Crystals

LORA-CC68-915MHz-TCXO is a compact, high-performance LoRa wireless transceiver module from NiceRF based on the Semtech LLCC68 chipset. Operating in the 915 MHz ISM band, it features a high-precision TCXO (Temperature-Compensated Crystal Oscillator) for improved frequency stability, making it ideal for long-range, low-power IoT and industrial wireless communication applications. The module supports LoRa, FSK, and GFSK modulation schemes, provides up to +22 dBm (160 mW) transmit power, and achieves receiver sensitivity as low as -129 dBm for extended communication range. It communicates through an SPI interface and is optimized for battery-powered and low-power systems. Key Features Based on Semtech LLCC68 LoRa transceiver chip 915 MHz ISM band operation High-precision TCXO for enhanced frequency stability Supports LoRa, FSK, and GFSK modulation Up to +22 dBm (160 mW) RF output power Receiver sensitivity up to -129 dBm SPI communication interface Operating voltage: 1.8 V to 3.7 V Low receive current (~6.5 mA typical) Integrated antenna switching circuitry Compact 16 mm × 16 mm SMD package Suitable for long-range and low-power wireless applications FCC-certified 915 MHz version RoHS compliant Typical Applications Smart Metering Industrial Automation Agricultural Monitoring Smart Cities Environmental Sensors Asset Tracking Warehouse Management Remote Control Systems Street Lighting Control Battery-Powered IoT Devices #CommonPartsLibrary #Module #LoRa #LLCC68 #915MHz #TCXO #WirelessModule #RFModule #IoT #IndustrialAutomation #SmartMetering #LongRangeCommunication #LowPowerDesign #SPI #EmbeddedSystems #NiceRF

Power Management IC for iMX8M 5V 6A 6 Buck + 5 LDO The PCA9450CHNY is a highly integrated Power Management Integrated Circuit (PMIC) from NXP Semiconductors, specifically designed to power the i.MX 8M family of application processors, particularly the i.MX 8M Plus. It integrates multiple high-efficiency DC-DC buck converters, LDO regulators, power sequencing logic, load switching, voltage monitoring, and system control functions into a single device. The PCA9450C variant features a configurable dual-phase 6 A buck regulator for powering high-current processor cores while supporting Dynamic Voltage Scaling (DVS) for optimized power efficiency. Key Features Six high-efficiency switching regulators (Buck converters) PCA9450C variant supports a configurable 6 A dual-phase buck regulator Three 3 A buck regulators with Dynamic Voltage Scaling (DVS) Remote-sense capability on major buck outputs for IR-drop compensation Five integrated LDO regulators Supports DDR4, LPDDR4, and DDR3L memory configurations 400 mA load switch with active discharge Dual-channel logic level translator Integrated 32.768 kHz crystal oscillator driver Fast-mode Plus (Fm+) 1 MHz I²C interface Programmable power sequencing and voltage control Power ON/OFF and Standby/Run mode control inputs Protection features including UVLO, thermal shutdown, fault monitoring, and soft-start Operating temperature range: −40°C to +105°C 56-pin HVQFN package (7 mm × 7 mm, 0.4 mm pitch) Optimized for i.MX 8M Mini, Nano, and Plus processors, especially the i.MX 8M Plus for the PCA9450C variant. #CommonPartsLibrary #PCA9450CHNY #PCA9450C #NXP #PMIC #PowerManagementIC #PowerSupply #VoltageRegulator #BuckConverter #LDO #DynamicVoltageScaling #DVS #IMX8M #IMX8MPlus #EmbeddedSystems #IndustrialElectronics #PowerManagement #HVQFN56 #Semiconductor #IntegratedCircuit #IC #CommonPartsLibrary #ElectronicsDesign #HardwareDesign #PCBDesign #EmbeddedLinux #IoT #ProcessorPowerManagement #PowerSequencing #SystemPower #NXPSemiconductors

0.35 BB CONN. H=0.6 SSB6 RP REC ASSY 5050660622 is a 6-position board-to-board (mezzanine) receptacle connector from the Molex SlimStack™ Armor 505066 Series. It is designed for compact electronic devices where a very low-profile connection between two PCBs is required. The connector features a fine 0.35 mm pitch, 0.60 mm mated height, and surface-mount termination, making it suitable for smartphones, wearables, IoT devices, cameras, and other space-constrained applications. Key Features 6 circuits (contacts) for board-to-board interconnection. 0.35 mm pitch for high-density PCB designs. Ultra-low 0.60 mm mated height to minimize product thickness. 2-row connector configuration for efficient space utilization. Surface-mount (SMT) mounting for automated assembly. Armor Nail design improves solder joint strength and mechanical retention. Gold-plated contacts for reliable electrical performance and corrosion resistance. 50 V AC/DC voltage rating. Up to 0.3 A per contact current rating. Operating temperature range: -40°C to +85°C. Liquid Crystal Polymer (LCP) housing for high heat resistance during reflow soldering. 30 mating cycle durability. Typical Applications Smartphones and tablets Wearable devices Wireless modules Portable medical devices Cameras and imaging equipment Compact consumer electronics #CommonPartsLibrary #Connector

The CC1101RGP is a low-power sub-gigahertz RF transceiver designed for wireless communication applications requiring reliable long-range data transmission and high receiver sensitivity. It integrates a complete radio frequency front-end, packet handling engine, modulation and demodulation circuitry, frequency synthesizer, and advanced power management features within a compact package. The device supports multiple modulation formats and is optimized for industrial, scientific, medical, smart metering, home automation, remote control, wireless sensor networks, and Internet of Things applications. Its flexible configuration options enable designers to achieve an optimal balance between communication range, data throughput, power consumption, and system robustness. Features Sub-gigahertz RF transceiver for license-free ISM frequency bands High receiver sensitivity for extended communication range Programmable output power for optimized power consumption Multiple modulation schemes including FSK, GFSK, ASK, OOK, and MSK Integrated packet handling and error detection functions Fast frequency synthesizer settling time Low current consumption in transmit, receive, and sleep modes Hardware support for address filtering and data buffering Programmable channel spacing and data rate configuration Integrated RSSI, LQI, and clear channel assessment functions SPI interface for configuration and data communication Suitable for battery-powered wireless devices Applications Smart metering systems Wireless sensor networks Industrial monitoring and control Home and building automation Remote keyless entry systems Alarm and security systems Asset tracking devices Telemetry and data acquisition systems IoT communication nodes Proprietary wireless communication networks Electrical Characteristics Wide operating supply voltage range Low-power transmit and receive operation Programmable RF output power levels High-performance frequency synthesizer Low standby and sleep current consumption Integrated crystal oscillator support Robust RF performance across supported frequency bands Interface and Connectivity Serial Peripheral Interface communication Digital control and status signals Configurable interrupt outputs Integrated FIFO buffers for transmit and receive data External antenna connection through matching network Package Information Surface-mount package suitable for automated assembly Compact footprint for space-constrained applications RoHS-compliant device construction #commonpartslibrary #integratedcircuit #wirelesscommunication #rftransceiver #subghz #iot #embeddedsystems #industrialautomation #smartmetering #wirelesssensornetwork #lowpowerdesign #telemetry #homeautomation #remotecontrol #texasinstruments

ARM Microcontrollers - MCU ARM M4 1024 FLASH 168 Mhz 192kB SRAM 100-LQFP (14x14) Arm® Cortex®-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from Flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 1 Mbyte of Flash memory – Up to 192+4 Kbytes of SRAM including 64- Kbyte of CCM (core coupled memory) data RAM – 512 bytes of OTP memory – Flexible static memory controller supporting Compact Flash, SRAM, PSRAM, NOR and NAND memories • LCD parallel interface, 8080/6800 modes • Clock, reset and supply management – 1.8 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC (1% accuracy) – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Low-power operation – Sleep, Stop and Standby modes –VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM • 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode • 2×12-bit D/A converters • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support • Up to 17 timers: up to twelve 16-bit and two 32- bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex-M4 Embedded Trace Macrocell™ • Up to 140 I/O ports with interrupt capability – Up to 136 fast I/Os up to 84 MHz – Up to 138 5 V-tolerant I/Os • Up to 15 communication interfaces – Up to 3 × I2C interfaces (SMBus/PMBus) – Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control) – Up to 3 SPIs (42 Mbits/s), 2 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock – 2 × CAN interfaces (2.0B Active) – SDIO interface • Advanced connectivity – USB 2.0 full-speed device/host/OTG controller with on-chip PHY – USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI – 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII #CommonPartsLibrary #IntegratedCircuit #Microcontroller #STM32F407

ARM® Cortex® M3 STM32F1 Microcontroller IC 32-Bit Single-Core 72MHz 64KB (64K x 8) FLASH Medium-density performance line Arm®-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 com. interfaces Arm® 32-bit Cortex®-M3 CPU core – 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access – Single-cycle multiplication and hardware division • Memories – 64 or 128 Kbytes of Flash memory – 20 Kbytes of SRAM • Clock, reset and supply management – 2.0 to 3.6 V application supply and I/Os – POR, PDR, and programmable voltage detector (PVD) – 4 to 16 MHz crystal oscillator – Internal 8 MHz factory-trimmed RC – Internal 40 kHz RC – PLL for CPU clock – 32 kHz oscillator for RTC with calibration • Low-power – Sleep, Stop and Standby modes – VBAT supply for RTC and backup registers • 2x 12-bit, 1 µs A/D converters (up to 16 channels) – Conversion range: 0 to 3.6 V – Dual-sample and hold capability – Temperature sensor • DMA – 7-channel DMA controller – Peripherals supported: timers, ADC, SPIs, I 2Cs and USARTs • Up to 80 fast I/O ports – 26/37/51/80 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant Debug mode: – Serial wire debug (SWD) and JTAG interfaces • Seven timers – Three 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input – 16-bit, motor control PWM timer with dead-time generation and emergency stop – Two watchdog timers (independent and window) – SysTick timer 24-bit downcounter • Up to nine communication interfaces – Up to two I2C interfaces (SMBus/PMBus®) – Up to three USARTs (ISO 7816 interface, LIN, IrDA capability, modem control) – Up to two SPIs (18 Mbit/s) – CAN interface (2.0B Active) – USB 2.0 full-speed interface • CRC calculation unit, 96-bit unique ID • Packages are ECOPACK #commonpartslibrary #integratedcircuit #microcontroller #stm32f1

50 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF12C(3.0)-50DS-0.5V(81) is a high-density, board-to-board mezzanine connector from Hirose Electric’s DF12 series. It features a 0.5 mm pitch with 50 contacts in a dual-row configuration, designed for compact PCB layouts requiring reliable high-speed and high-signal-count interconnections. This connector is optimized for applications such as embedded systems, industrial electronics, communication devices, and portable equipment where space-saving and robust mating performance are critical. Manufacturer Information Manufacturer: Hirose Electric Co., Ltd. Series: DF12 Part Number: DF12C(3.0)-50DS-0.5V(81) Mechanical Specifications Connector Type: Board-to-Board (Mezzanine) Mounting Type: Surface Mount (SMT) Contact Configuration: Dual Row Number of Positions: 50 Pitch: 0.5 mm Stacking Height: 3.0 mm Mating Style: Receptacle (Socket) Contact Plating: Gold over Nickel Termination Style: Solder (SMT pads) Board Retention: None (standard SMT anchoring) Electrical Specifications Rated Current: 0.5 A per contact (typical) Rated Voltage: 50 V AC/DC Contact Resistance: ≤ 100 mΩ (initial) Insulation Resistance: ≥ 100 MΩ Withstanding Voltage: 250 V AC for 1 minute Material Specifications Insulator Material: LCP (Liquid Crystal Polymer), UL94V-0 rated Contact Material: Copper Alloy Plating: Gold plating on contact area, Tin on solder tails Environmental Specifications Operating Temperature Range: -35°C to +85°C Storage Temperature Range: -10°C to +60°C Humidity: Up to 85% RH (non-condensing) Packaging Information Packaging Type: Tape and Reel Reel Quantity: Typically 1,000–2,000 pcs per reel Applications Embedded systems Industrial control equipment Communication devices Portable electronics High-density PCB interconnections Compliance & Standards RoHS Compliant: Yes Halogen-Free: Yes UL Flammability Rating: UL94V-0 Mating Connector Compatible with DF12 series plug connectors with 3.0 mm stacking height and 0.5 mm pitch #commonpartslibrary #connector

16 MHz ±15ppm Crystal 8pF 60 Ohms 4-SMD, No Lead The CX3225SB16000D0GZJC1, manufactured by Kyocera AVX, is a 16.000 MHz crystal oscillator element designed to provide precise frequency reference for microcontrollers, communication ICs, and digital systems. It belongs to the CX3225SB series, known for compact size and stable frequency performance. Key Characteristics Type: Quartz crystal (passive frequency component) Frequency: 16 MHz Load Capacitance: 8 pF Frequency Stability: ±15 ppm Frequency Tolerance: ±15 ppm Operating Mode: Fundamental ESR (Equivalent Series Resistance): ~60–80 Ω Mechanical Details Package: 4-SMD, no-lead (surface mount) Size: 3.2 mm × 2.5 mm (3225 package) Height: ~0.6 mm (low profile) Operating Conditions Temperature Range: −25°C to +85°C Mounting Type: Surface mount (SMT) Function (Simple Explanation) This component: Generates a stable clock signal (16 MHz) Acts as the timing reference for MCUs, processors, or RF modules Works together with internal oscillator circuits inside ICs Microcontroller clock sources (e.g., ESP32, STM32, AVR) Communication modules Embedded systems Consumer electronics IoT devices #CommonPartsLibrary #Crystal #Oscillator #resonator

Connector Header Through Hole 40 position 0.100" (2.54mm) Raspberry Pi 40 pin header The TSW-120-07-G-D is a through-hole, double-row vertical header manufactured by Samtec. It features 40 total positions (2 rows of 20 pins) with a standard 2.54 mm pitch. This connector is widely used for board-to-board connections, prototyping, and general-purpose signal routing in embedded and electronic systems. It is designed for reliable mechanical and electrical performance with gold-plated contacts for enhanced conductivity and corrosion resistance. Manufacturer Samtec Inc. Manufacturer Part Number TSW-120-07-G-D Product Type Through-Hole Pin Header Number of Positions 40 (2 × 20) Number of Rows 2 Pitch 2.54 mm (0.100") Row Spacing 2.54 mm (0.100") Mounting Type Through Hole Orientation Vertical Contact Material Phosphor Bronze Contact Plating Gold (Au) over Nickel Plating Thickness Typically 10 µin (0.25 µm) Gold Insulator Material Black Liquid Crystal Polymer (LCP) Current Rating Typically 3.0 A per contact (depending on application conditions) Voltage Rating Typically 250 VAC Operating Temperature Range -55°C to +125°C Termination Type Solder Contact Style Square Post Post Length Standard Samtec “-07” tail length (approx. 2.92 mm tail, varies slightly per datasheet) Applications Embedded systems (e.g., Raspberry Pi GPIO headers) Development boards and expansion modules Board-to-board interconnects Prototyping and test setups Compliance RoHS Compliant Lead-Free Notes Compatible with standard 2.54 mm female headers and sockets Commonly used in stacking or mezzanine configurations Available in various plating options and pin lengths under the TSW series #commonpartslibrary #connector

12 MHz Ceramic Resonator Built in Capacitor 33 pF ±0.2% 30 Ohms -40°C ~ 125°C Surface Mount #CommonPartsLibrary #Crystal #Oscillator #Resonator #CERALOCK® CSTCE