Battery Management ICs

Temperature Sensor Digital, Local -55°C ~ 150°C 16 b 6-WSON (2x2) The TMP117AIDRVR is a high-precision digital temperature sensor manufactured by Texas Instruments. The device provides accurate temperature measurements through an I²C-compatible digital interface and is optimized for applications requiring medical-grade accuracy, low power consumption, and compact PCB footprint. The sensor integrates a precision temperature sensing element, analog-to-digital converter, calibration memory, and digital interface into a single compact package. The device supports continuous conversion and shutdown operating modes, enabling efficient thermal monitoring in battery-powered and always-on systems. Internal calibration minimizes external component requirements while providing highly linear and repeatable temperature measurements across an extended operating range. The TMP117AIDRVR is commonly used in industrial controls, wearable electronics, healthcare equipment, environmental monitoring systems, battery management systems, consumer electronics, and precision instrumentation. Electrical Characteristics Supply voltage supports low-voltage digital systems and portable electronics applications. Ultra-low operating current enables long battery life in energy-sensitive designs. Integrated EEPROM allows programmable offset correction and configuration storage. Digital output eliminates the need for external ADC circuitry. High measurement resolution supports precision thermal monitoring applications. Low self-heating characteristics improve measurement stability and accuracy. Functional Features High-accuracy digital temperature sensing. I²C and SMBus compatible communication interface. Programmable alert functionality for thermal threshold monitoring. Continuous conversion and low-power shutdown operating modes. Integrated non-volatile memory for user configuration storage. Wide operating temperature range for industrial and commercial environments. Fast conversion timing suitable for real-time monitoring systems. Factory-calibrated performance requiring minimal external calibration. Package Information Package type is WSON with compact surface-mount footprint suitable for dense PCB layouts. Moisture-sensitive package designed for automated assembly processes. Lead-free and RoHS-compliant construction. Typical Applications Medical thermometers and patient monitoring systems. Industrial temperature monitoring equipment. Battery-powered portable electronics. HVAC and environmental sensing systems. Data acquisition and instrumentation systems. Server and embedded thermal management applications. Consumer electronics requiring precision thermal sensing. #commonpartslibrary #integratedcircuit #temperaturesensor

Battery Management IC 2-cell to 5-cell NVDC dual-phase buck-boost battery charge controller with system power monitor #CommonPartsLibrary #IntegratedCircuit #PowerManagement #Battery-charger

Battery Power Management IC Lithium Ion/Polymer 32-QFN (5x5) #commonpartslibrary #integratedcircuit #powermanagement #batterymanagement

OR Controller P-Channel 1:1 SC-70-6 The LM66100DCKR is an ideal diode and power path management device manufactured by Texas Instruments. This integrated circuit is designed to provide low-loss reverse polarity protection and automatic power path control for low-voltage DC power systems. By utilizing an integrated low-resistance MOSFET architecture, the device significantly reduces forward voltage drop and power dissipation compared to conventional Schottky diodes. The device supports automatic source selection, reverse current blocking, and efficient power OR-ing functionality, making it suitable for battery-powered devices, USB-powered electronics, industrial embedded systems, portable equipment, and redundant power supply architectures. Its ultra-low forward voltage characteristics improve overall system efficiency and help extend battery operating life in portable applications. The LM66100DCKR is optimized for compact embedded designs requiring efficient power routing, input protection, and seamless power source switching while minimizing thermal losses and PCB footprint requirements. Engineering Specification Device Type Ideal diode and power path protection IC Power Management Function Reverse current blocking and automatic power path control Switching Technology Integrated low-resistance MOSFET architecture Reverse Protection Reverse polarity and reverse current protection Forward Voltage Characteristics Ultra-low forward voltage drop for high-efficiency operation Power Path Features Automatic source selection and power OR-ing support Efficiency Characteristics Reduced conduction loss compared to conventional diode solutions Input Characteristics Designed for low-voltage DC power rail operation Thermal Characteristics Low thermal dissipation due to efficient MOSFET conduction Protection Features Reverse current blocking Reverse polarity protection Power path isolation Fault-tolerant operation Package Type SC70 surface-mount package Mounting Style Surface mount technology Applications Battery-powered electronics USB-powered systems Power multiplexing Portable devices Embedded systems Industrial electronics Redundant power supplies Power OR-ing circuits IoT hardware Low-power electronic systems Manufacturer Texas Instruments #commonpartslibrary #idealdiode #powermanagement #reversepolarityprotection #powerpathcontroller #texasinstruments #powerelectronics #embeddedhardware #portableelectronics #surfaceountcomponents #electronicsdesign #powersupply #usbpower #batterypowered #industrialelectronics

Power Switch/Driver 1:1 P-Channel 2A SOT-23-5 The GLF1100 is an ultra-efficiency, 2 A rated, Load Switch with integrated slew rate control. The best in class efficiency makes it an ideal chose for use in IoT, mobile, and wearable electronics. The GLF1100 features ultra-efficient IQSmartTM technology that supports the lowest quiescent current (IQ) and shutdown current (ISD) in the industry. Low IQ and ISD solutions help designers to reduce parasitic leakage current, improve system efficiency, and increase battery lifetime. The GLF1100 integrated slew rate control can also enhance system reliability by mitigating bus voltage swings during switching events. Where uncontrolled switches can generate high inrush currents that result in voltage droop and/or bus reset events, the GLF slew rate control specifically limits inrush currents during turn-on to minimize voltage droop. GLF1100 Load Switch devices support an industry leading wide input voltage range and helps to improve operating life and system robustness. Furthermore, one device can be used in multiple voltage rail applications which helps to simplify inventory management and reduce operating cost. FEATURES • Wide Input Range: 1.1 V to 5.5 V 6 V abs max • RON : 82 mΩ Typ @ 5.5 VIN • IOUT Max: 2 A • Ultra-Low IQ: 10 nA Typ @ 5.5 VIN • Ultra-Low ISD: 25 nA Typ @ 5.5 VIN • Controlled Rise Time: 2.2 ms at 3.3 VIN • Internal EN Pull-Down Resistor • Integrated Output Discharge Switch • Wide Operating Temperature Range: -40 °C ~ 85 °C • HBM: 6 kV, CDM: 2 kV APPLICATIONS • Telecommunication Module • Low Power Subsystem • Mobile Devices #commonpartslibrary #integratedcircuit #powermanagement #LoadSwitch #PowerManagement #PMIC #HighSideSwitch #LowPower #BatteryPowered #PortableElectronics #GLFIntegratedPower #SOT23 #PowerDistribution

N-Channel 100 V 171A (Tc) 188W (Tc) Surface Mount PG-WSON-8-2 The BSC030N10NS5SCATMA1 specification defines the engineering requirements for an N-channel power MOSFET designed for high-efficiency switching and power management applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable switching performance, low conduction losses, and long-term operational stability in power electronic systems. The device is intended for use in DC-DC converters, synchronous rectification circuits, motor control systems, battery management systems, power distribution modules, and industrial electronic equipment. It provides low on-state resistance, fast switching characteristics, and efficient power handling, making it suitable for high-frequency and high-current applications requiring optimized efficiency and thermal performance. Engineering Requirements The power MOSFET shall be manufactured using advanced semiconductor fabrication processes and qualified materials to ensure consistent electrical characteristics, high switching efficiency, and reliable long-term operation. The device shall maintain stable performance under specified voltage, current, and environmental operating conditions. Electrical characteristics shall provide low on-state resistance, high current-carrying capability, low gate charge, and fast switching performance to minimize conduction and switching losses. The device shall maintain stable operation during repetitive switching cycles, transient load conditions, and dynamic power management applications. Thermal performance shall support efficient heat dissipation through the package structure and printed circuit board interface. The component shall maintain electrical integrity and operational reliability within the specified junction temperature range during continuous and intermittent high-power operation. Mechanical construction shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. The package shall withstand vibration, thermal cycling, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, cracks, bond failures, package deformation, or structural inconsistencies. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with all applicable engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, thermal characterization reports, qualification records, inspection reports, material declarations, reliability data, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before implementation to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #PowerMOSFET #NChannelMOSFET #PowerElectronics #PowerManagement #MotorControl #DCDCConverter #Semiconductor #QualityAssurance #EngineeringDocumentation #commonpartslibrary #transistor #mosfet

1 mOhms ±1% 4W Chip Resistor Nonstandard Automotive AEC-Q200, Current Sense Metal Element Bourns Inc. CSS4J-4026R-1L00F is a high-power surface-mount current sense resistor designed for accurate current measurement in power electronics applications. It belongs to the CSS4J-4026 series and uses a metal element construction that provides low resistance, high power handling, and excellent stability for automotive and industrial applications. This device features a 1 mΩ resistance value, ±1% tolerance, and 4 W power rating, making it suitable for monitoring high-current paths while minimizing measurement losses. It is also qualified for AEC-Q200 automotive applications and operates across a wide temperature range. Key Features Component Type: SMD Current Sense Resistor (Metal Element / Metal Strip) Resistance Value: 1 mΩ (0.001 Ω) Resistance Tolerance: ±1% Power Rating: 4 W Package Size: 4026 (approx. 10.06 mm × 6.60 mm) Number of Terminals: 4 terminals (Kelvin sensing configuration) Temperature Coefficient: approximately ±75 ppm/°C Operating Temperature Range: −55°C to +170°C Construction: Metal element current shunt resistor for accurate current measurement Qualification: Automotive AEC-Q200 compliant Typical Applications Battery Management Systems (BMS) EV and automotive power systems Motor control circuits Power supplies and DC/DC converters Overcurrent monitoring and protection circuits Industrial power monitoring equipment #CommonPartsLibrary #Bourns #CSS4J4026 #CurrentSenseResistor #ShuntResistor #MetalElementResistor #AECQ200 #PowerElectronics #BatteryManagementSystem #EVElectronics #SMTComponents #PCBDesign

0.5 mOhms ±1% 5W Chip Resistor Nonstandard Automotive AEC-Q200, Current Sense Metal Element # Engineering Specification ## Product Name CSS4J-4026R-L500F ## General Description CSS4J-4026R-L500F is a precision four-terminal Kelvin current sense shunt resistor designed for accurate current measurement in high-performance electronic and power management systems. The device is intended for use in applications requiring low resistance sensing, high measurement accuracy, and stable thermal performance under varying electrical loads. The component utilizes a metal element resistive structure optimized for minimal resistance drift, reduced temperature effects, and consistent long-term stability. Its four-terminal Kelvin configuration separates current flow and voltage sensing paths, enabling improved measurement accuracy by eliminating errors caused by PCB trace and connection resistance. The device is widely used in power conversion systems, battery monitoring systems, motor control circuits, and industrial power electronics where precise current feedback is essential for control, protection, and monitoring functions. Its surface-mount construction supports compact PCB layouts and automated assembly processes while maintaining robust mechanical and electrical reliability. The design emphasizes efficient heat dissipation, stable electrical characteristics, and compatibility with demanding industrial and automotive environments. It is suitable for integration into systems requiring continuous current monitoring and high measurement fidelity. ## Functional Requirements ### Current Measurement The device shall provide accurate current sensing through a low-resistance conductive path designed for minimal measurement error. ### Kelvin Sensing Operation The device shall support four-terminal Kelvin sensing to improve measurement accuracy by separating current and voltage sensing paths. ### Signal Stability The device shall maintain stable sensing characteristics under varying load and thermal conditions. ### System Integration The component shall support integration into power electronics and embedded control systems requiring precise current feedback. ## Electrical Requirements ### Low Resistance Operation The device shall exhibit very low resistance to minimize power loss and maintain measurement accuracy. ### Thermal Stability The resistor shall maintain consistent electrical behavior under elevated operating temperatures and thermal cycling conditions. ### Power Handling The device shall support operation in high-current environments typical of power conversion and motor control systems. ### Measurement Accuracy The design shall support precise voltage drop measurement proportional to current flow for control and monitoring applications. ## Mechanical Requirements ### Surface Mount Construction The device shall be provided in a surface mount package suitable for automated PCB assembly. ### Structural Integrity The component shall maintain mechanical stability during assembly, operation, and thermal cycling. ### PCB Integration The device shall support direct integration into multilayer printed circuit board designs with optimized current path layout. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under industrial and automotive environmental conditions. ### Thermal Performance The component shall maintain performance stability under continuous electrical loading and heat generation. ### Storage and Handling The device shall maintain physical and electrical integrity during storage, transport, and handling procedures. ## Quality Requirements ### Reliability The device shall provide long-term stability in resistance value and sensing accuracy under continuous operation. ### Verification Electrical, thermal, and mechanical characteristics shall be validated through appropriate testing and qualification procedures. ### Compliance The product shall conform to applicable standards for current sensing resistors used in industrial and automotive electronics. ## Documentation Requirements Technical documentation shall include application guidelines, layout recommendations for Kelvin sensing, thermal considerations, electrical characteristics, and integration practices for power electronics systems. ## Classification Tags #CSS4J4026RL500F #CurrentSenseResistor #ShuntResistor #KelvinSensing #FourTerminalResistor #PowerElectronics #BatteryManagement #MotorControl #PowerSupplyDesign #AnalogSensing #ElectricalEngineering #PCBDesign #EmbeddedSystems #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #HighCurrentSensing #PrecisionMeasurement #CircuitDesign

All details fully confirmed from Azoteq's official IQS7222B datasheet and multiple verified distributor sources. Here's the complete spec. Engineering Specification — IQS7222B102QNR Manufacturer: Azoteq (Pty) Ltd Device Family: IQ Switch® ProxFusion® Series — IQS7222B General Description The IQS7222B102QNR is a high-channel-count capacitive touch and proximity sensing controller integrated circuit manufactured by Azoteq, belonging to the ProxFusion series of intelligent human interface sensing devices. The IQS7222B is a sensor fusion device for various multi-button applications that is fully I²C compatible, with on-chip calculations that enable the IC to respond effectively even in the lowest-power modes. It represents an expanded-channel evolution within Azoteq's IQS7222 family, offering a substantially higher mutual capacitance channel count than the IQS7222A variant while maintaining the same ProxFusion design philosophy of combining sophisticated on-chip sensing intelligence with a minimal external component requirement and a compact surface-mount package. Molex The IQS7222B is a highly flexible ProxFusion device that can configure up to eighteen mutual capacitance buttons or up to eight self-capacitance buttons, with nine external sensor pad connections available in the QFN package variant. Alternatively, it can configure up to twenty mutual capacitance buttons or eighteen mutual capacitance buttons with a proximity wake-up function. This high degree of channel configurability makes the device adaptable to a very broad range of physical interface configurations, from simple multi-button panels to complex touch arrays with simultaneous proximity wake-up capability, all within a single fixed-footprint IC that does not require a change of device between product variants with different button counts. MolexAmazon Target applications for the IQS7222B include remote control user interfaces, home automation device user interfaces, and wireless speaker controls. These application domains share common requirements for robust touch detection through cosmetic overlay materials such as glass, plastic, or painted surfaces, reliable operation in environments where the device may be exposed to moisture or contamination, and power efficiency sufficient to support battery-powered or always-on operation without significantly impacting battery life. The device's on-chip power management architecture, which features automated system power modes for optimal response versus consumption, directly addresses these requirements by allowing the device to spend the majority of its time in a low-current sleep or ultra-low-power state while still waking promptly in response to proximity or touch events. MolexMolex Built-in basic functions include automatic tuning, noise filtering, debounce and hysteresis, and dual direction trigger indication. The automatic tuning capability, implemented through Azoteq's proprietary ATI algorithm, compensates for variations in electrode capacitance that arise from PCB manufacturing tolerances, overlay thickness variation, and environmental factors such as temperature and supply voltage drift. This self-calibration eliminates the need for individual unit factory calibration and ensures consistent touch sensitivity across the full production run of any product built around this device. The noise filtering and debounce functions further improve the reliability of touch event detection in electrically noisy environments, preventing false triggers from electrical interference or mechanical vibration that could otherwise cause spurious button events in poorly filtered designs. Molex Both mutual capacitance and self-capacitance designs are possible with the IQS7222B, giving system designers the flexibility to choose the sensing modality most appropriate for their electrode layout and overlay configuration. Mutual capacitance sensing offers better noise immunity and the ability to detect touch through thicker overlay materials, while self-capacitance sensing allows a simpler single-electrode layout per button with potentially higher raw sensitivity. The I²C communication interface supports IRQ/RDY signaling at speeds up to Fast-Plus mode, providing efficient, low-latency event notification to the host microcontroller without requiring continuous polling of the device. The "QNR" suffix in the part number designates the QFN twenty-pin package variant, which offers the maximum external pad count for mutual capacitance configurations. MolexMolex Spec Sheet Identification Part Number: IQS7222B102QNR Device Family: IQ Switch ProxFusion Series — IQS7222B Manufacturer: Azoteq (Pty) Ltd Part Number Decode IQS7222B: Base device family, B-variant expanded channel count 102: Firmware/configuration variant designation QNR: QFN twenty-pin package, tape-and-reel Functional Classification Device Type: Multi-channel capacitive touch and proximity sensing controller IC Sensing Architecture: ProxFusion sensor fusion engine with on-chip processing Application Class: Multi-button, slider, and wheel human interface controller Channel Configuration Mutual Capacitance Buttons: Up to twenty configurable buttons Mutual Capacitance with Proximity Wake-Up: Up to eighteen mutual capacitance buttons with simultaneous proximity wake function Self-Capacitance Buttons: Up to eight self-capacitance buttons External Sensor Pad Connections: Nine pads available in QFN package Sensing Modalities Mutual Capacitance: Full channel array for high noise immunity and overlay penetration Self-Capacitance: Simplified single-electrode per button layout option Proximity Detection: Pre-touch proximity wake-up capability Built-In Processing Functions Automatic Tuning: Proprietary ATI algorithm for self-calibration and baseline normalization Noise Filtering: Integrated digital filtering for EMI and environmental noise rejection Debounce and Hysteresis: Per-channel configurable debounce and release hysteresis Dual Direction Trigger: Positive and negative delta event detection Host Interface Communication Protocol: I²C fully compatible Speed Grade: Up to Fast-Plus mode Event Signaling: IRQ/RDY interrupt output for host notification I²C Address: Configurable; additional address options available on special request Power Management Operating Modes: Active sensing, idle, and ultra-low-power modes Automated Power Mode Control: System-managed transitions for optimized response versus current consumption ULP Wake Capability: Proximity or touch event wake-up from ultra-low-power state Layout & Application Notes VREG Decoupling: Capacitor required at each VREG pin, placed as close as possible to IC Tx Series Resistance: Nominal series resistance recommended on Rx electrodes to reduce EMI coupling ESD Rating: Pins rated to high HBM ESD performance per JEDEC JEP155 Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active production Package Package Type: QFN — Quad Flat No-Lead, twenty-pin Package Designation: QNR variant per Azoteq ordering suffix Mounting Method: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel Target Applications Remote control user interfaces Home automation device controls Wireless speaker and audio device interfaces Multi-button consumer appliance panels IoT device touch interfaces Industrial HMI panels with overlay #IQS7222B #IQS7222B102QNR #Azoteq #ProxFusion #IQSwitch #CapacitiveTouchController #MutualCapacitance #SelfCapacitance #ProximityController #MultiButtonHMI #TouchSensor #ATICalibration #SmartHMI #HomeAutomation #RemoteControl #WirelessSpeaker #IoTDesign #LowPowerSensing #QFN20 #SurfaceMount #EmbeddedHMI #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant