsLibrary #Sensor

SPI Flash Serial Flash Memory with Dual/Quad SPI The W25Q16JVUXIQ is a 16-Mbit (2-MByte) Serial NOR Flash memory device from Winbond. It is designed for embedded systems that require non-volatile code and data storage with minimal pin count, low power consumption, and high-speed access. The device supports standard SPI, Dual SPI, and Quad SPI interfaces, making it suitable for firmware storage, boot memory, IoT devices, microcontrollers, consumer electronics, and execute-in-place (XIP) applications. Key Features 16-Mbit (2-MByte) Flash Memory Capacity Operating Voltage: 2.7 V to 3.6 V Standard SPI, Dual SPI, and Quad SPI Interface Support Maximum SPI Clock Frequency: 133 MHz Equivalent Data Transfer Rates: 266 MHz (Dual SPI) 532 MHz (Quad SPI) Continuous Read and XIP (Execute-In-Place) Capability 4 KB Sector Erase, 32 KB Block Erase, 64 KB Block Erase, and Chip Erase 256-Byte Programmable Page Size Minimum 100,000 Program/Erase Cycles per Sector More Than 20 Years Data Retention Ultra-Low Power Consumption Typical power-down current below 1 µA 64-Bit Unique Serial Number Three 256-Byte Security Registers with OTP Protection JEDEC ID and SFDP Support Software and Hardware Write Protection Operating Temperature Options up to +85°C and +105°C Compact 8-Pad USON Package (2 mm × 3 mm) suitable for space-constrained designs #CommonPartsLibrary #IntegratedCircuit #Memory

Small Footprint RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support LAN8720A-CP-TR-ABC is a low-power, single-port 10BASE-T/100BASE-TX Ethernet Physical Layer (PHY) transceiver from Microchip Technology. It is designed to connect a microcontroller, processor, or Ethernet MAC to a standard Ethernet network through an RMII (Reduced Media Independent Interface). The device is widely used in embedded networking applications such as industrial controllers, IoT gateways, IP cameras, networked printers, routers, and ESP32-based Ethernet designs. Key Features Single-chip 10/100 Mbps Ethernet PHY Supports both 10BASE-T and 100BASE-TX Ethernet operation. RMII Interface Reduced pin-count interface for easy connection to Ethernet MACs and microcontrollers. IEEE 802.3 / 802.3u Compliant Fully compliant with Fast Ethernet standards. HP Auto-MDIX Support Automatically detects and configures straight-through or crossover Ethernet cables. Auto-Negotiation Automatically selects the best available speed and duplex mode. Flexible I/O Voltage Supports LVCMOS I/O voltages from 1.6 V to 3.6 V, simplifying interfacing with different processors. Integrated 1.2 V Regulator Allows operation from a single 3.3 V supply, reducing external components. Low-Power Architecture Features multiple power-saving modes through Microchip's flexPWR® technology. Built-in Diagnostics and Reliability Features Loopback modes, automatic polarity correction, link-status monitoring, and wake-up detection. Compact Package Available in a 24-pin SQFN/QFN (4 mm × 4 mm) package for space-constrained designs #CommonPartsLibrary #IntegratedCircuit

M.2 CONN.P=0.5 6.7mm H conn The 91302-67-067R2M is a 67-position M.2 (NGFF) card-edge connector manufactured by UMAX. It is designed for connecting M.2 SSDs and PCIe-based expansion modules to a host PCB. The connector features an M-Key interface, making it suitable for high-speed PCIe storage applications such as NVMe solid-state drives. It is a surface-mount, right-angle receptacle with a 0.5 mm contact pitch and a 6.7 mm height above the PCB. Key Features M.2 M-Key connector Supports M-Key M.2 modules, commonly used for PCIe/NVMe SSDs. 67 contacts (67P) Standard pin count for M-Key M.2 card-edge connections. 0.5 mm pitch Fine-pitch design suitable for compact, high-density PCB layouts. Surface-mount, right-angle mounting Optimized for automated PCB assembly and low-profile system designs. 6.7 mm connector height Provides compatibility with standard M.2 card installation requirements. Female card-edge receptacle Accepts M.2 modules directly without additional adapters. RoHS compliant Meets environmental requirements for lead-free electronic assemblies. Typical Applications NVMe SSD sockets PCIe M.2 storage devices Embedded computing systems Industrial PCs Networking equipment Edge AI and IoT gateways Single-board computers requiring M.2 expansion #CommonPartsLibrary #Connector

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.05Hz ~ 1.6kHz 14-LGA (3x5) The ADXL345-EP is an extended performance version of the ADXL345, which is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2 C digital interface. The ADXL345-EP is well suited for extended temperature range industrial and aerospace equipment. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (3.9 mg/LSB) enables measurement of inclination changes less than 1.0°. Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction. Freefall sensing detects if the device is falling. These functions can be mapped individually to either of two interrupt output pins. An integrated memory management system with a 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption. Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation. The ADXL345-EP is supplied in a small, thin, 3 mm × 5 mm × 1 mm, 14-lead, enhanced plastic package. Ultralow power: as low as 23 µA in measurement mode and 0.1 µA in standby mode at VS = 2.5 V (typical) Power consumption scales automatically with bandwidth User-selectable resolution from 10 to 13 bits 4 mg/LSB scale factor in all g ranges 32-sample FIFO minimizes host processor load Single tap, double tap, and free-fall detection Activity/inactivity monitoring Supply voltage range: 2.0 V to 3.6 V I/O voltage range: 1.7 V to VS SPI (3- and 4-wire) and I2C digital interfaces Flexible interrupt modes mappable to either interrupt pin Measurement ranges selectable via serial command Bandwidth selectable via serial command 10,000 g shock survival Pb free/RoHS compliant Small and thin: 3 mm × 5 mm × 1 mm LGA package #CommonPartsLibrary #Sensor #Motion-sensor #accelerometer

SPI Flash Memory with Dual/Quad SPI The W25Q128JV (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages. The W25Q128JV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128JV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q128JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 and I/O3. SPI clock frequencies of W25Q128JV of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories.  New Family of SpiFlash Memories – W25Q128JV: 128M-bit / 16M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1 – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1)  Highest Performance Serial Flash – 133MHz Single, Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles per sector – More than 20-year data retention  Efficient “Continuous Read” – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – <1µA Power-down (typ.) – -40°C to +85°C operating range – -40°C to +105°C operating range Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4K/32K/64K-Byte) – Program 1 to 256 byte per programmable page – Erase/Program Suspend & Resume  Advanced Security Features – Software and Hardware Write-Protect – Power Supply Lock-Down – Special OTP protection – Top/Bottom, Complement array protection – Individual Block/Sector array protection – 64-Bit Unique ID for each device – Discoverable Parameters (SFDP) Register – 3X256-Bytes Security Registers with OTP locks – Volatile & Non-volatile Status Register Bits  Space Efficient Packaging – 8-pin SOIC 208-mil – 16-pin SOIC 300-mil (additional /RESET pin) – 8-pad WSON 6x5-mm / 8x6-mm – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array) – 24-ball WLCSP – Contact Winbond for KGD and other options #CommonPartsLibrary #IntegratedCircuit #Memory

Cellular, Navigation BeiDou, EGDE, Galileo, GLONASS, GPS, GNSS, GSM, LTE Transceiver Module 850MHz, 900MHz, 1.8GHz, 1.9GHz Antenna Not Included Surface Mount The BG95M3LA-64-SGNS is a compact low-power LTE cellular communication module designed for IoT, telematics, asset tracking, industrial automation, and embedded wireless applications. The module supports global LTE Cat M1, Cat NB2, and EGPRS connectivity, enabling reliable wide-area wireless communication for battery-powered and mobile embedded systems. The device integrates cellular modem functionality, GNSS positioning capability, power management features, and multiple peripheral communication interfaces within a highly compact surface-mount package optimized for space-constrained embedded designs. The module is engineered for low-power operation, making it suitable for long-life IoT deployments requiring efficient wireless connectivity. The BG95M3LA-64-SGNS supports integrated satellite positioning technologies including GPS, GLONASS, Galileo, and BeiDou for location-aware applications. Its robust RF performance and industrial-grade operating capability allow deployment in harsh environmental conditions and demanding remote monitoring systems. The module provides comprehensive support for embedded communication protocols and is commonly used in smart meters, telematics units, industrial gateways, environmental monitoring systems, fleet tracking devices, and connected sensor platforms. Key Features LTE Cat M1 cellular communication support LTE Cat NB2 narrowband IoT capability EGPRS fallback connectivity Integrated GNSS positioning functionality Low-power optimized architecture Global wireless network compatibility Compact surface-mount module design Embedded TCP/IP protocol stack support UART, USB, and serial communication interfaces Integrated power management subsystem Industrial operating temperature support Embedded IoT connectivity optimization High-reliability wireless communication platform Multi-constellation satellite navigation support Electrical Characteristics Low operating power consumption Wide input voltage support High RF sensitivity performance Embedded low-power sleep functionality Stable wireless communication architecture Integrated RF and baseband processing Optimized antenna interface support Industrial-grade reliability performance Fast network registration capability Applications IoT and M2M communication systems Asset tracking devices Fleet management platforms Smart utility metering Industrial automation equipment Remote environmental monitoring Smart agriculture systems Telematics and transportation electronics Portable wireless data terminals Embedded gateway systems Smart city infrastructure Connected sensor platforms Package Information Package Type: LGA Module Mounting Type: Surface Mount Compact embedded wireless module package RoHS compliant configuration available #commonpartslibrary #wirelessmodule #lte #iot #embeddedhardware #cellularcommunication #gnss #telematics #industrialautomation #assettracking