Microcontrollers
A microcontroller is a small, low-cost computer-on-a-chip that can be used to control electronic devices and systems. It consists of a central processing unit (CPU), memory, input/output (I/O) ports, and other peripherals integrated onto a single chip. Microcontrollers are commonly used in a wide range of applications, including automotive systems, home appliances, industrial automation, and consumer electronics. One of the key benefits of microcontrollers is their ability to interact with their environment through sensors and actuators, making them well-suited for use in embedded systems. These systems are often found in devices that require real-time control or data processing, such as medical equipment, aircraft, and factory automation systems. Flux.ai is home to the world's largest community-driven public library of microcontrollers, with footprints, symbols, datasheets, and simulation models for a wide range of devices. Whether you're a professional engineer looking for a specific microcontroller for your next project, or a hobbyist exploring the possibilities of microcontroller-based systems, Flux.ai has the resources you need to get started.
XTL721-S999-301
32.768 kHz ±20ppm Crystal 9pF 70 kOhms 2-SMD, No Lead The XTL721-S999-301 specification defines the engineering requirements for a crystal oscillator component intended to provide a stable and accurate timing reference for electronic systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure precise frequency generation, reliable operation, and long-term stability in embedded, industrial, communication, and consumer electronic applications. The component is intended for use in applications requiring accurate clock generation and synchronization, including microcontroller-based systems, communication interfaces, digital signal processing, and timing circuits. It provides a highly stable frequency reference with low phase noise and excellent frequency stability to support reliable system operation under varying environmental conditions. Engineering Requirements The crystal component shall be manufactured using high-purity quartz material and precision fabrication processes to ensure consistent resonant frequency characteristics, low aging effects, and dependable long-term performance. The construction shall provide stable oscillation characteristics throughout the specified operating temperature and environmental conditions. Electrical characteristics shall ensure accurate frequency stability, low equivalent series resistance, and reliable oscillation startup when used with compatible oscillator circuits. The component shall maintain stable timing performance under normal supply variations, temperature fluctuations, and continuous operating conditions. Mechanical construction shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. The package shall provide mechanical robustness and resistance to vibration, mechanical shock, thermal cycling, and handling without degradation of electrical performance or structural integrity. Workmanship shall be free from defects including contamination, package cracking, seal failure, lead deformation, or structural inconsistencies that could adversely affect frequency accuracy or operational reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, frequency performance specifications, electrical characterization reports, qualification records, inspection reports, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #CrystalOscillator #QuartzCrystal #TimingDevice #ClockGenerator #EmbeddedSystems #IndustrialElectronics #FrequencyControl #QualityAssurance #EngineeringDocumentation
0 Uses0 StarsMSPM0C1104S8YCJR
ARM® Cortex®-M0+ MSPM0 C Microcontroller IC 32-Bit 24MHz 16KB (16K x 8) FLASH 8-DSBGA (0.86x1.6) MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 24MHz frequency. These costoptimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages from 1.62V to 3.6V. The MSPM0C110x devices provide up to 16KB embedded flash program memory with 1KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2% to +1.2%, eliminating the need for an external crystal. Additional features include a 1-channel DMA, CRC-16 accelerator, and a variety of highperformance analog peripherals such as one 12-bit 1.5Msps ADC with VDD as the voltage reference, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced timer, two 16-bit general purpose timer, one windowed watchdog timer, and a variety of communication peripherals including one UART, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus. The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration let customers find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications. MSPM0C110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums. Features • Core – Arm® 32-bit Cortex®-M0+ CPU, frequency up to 24MHz • Operating characteristics – Extended temperature: –40°C to 125°C – Wide supply voltage range: 1.62V to 3.6V • Memories – Up to 16KB of flash – 1KB of SRAM • High-performance analog peripherals – One analog-to-digital converter (ADC) with up to 10 total external channels, 1.7Msps at 10 bit or 1.5Msps at 12 bit with VDD as the voltage reference – Configurable 1.4V or 2.5V internal ADC voltage reference (VREF) – Integrated temperature sensor – Integrated supply monitor • Optimized low-power modes – RUN: 87µA/MHz – STOP: 609µA at 4MHz, 311µA at 32kHz – STANDBY: 5µA with SRAM retention – SHUTDOWN: 200nA • Intelligent digital peripherals – 1-channel DMA controller dedicated for ADC – Three timers supporting up to 14 PWM channels • One 16-bit advanced timers with deadband support up to 8 PWM channels • One 16-bit general purpose timer with 4 capture/compares • One 16-bit general purpose timer with 2 capture/compares – Windowed watchdog timer – BEEPER generating 1kHz, 2kHz, 4kHz, or 8kHz square wave to drive the external beeper • Enhanced communication interfaces – One UART interface supporting LIN, IrDA, DALI, smart card, Manchester and low-power operation in STANDBY mode – One I2C interface supporting FM+ (1Mbps), SMBus, PMBus, and wakeup from STOP mode – One SPI supporting up to 12Mbps • Clock system – Internal 24MHz oscillator with an accuracy from -2% to +1.2% (SYSOSC) – Internal 32kHz low-frequency oscillator (LFOSC) • Data integrity – Cyclic redundancy checker (CRC-16) • Flexible I/O features – Up to 18 GPIOs – Two 5V-tolerant open-drain IOs • Development support – 2-pin serial wire debug (SWD) • Package options – 20-pin TSSOP (PW) – 20-pin VSSOP (DGS) – 20-pin WQFN (RUK) – 16-pin SOT (DYY) – 8-pin SOT (DDF) – 8-pin WSON (DSG) – 8-pin DSBGA (YCJ) • Family members (also see Device Comparison) – MSPS003F4: 16KB of flash, 1KB of RAM – MSPS003F3: 8KB of flash, 1KB of RAM – MSPM0C1104: 16KB of flash, 1KB of RAM – MSPM0C1103: 8KB of flash, 1KB of RAM • Development kits and software (also see Tools and Software) – LP-MSPM0C1104 LaunchPad™ development kit – MSP Software Development Kit (SDK) 2 Applications • Battery charging and management • Power supplies and power delivery • Personal electronics • Building security and fire safety • Connected peripherals and printers • Grid infrastructure • Smart metering • Communication modules • Medical and healthcare • Lighting #MSPM0C1104S8YCJR #MSPM0C1104 #TexasInstruments #CortexM0Plus #Microcontroller #EmbeddedSystems #LowPowerMCU #IoT #WearableDevices #IndustrialControl #ConsumerElectronics #ADC #UART #SPI #I2C #PWM #TI #ElectronicsDesign #PCBDesign #EmbeddedDevelopment
2 Uses0 StarsSIWG917Y111MGABAR
Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering
1.7k Uses0 StarsESP32-POE
ESP32-WROOM32 ESP32 802.11 b/g/n (WiFi/WLAN/Wi-Fi 4), Bluetooth® Smart 4.x Low Energy (BLE) Transceiver 2.4GHz Evaluation Board ESP32-POE is an ESP32-based IoT development board that combines Wi-Fi, Bluetooth, Ethernet connectivity, and Power over Ethernet (PoE) in a single platform. It is designed for industrial automation, smart home systems, remote monitoring, and other network-connected embedded applications where both power and data can be delivered through a single Ethernet cable. The board supports the ESP32 dual-core processor and provides expansion interfaces for sensors, storage, and peripherals. FEATURES • ESP32-WROOM-32 WiFi/BLE module • Ethernet 100Mb interface with IEEE 802.3 PoE support • LiPo battery charger • LiPo battery connector • UEXT connector • User button • Reset button • Micro USB with programmer for ESP32 programming • MicroSD card • Two extension connectors 0.1" step spaced at 1" • PCB dimensions: (75 x 28)mm ~ (3 x 1)" #ESP32 #ESP32POE #IoT #Ethernet #PoE #WiFi #Bluetooth #EmbeddedSystems #IndustrialIoT #SmartHome #OpenSourceHardware #Microcontroller #EdgeComputing #Automation #MakerProjects
6 Uses0 StarsSTM32F427IIT6
ARM® Cortex®-M4 STM32F4 Microcontroller IC 32-Bit 180MHz 2MB (2M x 8) FLASH 176-LQFP (24x24) The STM32F427IIT6 specification defines the engineering requirements for a high-performance microcontroller device designed for embedded processing applications requiring advanced computational capability, rich peripheral integration, and reliable real-time control. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure consistent operation across industrial, consumer, and communication systems. The device is intended for use in complex embedded systems where high-speed processing, efficient memory handling, and extensive peripheral connectivity are required. It supports applications such as industrial automation, motor control, signal processing, communication interfaces, and advanced embedded control systems. Engineering Requirements The microcontroller shall be manufactured using advanced semiconductor fabrication processes to ensure high processing performance, low power consumption, and long-term reliability. The device shall provide stable operation across its intended voltage, temperature, and environmental conditions while maintaining deterministic real-time behavior. The integrated architecture shall support high-speed processing capabilities, embedded memory resources, and multiple communication interfaces for system-level integration. Peripheral functionality shall operate reliably under defined electrical and environmental conditions without degradation of performance. Electrical characteristics shall ensure stable logic levels, accurate timing behavior, and robust signal integrity across all supported operating modes. The device shall maintain functional reliability during power transitions, reset conditions, and dynamic load variations. Mechanical and package construction shall be suitable for surface-mount assembly processes and shall ensure mechanical integrity during soldering, handling, and operation. Workmanship shall be free from defects including contamination, physical damage, or structural inconsistencies that could impact reliability or performance. Inspection, validation, and testing shall be performed using controlled procedures and calibrated equipment to ensure compliance with all applicable engineering and quality standards. Any deviation from this specification shall require formal engineering review, documented justification, and approval through the established change control process. Documentation Supporting documentation shall include engineering datasheets, reference manuals, qualification reports, electrical characterization data, inspection records, and revision-controlled manufacturing documentation. All records shall be maintained under formal configuration management and quality assurance systems. Revision Control Any modification to this specification shall be processed through the established engineering change management system. All revisions shall undergo technical review, validation, and formal approval prior to implementation to ensure continued compliance with design intent and applicable industry requirements. #EngineeringSpecification #Microcontroller #EmbeddedSystems #STMicroelectronics #DigitalControl #IndustrialElectronics #Firmware #Semiconductor #QualityAssurance #EngineeringDocumentation #RealTimeSystems
0 Uses0 StarsSTM32G491RET6
ARM® Cortex®-M4F STM32G4 Microcontroller IC 32-Bit 170MHz 512KB (512K x 8) FLASH 64-LQFP (10x10) The STM32G491RET6 from STMicroelectronics is a high-performance 32-bit microcontroller based on the Arm® Cortex®-M4 core with Floating Point Unit (FPU), designed for advanced embedded applications requiring high computational performance, precise analog processing, and real-time control. It belongs to the STM32G4 series and integrates enhanced analog peripherals, motor-control timers, communication interfaces, security features, and hardware accelerators such as CORDIC and FMAC. The device operates at up to 170 MHz, provides 512 KB Flash memory, and includes 96 KB SRAM, making it suitable for applications such as motor control, digital power conversion, industrial automation, robotics, and embedded control systems. Key Features Core: Arm® Cortex®-M4 32-bit CPU with FPU, DSP instructions, and MPU Maximum CPU Frequency: Up to 170 MHz (up to 213 DMIPS) Memory: 512 KB Flash memory with ECC support 96 KB SRAM with parity checking features Quad-SPI memory interface Operating Voltage: 1.71 V to 3.6 V Package: LQFP-64 Advanced Analog Features: 3 × 12-bit ADCs with high-speed conversion 4 × 12-bit DAC channels 4 × Rail-to-Rail operational amplifiers 4 × Fast analog comparators Internal voltage reference buffer Hardware Accelerators: CORDIC accelerator for trigonometric calculations FMAC (Filter Math Accelerator) for digital filtering applications Timers & Motor Control: Advanced PWM timers for motor-control applications Multiple 16-bit and 32-bit timers Support for encoder and PWM control Communication Interfaces: 2 × FDCAN interfaces 5 × USART/UART 3 × SPI interfaces 3 × I²C interfaces USB 2.0 Full-Speed interface SAI audio interface Security Features: True Random Number Generator (TRNG) CRC calculation unit Unique device ID Debug & Programming: SWD and JTAG debugging support Typical Applications Motor control and BLDC controllers Digital power converters Industrial automation equipment Robotics and motion control Smart sensors and embedded control systems Power management applications #STM32G491RET6 #STM32G4 #STMicroelectronics #ARM_CortexM4 #Microcontroller #MCU #EmbeddedSystems #MotorControl #DigitalPower #IndustrialAutomation #Robotics #IoT #ElectronicsDesign #PCBDesign
32 Uses0 Stars
