Memory
A memory IC, or integrated circuit, is a type of electronic device that stores and retrieves data. It is used in a wide range of electronic devices, including computers, smartphones, and other electronic devices. Memory ICs come in a variety of types, including DRAM, SRAM, and Flash memory, and are used for different purposes depending on the device and application. One of the primary use cases for memory ICs is in computer systems, where they are used to store data and instructions that are accessed by the processor. Memory ICs are also used in a variety of other electronic devices, such as digital cameras, MP3 players, and mobile phones, to store data and enable various functions. Flux.ai has the world's largest community-driven public library of memory ICs, with a wide variety of footprints, symbols, datasheets, and simulation models available. This extensive library allows users to easily access and use memory ICs in their projects, making it an invaluable resource for engineers and developers.
ESP32-C6FH4
IC RF TxRx Only Bluetooth, WiFi Bluetooth v5.0, Thread, Zigbee® 2.412GHz ~ 2.484GHz 32-VFQFN Exposed Pad The ESP32-C6FH4 is a low-power, highly integrated wireless microcontroller from Espressif Systems, designed for IoT applications. It is based on a 32-bit RISC-V processor running at up to 160 MHz, providing efficient performance for embedded systems while maintaining low power consumption. This variant includes 4 MB of embedded flash memory, making it suitable for standalone applications without the need for external flash. The ESP32-C6FH4 supports multiple wireless communication protocols, including: Wi-Fi 6 (802.11ax) in the 2.4 GHz band (backward compatible with Wi-Fi 4/802.11 b/g/n) Bluetooth Low Energy (BLE 5) IEEE 802.15.4 (used for protocols like Thread and Zigbee) Key features include: Rich set of GPIO pins with support for peripherals such as UART, SPI, I2C, PWM, ADC, and more Integrated hardware security features (secure boot, flash encryption, cryptographic accelerators) Multiple low-power modes for battery-operated devices On-chip temperature sensor and RTC peripherals #commonpartslibrary #transceiver
58 Uses0 StarsESP32-C6-WROOM-1-N8
802.15.4, Bluetooth, WiFi Bluetooth v5.0, Zigbee Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C6-WROOM-1-N8 integrates a 32-bit RISC-V single-core processor running up to 160 MHz, along with 8 MB of embedded SPI flash memory. It supports multiple wireless communication protocols, including: Wi-Fi 6 (802.11ax) in the 2.4 GHz band for improved efficiency and lower latency Bluetooth Low Energy (BLE 5) for short-range communication IEEE 802.15.4 for protocols such as Thread and Zigbee The module features a built-in PCB antenna, RF circuitry, crystal oscillator, and passive components, making it a complete solution that simplifies hardware design. It provides a wide range of GPIO pins and peripheral interfaces such as UART, SPI, I2C, PWM, ADC, and more, enabling flexible integration with sensors and external devices. Designed for low power consumption, it includes multiple power-saving modes, making it suitable for battery-powered applications. Typical Applications Smart home and IoT devices Wireless sensors and control systems Industrial automation Smart lighting and energy management Matter-compatible devices (via Thread support)
195 Uses0 StarsAP510BFA-CBR
RF System on a Chip - SoC Cortex-M55 250MHz, 2.5D GPU, 4MB MRAM, 3.75MB SRAM, BLE5.4, -20 to +70 C, BGA , 1.71 V to 2.2 V -20C ~ 70C ARM® Cortex®-M55 System On Chip (SOC) IC Apollo510B 250MHz The AP510BFA-CBR is an ultra-low-power MCU System-on-Chip (SoC) designed for advanced embedded and edge-AI applications. It belongs to the Apollo510B series and integrates a powerful ARM Cortex-M55 processor optimized for both performance and energy efficiency. It combines processing, memory, and multiple peripherals into a single BGA package, making it suitable for compact and power-sensitive designs. Key Characteristics Core: ARM Cortex-M55 Max CPU Speed: 250 MHz Architecture: MCU / SoC Flash Memory: 4 MB RAM: ~3.75 MB Connectivity: I2C, SPI, UART, USB Wireless Support: Bluetooth 5.4 (variant dependent) Package: 153-BGA (compact high-density package) Key Features Built on Ambiq’s ultra-low-power SPOT technology Designed for battery-powered and energy-sensitive devices High computational performance for edge AI and DSP workloads Integrated peripherals for embedded system development Typical Applications Wearables (smartwatches, fitness bands) Smart home and IoT devices Edge AI / machine learning nodes Industrial sensors and monitoring systems Wireless communication modules #CommonPartsLibrary #IntegratedCircuit #SoC #Apollo510B
1 Uses0 StarsTC58NVG1S3HBAI6
NAND Flash 3.3V 2Gb 24nm SLC NAND (EEPROM) FLASH - NAND (SLC) Memory IC 2Gbit Parallel 25 ns 67-VFBGA (6.5x8) The TC58NVG1S3HBAI6 is a 2-Gbit (256M × 8) SLC NAND flash memory device originally developed by Toshiba (now Kioxia). It is a CMOS-based, electrically erasable and programmable read-only memory (EEPROM) used to store data even when power is removed. This device uses Single-Level Cell (SLC) NAND technology, which offers high reliability, fast access time, and long endurance, making it suitable for industrial and embedded systems. Key Characteristics Memory Type: NAND Flash (Non-volatile) Technology: SLC (Single-Level Cell) Density: 2 Gbit (256M × 8 organization) Interface: Parallel I/O Supply Voltage: 2.7 V – 3.6 V Access Time: ~25 ns Package: 67-ball VFBGA (compact surface-mount) Functional Overview Organized into pages and blocks (typical NAND structure) Supports operations such as: Read Page program (write) Block erase Copy-back operations Uses shared I/O pins for address, data, and command input/output Internally, data is transferred between the memory array and internal registers in page-sized chunks (~2176 bytes including spare area). Typical Applications Embedded systems storage Firmware and boot memory Industrial control systems Data logging devices Consumer electronics (e.g., cameras, audio storage) #CommonPartsLibrary #IntegratedCircuit #memory #TC58NVG1
0 Uses0 StarsM24256E-FMN6TP
EEPROM Memory IC 256Kbit I2C 1 MHz 450 ns 8-SO The M24256E-FMN6TP is a 256-Kbit (32 Kbyte) I²C-compatible serial EEPROM from STMicroelectronics. It is designed for reliable, non-volatile data storage in a wide range of electronic applications including consumer, industrial, and automotive systems. The device supports standard (100 kHz), fast (400 kHz), and fast-mode plus (1 MHz) I²C communication, enabling efficient data transfer. It features byte and page write operations, low power consumption, and a high endurance of write cycles, making it suitable for frequent data logging and configuration storage. Housed in a compact SO8 package, the device is optimized for space-constrained PCB designs while maintaining robust performance and data retention capabilities. Key Features Memory size: 256 Kbit (32 Kbyte) Interface: I²C (2-wire serial interface) Clock frequency: Standard mode: 100 kHz Fast mode: 400 kHz Fast-mode Plus: 1 MHz Supply voltage range: 1.7 V to 5.5 V Page write capability: up to 64 bytes Write cycle time: ~5 ms (typical) Data retention: > 200 years Endurance: > 4 million write cycles Hardware write protection available ESD protection and latch-up immunity Functional Description The device operates as a slave on the I²C bus and supports: Byte write and read Page write (up to 64 bytes) Random and sequential read operations Memory addressing is internally managed using a 16-bit address pointer, allowing access to the full 32 KB memory array. The device includes an internal write cycle controller, eliminating the need for external timing management. Pin Configuration (SO8 Package) A0, A1, A2: Device address inputs VSS: Ground SDA: Serial data line SCL: Serial clock line WC: Write control (hardware write protection) VCC: Supply voltage Absolute Maximum Ratings Supply voltage (VCC): -0.3 V to 6.5 V Input voltage: -0.3 V to VCC + 0.6 V Storage temperature: -65°C to +150°C Operating temperature (industrial grade): -40°C to +85°C Electrical Characteristics Low standby current: < 1 µA (typical) Operating current: < 1 mA Input/output compatible with CMOS logic levels Schmitt trigger inputs for noise immunity Timing Characteristics Write cycle time: 5 ms (typical) Fast-mode Plus support up to 1 MHz Sequential read supports continuous data streaming Package Information Package type: SO8 (8-lead Small Outline) Mounting: Surface-mount (SMD) Tape & reel packaging (TP suffix) Applications Configuration storage Calibration data storage Data logging systems Industrial control systems Consumer electronics Embedded systems requiring non-volatile memory Advantages High endurance and long data retention Wide voltage range (ideal for mixed-voltage systems) Compact footprint High-speed I²C compatibility (up to 1 MHz) #commonpartslibrary #integratedcircuit #memory
14 Uses0 StarsESP-12F
WiFi 802.11b/g/n Transceiver Module 2.4GHz ~ 2.5GHz Integrated, Trace Surface Mount The ESP-12F is a compact WiFi module based on the ESP8266EX, widely used in IoT and embedded systems due to its low cost and built-in networking capabilities. Integrated WiFi (2.4 GHz) Supports 802.11 b/g/n Built-in TCP/IP stack (no external WiFi processor needed) Microcontroller + WiFi in one Powered by the ESP8266EX SoC Can run user applications directly (not just a WiFi modem) Flash Memory Typically 4 MB SPI flash (varies by version) GPIO Support Multiple multifunction pins: Digital I/O PWM I2C SPI UART ADC (1 channel) Size: ~16 mm × 24 mm Mounting: Castellated SMD module Antenna: Built-in PCB trace antenna (requires proper keepout zone) Power Requirements Operating Voltage: 3.0V – 3.6V (typical 3.3V) Current Consumption: Idle: ~70 mA Peak (TX): up to ~300 mA Common Interfaces UART – programming and debugging SPI – peripheral communication I2C (software-based) GPIO – general-purpose control #commonpartslibrary #transceiver #module #wireless #rf #wifi
185 Uses0 StarsTDA4VM88TGCALFR
System On Chip (SOC) IC It integrates multiple processing units including CPUs, DSPs, AI accelerators, and GPU into a single chip to handle vision processing, deep learning, sensor fusion, and real-time control in automotive and industrial systems. • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators • Depth and Motion Processing Accelerators (DMPAC) • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0GHz – 1MB shared L2 cache per dual-core Cortex®- A72 cluster – 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core • Six Arm® Cortex®-R5F MCUs at up to 1.0GHz – 16K I-Cache, 16K D-Cache, 64K L2 TCM – Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem – Four Arm® Cortex®-R5F MCUs in general compute partition • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS • 3D GPU PowerVR® Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec • Custom-designed interconnect fabric supporting near max processing entitlement Memory subsystem: • Up to 8MB of on-chip L3 RAM with ECC and coherency – ECC error protection – Shared coherent cache – Supports internal DMA engine • External Memory Interface (EMIF) module with ECC – Supports LPDDR4 memory types – Supports speeds up to 4266MT/s – 32-bit data bus with inline ECC • General-Purpose Memory Controller (GPMC) • 512KB on-chip SRAM in MAIN domain, protected by ECC #CommonPartsLibrary #IntegratedCircuit
2 Uses0 Stars
