ARM® Cortex®-M33 RT-600 Microcontroller IC 32-Bit Dual-Core 300MHz External Program Memory 176-VFBGA (9x9) The RT600 is a family of dual-core microcontrollers for embedded applications featuring an Arm Cortex-M33 CPU combined with a Cadence Xtensa HiFi4 advanced Audio Digital Signal Processor CPU. The Cortex-M33 includes two hardware coprocessors providing enhanced performance for an array of complex algorithms. The family offers a rich set of peripherals and very low power consumption. The Arm Cortex-M33 is a next generation core based on the ARMv8-M architecture that offers system enhancements, such as ARM TrustZone® security, single-cycle digital signal processing, and a tightly-coupled coprocessor interface, combined with low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M33 CPU employs a 3-stage instruction pipe and includes an internal prefetch unit that supports speculative branching. A hardware floating-point processor is integrated into the core. On the RT600, the Cortex-M33 is augmented with two hardware coprocessors providing accelerated support for additional DSP algorithms and cryptography. The Cadence Xtensa HiFi 4 Audio DSP engine is a highly optimized audio processor designed especially for efficient execution of audio and voice codecs and pre- and post-processing modules. It supports four 32x32-bit MACs, some support for 72-bit accumulators, limited ability to support eight 32x16-bit MACs, and the ability to issue two 64-bit loads per cycle. There is a floating point unit providing up to four single-precision IEEE floating point MACs per cycle. The RT600 provides up to 4.5 MB of on-chip SRAM (plus an additional 128 KB of tightly-coupled HiFi4 ram) and several high-bandwidth interfaces to access off-chip flash. The FlexSPI flash interface supports two channels and includes an 32 KB cache and an on-the-fly decryption engine. The RT600 is designed to allow the CortexM33 to operate at frequencies of up to 300 MHz and the HiFi4 DSP to operate at frequencies of up to 600 MHz. Key Features Dual-core architecture with Arm Cortex-M33 CPU and Cadence Xtensa HiFi4 DSP Cortex-M33 operating at up to 300 MHz HiFi4 DSP operating at up to 600 MHz Up to 4.5 MB on-chip SRAM 128 KB DSP tightly coupled memory (TCM) FlexSPI interface supporting Quad/Octal SPI Flash with execute-in-place (XIP) High-speed USB 2.0 Host/Device with integrated PHY Digital microphone (DMIC) interface supporting up to 8 channels Multiple I2S, SPI, I²C, UART, SDIO, and I3C interfaces 12-bit ADC with up to 1 MSPS sampling rate Hardware cryptography acceleration (AES, SHA, RSA, ECC) Arm TrustZone® security technology Secure boot and physically unclonable function (PUF) key storage Multiple low-power operating modes for battery-powered applications Up to 147 GPIOs depending on package option 176-pin VFBGA package (9 mm × 9 mm) Typical Applications Voice-controlled smart devices Audio processing and DSP systems Smart speakers and soundbars Industrial HMI and control panels Edge AI and machine learning applications IoT gateways and connected devices Wearable and portable electronics #NXP #iMXRT685 #RT600 #CortexM33 #HiFi4DSP #Microcontroller #EmbeddedSystems #EdgeAI #VoiceRecognition #AudioProcessing #IoT #IndustrialAutomation #SecureMCU #MachineLearning #MCUDesign

NXP JN5164/JN5169 breakout module, SMD #RF #ZigBee #commonpartslibrary

NXP JN5164/JN5169 breakout module, SMD #RF #ZigBee #commonpartslibrary

This project is a reference design for a UJA1166ATK-based circuit, implementing CAN protocol interface with Wake-up, Inhibit, and Sleep functionality. CANBus have block terminal connector and surface mount test points. #referenceDesign #Module #CANbus #interface #transceiverCircuit #UJA1166ATK #UJA1166ATK/0Z #reusable #module #canbus #nxp #sublayout

8 bit Output Shift Register (DIP package) DIP254P762X420-16 NXP DIP-16 71R2683 1826799 74HC595N,112

NXP MCU T4240NSN7QTB FBGA-1932_L45.0-W45.0-P1.00-BL_10AX115SF45 LCSC Part Number: C1555511 undefined Manufactured by NXP(恩智浦)

NXP MCU LPC832M101FDH20FP TSSOP-20_L6.5-W4.4-P0.65-LS6.4-BL LCSC Part Number: C111582 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU MKL16Z64VFM4 QFN-32_L5.0-W5.0-P0.50-BL-EP3.4 LCSC Part Number: C191270 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU S9KEAZN8AMTG TSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL LCSC Part Number: C181712 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU LS1046ASN8T1A FCPBGA-780_L23.0-L23.0-P0.80-BL_NXP_BSC9132 LCSC Part Number: C1555382 undefined Manufactured by NXP(恩智浦)

NXP MCU SPC5607BAVLU6R LQFP-176_L24.0-W24.0-P0.50-LS26.0-BL LCSC Part Number: C2056904 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU FS32K144HAT0VLLR LQFP-100_L14.0-W14.0-P0.50-LS16.0-BL LCSC Part Number: C1850146 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

ARM® Cortex®-A53 Microprocessor IC i.MX8ML 2 Core, 64-Bit 1.8GHz 548-LFBGA (15x15) Application Processor for embedded multimedia and industrial systems, integrating dual Arm® Cortex®-A53 cores operating up to 1.8 GHz and a Cortex®-M4 real-time core up to 400 MHz. It supports LPDDR4/DDR4/DDR3L memory, Gigabit Ethernet, PCIe, USB 2.0, MIPI-CSI/DSI, SAI audio interfaces, and 1080p video encode/decode, and is housed in a 0.8 mm pitch 486-ball FCBGA package. #ApplicationProcessor #NXP #iMX8MMini #ARMCortexA53 #CortexM4 #EmbeddedProcessor #MultimediaProcessor #FCBGA486 #LPDDR4 #DDR4 #PCIe #USB2 #GigabitEthernet #MIPI #SAI #EmbeddedSystems

NXP MCU MK60FN1M0VLQ15 LQFP-144_L20.0-W20.0-P0.50-LS22.0-BL LCSC Part Number: C1337932 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU LPC2388FBD144K LQFP-144_L20.0-W20.0-P0.50-LS22.0-BL LCSC Part Number: C1020281 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU SPC5633MF2MLQ60R LQFP-144_L20.0-W20.0-P0.50-LS22.0-BL LCSC Part Number: C2056905 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU LPC55S69JBD100Y HLQFP-100_L14-W14-P0.5-LS16-TL-EP3.4 LCSC Part Number: C1850150 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU MC9S12A512CPVE LQFP-112_L20.0-W20.0-P0.65-LS22.0-BL LCSC Part Number: C1340963 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU LPC4317JET100E TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL LCSC Part Number: C1345240 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU LPC4310FET100,551 TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL LCSC Part Number: C1339863 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU LPC54005JET100E TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL LCSC Part Number: C1340572 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU FS32K142HAT0MLLT LQFP-100_L14.0-W14.0-P0.50-LS16.0-BL LCSC Part Number: C414046 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU SPC5604PEF1MLL6R LQFP-100_L14.0-W14.0-P0.50-LS16.0-BL LCSC Part Number: C2056939 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU SPC5604CK0MLL6 LQFP-100_L14.0-W14.0-P0.50-LS16.0-BL LCSC Part Number: C1340648 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)