Sensors

868/915MHz SPI SMD LoRa Module E22-900M22S is a compact, industrial-grade LoRa® wireless transceiver module developed by Ebyte, based on the Semtech SX1262 RF chipset. Operating in the 868/915 MHz ISM band, it communicates through an SPI interface and is designed for long-range, low-power wireless data transmission. The module offers excellent receiver sensitivity, strong anti-interference performance, and supports both LoRa and FSK modulation, making it suitable for smart metering, industrial automation, IoT sensor networks, remote monitoring, and wireless control applications. Key Features Based on the Semtech SX1262 LoRa transceiver Operates in the 850–930 MHz frequency range (optimized for 868/915 MHz ISM bands) SPI interface with data rates up to 10 Mbps Maximum transmit power of +22 dBm (160 mW) Receiver sensitivity up to −147 dBm (LoRa mode) Supports LoRa and FSK modulation Programmable air data rate up to 62.5 kbps (LoRa) and 300 kbps (FSK) Long communication range of up to 7 km under ideal line-of-sight conditions Wide operating voltage: 1.8 V to 3.7 V (3.3 V recommended) Ultra-low receive current (~6.8 mA) and low sleep current Industrial operating temperature: −40°C to +85°C Compact 20 × 14 × 2.8 mm SMD package with castellated pads/IPEX antenna options Suitable for IoT, AMI, smart home, industrial sensors, wireless alarms, and remote control systems. #Ebyte #E22Series #E22900M22S #SX1262 #LoRa #WirelessModule #SubGHz #SPI #IoT #IndustrialAutomation #SmartMetering #RemoteMonitoring #EmbeddedSystems #RFModule

Linear Voltage Regulator IC Positive Fixed 1 Output 150mA SOT-23-5 The LP2985IM5X-3.3 specification defines the engineering requirements for a low-dropout linear voltage regulator integrated circuit designed to provide a regulated 3.3 V output for precision analog and digital electronic systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure stable voltage regulation, low output noise, and long-term operational reliability. The device is intended for use in embedded systems, industrial automation, portable electronics, instrumentation, communication equipment, and battery-powered applications requiring a low-noise and highly stable power supply. Its low dropout voltage, high power supply rejection, and integrated protection features make it suitable for powering microcontrollers, sensors, analog circuitry, and other sensitive electronic devices. Engineering Requirements The low-dropout voltage regulator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low quiescent current, and dependable long-term reliability. The device shall maintain stable operation under specified input voltage, output load, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate output voltage regulation, low dropout voltage, excellent line and load regulation, high power supply rejection, and low output noise. The regulator shall maintain stable output performance during startup, shutdown, transient load changes, and supply voltage variations without compromising system operation. The integrated control architecture shall support reliable voltage regulation while incorporating protection mechanisms such as current limiting and thermal shutdown to safeguard both the device and the powered system during abnormal operating conditions. The regulator shall maintain stable performance throughout continuous operation and dynamic load transitions. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, plating irregularities, or structural inconsistencies that could adversely affect functionality or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, thermal characterization reports, application guidelines, qualification records, inspection reports, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #LowDropoutRegulator #LDO #VoltageRegulator #PowerManagement #EmbeddedSystems #IndustrialElectronics #Semiconductor #QualityAssurance #EngineeringDocumentation

12 Bit Analog to Digital Converter 2, 4 Input 1 SAR 14-SOIC The MCP3204-CI/SL specification defines the engineering requirements for a multi-channel analog-to-digital converter integrated circuit designed to provide high-accuracy conversion of analog signals into digital data for embedded electronic systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure precise signal acquisition, reliable data conversion, and long-term operational stability. The device is intended for use in embedded control systems, industrial automation, instrumentation, data acquisition equipment, sensor interfaces, medical electronics, and portable devices requiring accurate analog signal measurement. It supports multiple analog input channels and serial digital communication, enabling efficient integration with microcontrollers and digital processing systems. Engineering Requirements The analog-to-digital converter shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent conversion accuracy, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental conditions. Electrical characteristics shall provide accurate analog-to-digital conversion with low noise, excellent linearity, and stable reference performance. The converter shall maintain repeatable sampling characteristics and consistent digital output while supporting reliable serial communication with compatible host controllers. The conversion architecture shall provide predictable sampling behavior, low conversion error, and reliable channel selection while maintaining signal integrity throughout the specified operating range. The device shall support continuous and intermittent data acquisition without degradation of conversion performance. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical characteristics and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of functionality. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, timing diagrams, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #AnalogToDigitalConverter #ADC #DataAcquisition #SignalConditioning #EmbeddedSystems #IndustrialElectronics #Semiconductor #QualityAssurance #EngineeringDocumentation

The TGS2611-C00 specification defines the engineering requirements for a semiconductor gas sensor designed for the detection of combustible gases in industrial, commercial, and embedded monitoring systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate gas detection, stable sensing characteristics, and long-term operational reliability. The sensor is intended for use in gas leak detection equipment, safety monitoring systems, residential and commercial appliances, industrial automation, and environmental monitoring applications. It utilizes semiconductor sensing technology to detect target combustible gases with high sensitivity and repeatable performance, enabling reliable monitoring and early warning in safety-critical environments. Engineering Requirements The gas sensor shall be manufactured using qualified semiconductor sensing materials and controlled production processes to ensure consistent sensitivity, repeatability, and long-term stability. The sensing element shall maintain reliable performance under specified operating voltage, temperature, humidity, and environmental conditions. Electrical characteristics shall provide stable output response, repeatable detection performance, and predictable recovery behavior following gas exposure. The sensor shall maintain reliable operation during continuous monitoring while minimizing drift and preserving measurement consistency throughout its service life. The sensing element shall provide dependable detection of the intended combustible gases while maintaining resistance to environmental influences and normal operational contaminants. The sensor shall exhibit stable response characteristics suitable for integration with embedded control systems and gas monitoring electronics. Mechanical construction shall provide adequate protection for the sensing element while allowing sufficient exposure to the surrounding atmosphere for effective gas diffusion. The package shall withstand handling, vibration, thermal cycling, and standard assembly processes without degradation of sensing performance or structural integrity. Workmanship shall be free from defects including contamination, mechanical damage, corrosion, package deformation, or structural inconsistencies that could adversely affect sensing accuracy or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, gas sensitivity characteristics, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #GasSensor #CombustibleGasSensor #SemiconductorSensor #GasDetection #IndustrialSafety #EmbeddedSystems #EnvironmentalMonitoring #QualityAssurance #EngineeringDocumentation

Pressure Sensor ±0.36PSI (±2.49kPa) Differential Male - 0.09" (2.24mm) Tube, Dual 14 b 8-DIP (0.620", 15.75mm), Dual Ports, Same Side The DLVR-L10D-E1BD-C-NI3N is a low-voltage, digital differential pressure sensor from Amphenol All Sensors' DLVR Series. It is designed to deliver highly accurate and temperature-compensated pressure measurements using proprietary CoBeam²™ sensing technology, which enhances long-term stability while minimizing package stress effects. The sensor features a 14-bit digital I²C output, operates from a 3.3 V supply, and measures differential pressures in the ±10 inH₂O range. Its compact through-hole DIP package with dual barbed ports makes it well suited for medical, HVAC, environmental monitoring, industrial control, and portable instrumentation applications. Key Features Differential pressure measurement: ±10 inH₂O 14-bit digital I²C interface 3.3 V low-voltage operation Proprietary CoBeam²™ MEMS technology for improved long-term stability Factory calibrated and temperature compensated Typical accuracy better than ±1% over temperature Dual barbed pressure ports (same-side orientation) Through-hole 8-pin DIP package Low-power operation suitable for battery-powered systems Designed for non-corrosive, non-ionic gases such as air and dry gases Ideal for medical breathing devices, HVAC, environmental monitoring, industrial automation, and portable equipment. #PressureSensor #DifferentialPressure #DigitalSensor #I2C #MEMS #AmphenolAllSensors #DLVRSeries #MedicalElectronics #HVAC #IndustrialAutomation #EnvironmentalMonitoring #EmbeddedSystems

Pressure Sensor 203.05PSI (1400kPa) Absolute 24 b 8-SMD Module The MS580314BA01-00 is a high-resolution digital absolute pressure sensor module from TE Connectivity Measurement Specialties. It integrates a precision MEMS pressure sensing element, a 24-bit ΔΣ ADC, and factory-calibrated coefficients to provide highly accurate digital pressure and temperature measurements. The sensor supports both I²C and SPI communication interfaces, making it easy to interface with a wide range of microcontrollers while requiring minimal external components. It is designed for low-power, high-accuracy applications such as altimeters, depth measurement systems, weather monitoring, industrial pressure sensing, and portable instrumentation. Key Features Digital absolute pressure sensor with integrated MEMS sensing element High-resolution 24-bit ΔΣ ADC with factory calibration Supports I²C and SPI digital interfaces Pressure range up to 14 bar (1400 kPa / 203 psi) Supply voltage: 1.8 V to 3.6 V Integrated temperature measurement for compensation and monitoring Low power consumption, suitable for battery-powered devices Operating temperature range: −40°C to +85°C Excellent long-term stability with low hysteresis Compact 8-SMD module for surface-mount PCB assembly Requires few or no external components for operation #PressureSensor #MEMS #AbsolutePressure #DigitalSensor #24BitADC #I2C #SPI #LowPower #IndustrialElectronics #Altimeter #DepthMeasurement #WeatherMonitoring #TEConnectivity #SurfaceMount #EmbeddedSystems

ARM® Cortex®-M0+ MSPM0 C Microcontroller IC 32-Bit 24MHz 16KB (16K x 8) FLASH 8-DSBGA (0.86x1.6) MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 24MHz frequency. These costoptimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages from 1.62V to 3.6V. The MSPM0C110x devices provide up to 16KB embedded flash program memory with 1KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2% to +1.2%, eliminating the need for an external crystal. Additional features include a 1-channel DMA, CRC-16 accelerator, and a variety of highperformance analog peripherals such as one 12-bit 1.5Msps ADC with VDD as the voltage reference, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced timer, two 16-bit general purpose timer, one windowed watchdog timer, and a variety of communication peripherals including one UART, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus. The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration let customers find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications. MSPM0C110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums. Features • Core – Arm® 32-bit Cortex®-M0+ CPU, frequency up to 24MHz • Operating characteristics – Extended temperature: –40°C to 125°C – Wide supply voltage range: 1.62V to 3.6V • Memories – Up to 16KB of flash – 1KB of SRAM • High-performance analog peripherals – One analog-to-digital converter (ADC) with up to 10 total external channels, 1.7Msps at 10 bit or 1.5Msps at 12 bit with VDD as the voltage reference – Configurable 1.4V or 2.5V internal ADC voltage reference (VREF) – Integrated temperature sensor – Integrated supply monitor • Optimized low-power modes – RUN: 87µA/MHz – STOP: 609µA at 4MHz, 311µA at 32kHz – STANDBY: 5µA with SRAM retention – SHUTDOWN: 200nA • Intelligent digital peripherals – 1-channel DMA controller dedicated for ADC – Three timers supporting up to 14 PWM channels • One 16-bit advanced timers with deadband support up to 8 PWM channels • One 16-bit general purpose timer with 4 capture/compares • One 16-bit general purpose timer with 2 capture/compares – Windowed watchdog timer – BEEPER generating 1kHz, 2kHz, 4kHz, or 8kHz square wave to drive the external beeper • Enhanced communication interfaces – One UART interface supporting LIN, IrDA, DALI, smart card, Manchester and low-power operation in STANDBY mode – One I2C interface supporting FM+ (1Mbps), SMBus, PMBus, and wakeup from STOP mode – One SPI supporting up to 12Mbps • Clock system – Internal 24MHz oscillator with an accuracy from -2% to +1.2% (SYSOSC) – Internal 32kHz low-frequency oscillator (LFOSC) • Data integrity – Cyclic redundancy checker (CRC-16) • Flexible I/O features – Up to 18 GPIOs – Two 5V-tolerant open-drain IOs • Development support – 2-pin serial wire debug (SWD) • Package options – 20-pin TSSOP (PW) – 20-pin VSSOP (DGS) – 20-pin WQFN (RUK) – 16-pin SOT (DYY) – 8-pin SOT (DDF) – 8-pin WSON (DSG) – 8-pin DSBGA (YCJ) • Family members (also see Device Comparison) – MSPS003F4: 16KB of flash, 1KB of RAM – MSPS003F3: 8KB of flash, 1KB of RAM – MSPM0C1104: 16KB of flash, 1KB of RAM – MSPM0C1103: 8KB of flash, 1KB of RAM • Development kits and software (also see Tools and Software) – LP-MSPM0C1104 LaunchPad™ development kit – MSP Software Development Kit (SDK) 2 Applications • Battery charging and management • Power supplies and power delivery • Personal electronics • Building security and fire safety • Connected peripherals and printers • Grid infrastructure • Smart metering • Communication modules • Medical and healthcare • Lighting #MSPM0C1104S8YCJR #MSPM0C1104 #TexasInstruments #CortexM0Plus #Microcontroller #EmbeddedSystems #LowPowerMCU #IoT #WearableDevices #IndustrialControl #ConsumerElectronics #ADC #UART #SPI #I2C #PWM #TI #ElectronicsDesign #PCBDesign #EmbeddedDevelopment

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

Fully calibrated temperature and humidity sensor with digital output and I²C interface The AHT30 is a high-precision digital temperature and humidity sensor developed by AOSONG Electronics. It integrates a capacitive humidity sensing element, a temperature sensor, and a dedicated ASIC in a compact DFN package. The device provides fully calibrated digital output through an I²C interface, offering low power consumption, excellent long-term stability, and reliable performance in demanding environmental conditions. It is widely used in smart home devices, HVAC systems, industrial controls, weather monitoring equipment, IoT devices, and consumer electronics. Key Features Fully calibrated digital temperature and humidity sensor I²C digital communication interface Relative humidity measurement range: 0% to 100% RH Temperature measurement range: -40°C to +85°C High accuracy: up to ±2% RH and ±0.3°C (typical) Wide operating voltage: 2.2 V to 5.5 V Low power consumption Fast response time Excellent long-term stability Strong anti-interference capability Compact DFN package suitable for reflow soldering Optimized ASIC with improved MEMS sensing technology Applications Smart home and IoT devices HVAC and air quality monitoring Weather stations Consumer electronics Medical equipment Industrial monitoring and control systems Refrigerators, dehumidifiers, and air conditioners Hashtags #AHT30 #AOSONG #TemperatureSensor #HumiditySensor #EnvironmentalSensor #I2C #MEMS #SmartHome #IoT #HVAC #IndustrialAutomation #WeatherMonitoring #EmbeddedSystems #ElectronicsDesign #PCBDesign

ESP32-WROOM32 ESP32 802.11 b/g/n (WiFi/WLAN/Wi-Fi 4), Bluetooth® Smart 4.x Low Energy (BLE) Transceiver 2.4GHz Evaluation Board ESP32-POE is an ESP32-based IoT development board that combines Wi-Fi, Bluetooth, Ethernet connectivity, and Power over Ethernet (PoE) in a single platform. It is designed for industrial automation, smart home systems, remote monitoring, and other network-connected embedded applications where both power and data can be delivered through a single Ethernet cable. The board supports the ESP32 dual-core processor and provides expansion interfaces for sensors, storage, and peripherals. FEATURES • ESP32-WROOM-32 WiFi/BLE module • Ethernet 100Mb interface with IEEE 802.3 PoE support • LiPo battery charger • LiPo battery connector • UEXT connector • User button • Reset button • Micro USB with programmer for ESP32 programming • MicroSD card • Two extension connectors 0.1" step spaced at 1" • PCB dimensions: (75 x 28)mm ~ (3 x 1)" #ESP32 #ESP32POE #IoT #Ethernet #PoE #WiFi #Bluetooth #EmbeddedSystems #IndustrialIoT #SmartHome #OpenSourceHardware #Microcontroller #EdgeComputing #Automation #MakerProjects